Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
SMF Series
Uni-directional
Description
RoHS
Pb
e3
The SMF series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
This SMF package has a 50% smaller footprint as
compared to the SMA package and delivers one of the
lowest height profiles (1.1mm) available in the industry.
Features
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E230531
Maximum Ratings and Thermal Characteristics
(T
A
=25
O
C unless otherwise noted)
Parameter
Peak Pulse Power Dissipation at
T
A
=25ºC by 10/1000µs (Note 1)
Thermal Resistance Junction- to-
Ambient
Thermal Resistance Junction- to-
Lead
Operating Temperature Range
Storage Temperature Range
Symbol
P
PPM
R
θJA
R
θJL
T
J
T
STG
Value
200
220
100
-65 to 150
-65 to 175
Unit
W
°C/W
°C/W
°C
°C
Notes:
1. Non-repetitive current pulse, per Fig. 4 and derated above T
J
(initial) =25ºC per Fig. 3.
•Compatible with
industrial standard
package SOD-123FL
• Optimized surface mount
footprint for minimal PCB
space impact
• Low profile: maximum
height of 1.1mm.
• Low inductance, excellent
clamping capability
• Compatible with high
temperature reflow
soldering (260°C/40sec)
• Typical failure mode due
to exceeding maximum
ratings is a short circuit
condition
• Whisker test conducted
based on Table 4a and 4c
of JEDEC JESD201A
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• EFT protection of data
lines in accordance with
IEC 61000-4-4
• 200W peak pulsepower
capability at 10/1000µs
waveform, repetition rate
(duty cycle): 0.01%
• Fast response time:
typically less than 1.0ns
from 0 Volts to V
BR
min
• Glass passivated junction
• Built-in strain relief
• UL Recognized epoxy
meeting flammability
classification V-0
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260
°
C
• Matte tin lead–free plated
• Halogen-free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is
Pb-free and the terminal
finish material is tin(Sn)
(IPC/ JEDEC J-STD-
609A.01)
Functional Diagram
Bi-directional
Applications
SMF components are ideal for the protection of I/O
interfaces, V
CC
bus and other vulnerable circuit used in
cellular phones, portable devices, business machines,
power supplies and other consumer applications.
Additional Infomarion
Cathode
Uni-directional
Anode
Datasheet
Resources
Samples
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/07/17
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Electrical Characteristics
(T =25°C unless otherwise noted)
A
Part
Number
Marking
Code
Breakdown
Voltage V
BR
(Volts) @ I
T
MIN
MAX
7
.00
7
.37
7
.98
8.60
9.21
9.83
10.40
11.10
12.30
13.50
14.70
15.90
17
.20
18.50
19.70
20.90
22.10
24.50
26.90
29.50
31.90
34.40
36.80
40.60
44.20
49.10
52.80
55.30
58.90
62.70
66.30
71.20
73.70
78.60
86.00
92.10
95.80
104.00
Test
Current
I
T
(mA)
10
10
10
10
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
Maximum
Reverse Stand
Reverse
off Voltage
Leakage @ V
R
V
R
(V)
I
R
(µA)
5.0
6.0
6.5
7
.0
7
.5
8.0
8.5
9.0
10
11
12
13
14
15
16
17
18
20
22
24
26
28
30
33
36
40
43
45
48
51
54
58
60
64
70
75
78
85
400
400
250
100
50
25
10
5
2.5
2.5
2.5
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
Maximum
Peak Pulse
Current I
pp
(A)
21.7
19.4
17
.9
16.7
15.5
14.7
13.9
13.0
11.8
11.0
10.1
9.3
8.6
8.2
7
.7
7
.2
6.8
6.2
5.6
5.1
4.8
4.4
4.1
3.8
3.4
3.1
2.9
2.8
2.6
2.4
2.3
2.1
1.8
1.7
1.5
1.4
1.4
1.3
Maximum
Clamping
Voltage @I
pp
V
C
(V)
9.2
10.3
11.2
12.0
12.9
13.6
14.4
15.4
17
.0
18.2
19.9
21.5
23.2
24.4
26.0
27
.6
29.2
32.4
35.5
38.9
42.1
45.4
48.4
53.3
58.1
64.5
69.4
72.7
77
.4
82.4
87
.1
93.6
96.8
103.0
113.0
121.0
126.0
137
.0
Agency
Approval
SMF5.0A
SMF6.0A
SMF6.5A
SMF7
.0A
SMF7
.5A
SMF8.0A
SMF8.5A
SMF9.0A
SMF10A
SMF11A
SMF12A
SMF13A
SMF14A
SMF15A
SMF16A
SMF17A
SMF18A
SMF20A
SMF22A
SMF24A
SMF26A
SMF28A
SMF30A
SMF33A
SMF36A
SMF40A
SMF43A
SMF45A
SMF48A
SMF51A
SMF54A
SMF58A
SMF60A
SMF64A
SMF70A
SMF75A
SMF78A
SMF85A
AE
AG
AK
AM
AP
AR
AT
AV
AX
AZ
BE
BG
BK
BM
BP
BR
BT
BV
BX
BZ
CE
CG
CK
CM
CP
CR
CT
CV
CX
CZ
DE
RG
RK
RM
RP
RR
RT
RV
6.40
6.67
7
.22
7
.78
8.33
8.89
9.44
10.00
11.10
12.20
13.30
14.40
15.60
16.70
17
.80
18.90
20.0 0
22.20
24.40
26.70
28.90
31.10
33.30
36.70
40.00
44.40
47
.80
50.00
53.30
56.70
60.00
64.40
66.70
71.10
77
.80
83.30
86.70
94.40
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Notes:
1. V
BR
measured after I
T
applied for 300µs, I
T
= square wave pulse or equivalent.
2. Surge current waveform per 10/1000µs exponential wave and derated per Fig.2.
3. All terms and symbols are consistent with ANSI/IEEE C62.35.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/07/17
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
I-V Curve Characteristics
Uni-directional
Vc V
BR
V
R
I
R
V
F
I
T
V
I
pp
P
PPM
V
R
V
BR
V
C
I
R
V
F
Peak Pulse Power Dissipation
-- Max power dissipation
Stand-off Voltage
-- Maximum voltage that can be applied to the TVS without operation
Breakdown Voltage
-- Maximum voltage that flows though the TVS at a specified test current (I
T
)
Clamping Voltage
-- Peak voltage measured across the TVS at a specified Ippm (peak impulse current)
Reverse Leakage Current
-- Current measured at V
R
Forward Voltage Drop for Uni-directional
Ratings and Characteristic Curves
(T =25°C unless otherwise noted)
A
Figure 1 - TVS Transients Clamping Waveform
Voltage Transients
Figure 2 - Peak Pulse Power Rating Curve
10
P
PPM
-Peak Pulse Power (kW)
Voltage Across TVS
Voltage or Current
Current Through TVS
1
0.1
0.000001
Time
0.00001
0.0001
0.001
t
d
-Pulse Width (sec.)
continues on next page.
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/07/17
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Ratings and Characteristic Curves
(T =25°C unless otherwise noted)
(Continued)
A
Figure 3 - Peak Pulse Power Derating Curve
100
Peak Pulse Power (P
PP
) or Current (I
PP
)
Derating in Percentage %
80
60
40
20
0
Figure 4 - Pulse Waveform - 10/1000
µ
S
150
I
PPM
- Peak Pulse Current, % I
RSM
tr=10µsec
Peak Value
IPPM
TJ=25°C
Pulse Width(td) is defined
as the point where the peak
current decays to 50% of IPPM
100
Half Value
IPPM
IPPM
2
( )
10/1000µsec. Waveform
as defined by R.E.A
50
0
25
50
75
100
125 150
T
J
- Initial Junction Temperature (ºC)
175
0
td
0
1.0
2.0
t-Time (ms)
3.0
4.0
Figure 5 - Forward Voltage
Figure 6 - Typical Junction Capacitance
0.9
V
f
- Typical forward dropped voltage
0.8
0.7
0.6
10000
1000
Measured@Vr=0v
C
j
(pf)
0.5
0.4
0
-55
100
Measured@50%Vr
10
75
140
Temperature (ºC)
Figure 7 - Peak Forward Voltage Drop vs.
Peak Forward Current
Figure 8 - Maximum Non-Repetitive Forward Surge
10
1
Current Uni-Directional Only
10
100
35
V
br
- Reverse breakdown voltage
I F - Peak Forward Current(A)
10
IFSM - Peak Forward Surve Current(A)
0
0.5
1
1.5
2
2.5
3
3.5
4
30
25
20
15
10
5
0
1
10
Number of Cycles at 60 Hz
100
1
0.1
0.01
V F - Peak Forward Voltage(V)
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/07/17
Transient Voltage Suppression Diodes
Surface Mount – 200W > SMF Series
Soldering Parameters
Reflow Condition
- Temperature Min (T
s(min)
)
Pre Heat
- Temperature Max (T
s(max)
)
- Time (min to max) (t
s
)
Average ramp up rate (Liquidus Temp (T
A
)
to peak
T
S(max)
to T
A
- Ramp-up Rate
Reflow
- Temperature (T
A
) (Liquidus)
- Time (min to max) (t
s
)
Lead–free
assembly
150°C
200°C
Temperature (T)
T
P
Ramp-up
t
p
Critical Zone
T
L
to T
P
60 – 180 secs
3°C/second max
3°C/second max
217°C
60 – 150 seconds
260
+0/-5
°C
20 – 40 seconds
6°C/second max
8 minutes Max.
260°C
T
L
T
s(max)
t
L
T
s(min)
Ramp-down
Preheat
t
s
25˚C
t 25˚C to Peak
Peak Temperature (T
P
)
Time within 5°C of actual peak
Temperature (t
p
)
Ramp-down Rate
Time 25°C to peak Temperature (T
P
)
Do not exceed
Time (t)
Environmental Specifications
High Temp. Storage
HTRB
JESD22-A103
JESD22-A108
JESD22-A104
JEDEC-J-STD-020, Level 1
JESD22-A101
JESD22-A111
Physical Specifications
Case
Polarity
Terminal
SOD-123FL plastic over glass passivated
junction
Color band denotes cathode except
bipolar
Matte tin-plated leads, solderable per
JESD22-B102
Temperature Cycling
MSL
H3TRB
RSH
Dimensions
-
SOD-123FL Package
Dimensions
A
B
C
E
A
B
Millimeters
Min
2.50
3.40
0.70
1.50
0.35
0.05
0.00
0.95
Max
2.90
3.90
1.20
2.00
0.90
0.26
0.10
1.10
Min
Inches
Max
0.1142
0.1535
0.0472
0.0787
0.0354
0.0102
0.0039
0.0433
0.0984
0.1339
0.0275
0.0591
0.0138
0.0020
0.000
0.0374
E
D
E
F
G
H
C
D
F
Mounting Pad Layout
1.6 (0.062)
1.3 (0.051)
G
H
1.4 (0.055)
© 2017 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 06/07/17
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
