电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

SMCJ8.0CA

产品描述极性:Bidirectional 峰值脉冲电流(10/1000us):110.3A 箝位电压:13.6V 击穿电压(最小值):8.89V 反向关断电压(典型值):8V VBR=8.89V,Vc=13.6V,Ipp=110.3A 双向
产品类别分立半导体    二极管   
文件大小961KB,共6页
制造商Littelfuse
官网地址http://www.littelfuse.com
标准
下载文档 详细参数 全文预览

SMCJ8.0CA概述

极性:Bidirectional 峰值脉冲电流(10/1000us):110.3A 箝位电压:13.6V 击穿电压(最小值):8.89V 反向关断电压(典型值):8V VBR=8.89V,Vc=13.6V,Ipp=110.3A 双向

SMCJ8.0CA规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证符合
厂商名称Littelfuse
零件包装代码DO-214AB
包装说明R-PDSO-C2
针数2
Reach Compliance Codenot_compliant
ECCN代码EAR99
其他特性LOW INDUCTANCE, EXCELLENT CLAMPING CAPABILITY, UL RECOGNIZED
最大击穿电压9.83 V
最小击穿电压8.89 V
击穿电压标称值9.36 V
最大钳位电压13.6 V
配置SINGLE
二极管元件材料SILICON
二极管类型TRANS VOLTAGE SUPPRESSOR DIODE
JEDEC-95代码DO-214AB
JESD-30 代码R-PDSO-C2
JESD-609代码e3
湿度敏感等级1
最大非重复峰值反向功率耗散1500 W
元件数量1
端子数量2
最高工作温度150 °C
最低工作温度-65 °C
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
极性BIDIRECTIONAL
认证状态Not Qualified
最大重复峰值反向电压8 V
表面贴装YES
技术AVALANCHE
端子面层Matte Tin (Sn)
端子形式C BEND
端子位置DUAL
处于峰值回流温度下的最长时间40

文档预览

下载PDF文档
Transient Voltage Suppression Diodes
Surface Mount – 1500W > SMCJ series
SMCJ Series
Uni-directional
Bi-directional
Description
RoHS
Pb
e3
The SMCJ series is designed specifically to protect
sensitive electronic equipment from voltage transients
induced by lightning and other transient voltage events.
Features
• 1500W peak pulse power
capability at 10/1000μs
waveform, repetition rate
(duty cycles):0.01%
• Excellent clamping
capability
• Low incremental surge
resistance
• Typical I
R
less than 1μA
when V
BR
min>12V
• For surface mounted
applications to optimize
board space
• Low profile package
• Built-in strain relief
• Typical failure mode is
short from over-specified
voltage or current
• Whisker test is conducted
based on JEDEC
JESD201A per its table 4a
and 4c
• IEC-61000-4-2 ESD
30kV(Air), 30kV (Contact)
• ESD protection of data
lines in accordance with
IEC 61000-4-2
• EFT protection of data
lines in accordance with
IEC 61000-4-4
Applications
TVS devices are ideal for the protection of I/O Interfaces,
V
CC
bus and other vulnerable circuits used in Telecom,
Computer, Industrial and Consumer electronic
applications.
Additional Infomarion
• Fast response time:
typically less than 1.0ps
from 0V to BV min
• Glass passivated chip
junction
• High temperature
to reflow soldering
guaranteed: 260°C/40sec
• V
BR
@ T
J
= V
BR
@25°C
x (1+
α
T x (T
J
- 25))
(
α
T:Temperature
Coefficient, typical value
is 0.1%)
• Plastic package is
flammability rated V-0 per
Underwriters Laboratories
• Meet MSL level1, per
J-STD-020, LF maximun
peak of 260
°
C
• Matte tin lead–free plated
• Halogen free and RoHS
compliant
• Pb-free E3 means 2nd
level interconnect is
Pb-free and the terminal
finish material is tin(Sn)
(IPC/JEDEC J-STD-
609A.01)
Agency Approvals
AGENCY
AGENCY FILE NUMBER
E230531
Maximum Ratings and Thermal Characteristics
(T
A
=25
O
C unless otherwise noted)
Parameter
Peak Pulse Power Dissipation at
T
A
=25ºC by 10/1000µs Waveform
(Fig.2)(Note 1), (Note 2), (Note 5)
Power Dissipation on Infinite Heat
Sink at T
L
=50
O
C
Peak Forward Surge Current, 8.3ms
Single Half Sine Wave (Note 3)
Maximum Instantaneous Forward
Voltage at 100A for Unidirectional
Only (Note 4)
Operating Temperature Range
Storage Temperature Range
Typical Thermal Resistance Junction
to Lead
Typical Thermal Resistance Junction
to Ambient
Symbol
P
PPM
P
D
I
FSM
V
F
T
J
T
STG
R
θJL
R
θJA
Value
1500
6.5
200
3.5/5.0
-65 to 150
-65 to 175
15
75
Unit
W
W
A
V
°C
°C
°C/W
°C/W
Notes:
1. Non-repetitive current pulse , per Fig. 4 and derated above T
J
(initial) =25
O
C per Fig. 3.
2. Mounted on copper pad area of 0.31x0.31” (8.0 x 8.0mm) to each terminal.
3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional
device only, duty cycle=4 per minute maximum.
4. V
F
< 3.5V for single die parts and V
F
< 5.0V for stacked-die parts.
5. The P
PPM
of stacked-die parts is 2000W and please contact littelfuse for the detail
stacked-die parts.
Functional Diagram
Bi-directional
Datasheet
Cathode
Uni-directional
Anode
Resources
Samples
© 2015 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 11/20/15
proteus实例:32位超级流水灯
proteus实例:32位超级流水灯  作者:风飞月    Proteus 是个很优秀的单片机外围器件模拟软件,它可以仿真51 系列、AVR,PIC 等常用的MCU及其外围电路器件,如: LCD,RAM,ROM,键盘,马达, ......
yuandayuan6999 PCB设计
3G网络之我见
近年来关于3G的争论一直不绝于耳,多数厂家早已摩拳擦掌,各路说客各显神通,可政府就是不为所动,有人说是为了等TD,有人云是市场环境还不成熟,上与不上的争论也一直不断。很多业内人士比较赞 ......
234 无线连接
TMS320VC5410的McBSP串行接口技术与程序设计
一、DSP的串行接口技术   DSP是一种独特的微处理器,是以数字信号来处理大量信息的器件。其工作原理是接收模拟信号,转换为0或1的数字信号。再对数字信号进行修改、删除、强化,并在其他系 ......
Aguilera DSP 与 ARM 处理器
法拉第电磁感应定量测试仪-----已经发表在《无线电》杂志上。
图1 法拉第电磁感应定量测试仪 图2 在现行的高中物理课本中,电磁感应实验一般用图1所示的实验装置进行实验的。当我们插入或者拔出磁铁,电流表就有指示, ......
hujuan ADI 工业技术
SEL4442卡
怎样用430读写SEL4442? 主要是口线电平兼容问题...
微控制器 MCU
【求助】请问有人在汇编程序加入过自己编译的头文件吗?
如题!我想向c语言一样,在汇编程序,加一个自己定义的头文件。把自己成功的程序加到新的程序中,这样可行吗?如果行的话,怎么做? 谢谢!...
zhang124 微控制器 MCU

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 289  849  557  1195  655  58  37  21  41  4 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved