overcurrent protection for applications where space is at
a premium and resettable protection is desired.
Features
• RoHS compliant, lead-free
and halogen free
• Fast response to fault
currents
• Compact design saves
board space
AGENCY FILE NUMBER
• Low resistance
• Low-profile
• Compatible with high
temperature solders
Agency Approvals
AGENCY
Applications
• USB peripherals
• Disk drives
• CD-ROMs
• Plug and play protection
for motherboards and
peripherals
• PDAs / digital cameras
• Game console port
protection
E183209
R50119118
Additional Information
Datasheet
Resources
Samples
Electrical Characteristics
I
hold
(A)
0.04
0.10
0.20
0.25
0.35
0.50
I
trip
(A)
0.12
0.30
0.50
0.55
0.75
1.00
V
max
(Vdc)
24
15
9
9
6
6
I
max
(A)
20
40
40
40
40
40
P
d
typ.
(W)
0.5
0.5
0.5
0.5
0.5
0.5
Maximum Time
To Trip
Current
(A)
0.20
0.50
1.00
8.00
8.00
8.00
Time
(Sec.)
1.00
1.00
0.60
0.08
0.10
0.10
Resistance
R
min
(Ω)
4.00
0.900
0.550
0.500
0.200
0.100
R
1max
(Ω)
40.00
6.000
3.500
3.000
1.000
0.680
X
X
X
X
X
X
X
X
X
X
X
X
Part Number
Marking
Agency
Approvals
0603L004
0603L010
0603L020
0603L025
0603L035
0603L050
-
C
H
I
F
J
I
hold
= Hold current: maximum current device will pass without tripping in 20°C still air.
I
trip
= Trip current: minimum current at which the device will trip in 20°C still air.
V
max
= Maximum voltage device can withstand without damage at rated current (I max)
I
max
= Maximum fault current device can withstand without damage at rated voltage (V
max
)
P
d
= Power dissipated from device when in the tripped state at 20°C still air.
R
min
= Minimum resistance of device in initial (un-soldered) state.
R
1max
= Maximum resistance of device at 20°C measured one hour after tripping or reflow soldering of 260°C for 20 sec.
Caution:
Operation beyond the specified rating may result in damage and possible arcing and flame.
WARNING
• Users shall independently assess the suitability of these devices for each of their applications
• Operation of these devices beyond the stated maximum ratings could result in damage to the devices and lead to electrical arcing and/or fire
• These devices are intended to protect against the effects of temporary over-current or over-temperature conditions and are not intended to perform as protective devices where such
conditions are expected to be repetitive or prolonged in duration
• Exposure to silicon-based oils, solvents, electrolytes, acids, and similar materials can adversely affect the performance of these PPTC devices
• These devices undergo thermal expansion under fault conditions, and thus shall be provided with adequate space and be protected against mechanical stresses
• Circuits with inductance may generate a voltage (L di/dt) above the rated voltage of the PPTC device.
空分复用 (SDM) MIMO 处理可显著提高频谱效率，进而大幅增加无线通信系统的容量。空分复用 MIMO 通信系统作为一种能够大幅提升无线系统容量和连接可靠性的手段，近来吸引了人们的广泛关注。 MIMO 无线系统最佳硬判决检测方式是最大似然 (ML) 检测器。ML 检测因为比特误码率 (BER)性能出众，非常受欢迎。不过，直接实施的复杂性会随着天线和调制方案的增加呈指数级增强，使...[详细]
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