SKPF
TACT Switch
TM
10
3.5
6.8
Long-travel with High Operation Force (Snap-in Type)
8×9mm size. Combination of long travel 1.75mm and
high operation force prevents malfunction
■
Typical Specifications
Items
Rating（max.）
Rating（min.）
Specifications
5mA 12V DC
10μA 1V DC
1kΩ max.
1.75
3
4
8
9
4-ø1 hole
8.7
0.7
4.5
0.7
■
Circuit Diagram
1
3
2
4
Note
Please Using a 1.6mm thick PC board is recommended.
Refer to P.265 for soldering conditions.
258
4.5
Sharp
Feeling
Soft
Feeling
Snap-in
Type
Surface
Mount Type
Radial
Type
Initial contact resistance
Travel（mm）
■
Product Line
Product No.
Operating force
1.96N
3.92N
Operating direction
Operating life
（5mA 5V DC）
100,000 cycles
Minimum order unit（pcs.）
Japan
1,000
Export
1,000
SKPFACA010
SKPFAAA010
Top push
■
Packing Specifications
Bulk
Number of packages（pcs.）
1 case / Japan
4,000
1 case / export packing
12,000
Export package measurements
（mm）
309×476×347
■
Dimensions
Style
8
1
ø4
Unit:mm
PC board mounting hole dimensions
（Viewed from switch mounting face）
2
8.7
TACT Switch
List of Varieties
TACT Switch
TM
Sharp
Sharp
Feeling
Feeling
Soft
Soft
Feeling
Feeling
Snap-in
Snap-in
Type
Type
Surface
Surface
Mount Type
Mount Type
Radial
Radial
Type
Type
TM
Type
Series
Photo
Features
Water-proof
Dust-proof
IP standard
Operating
direction
Top push
Side push
W
Dimensions
（mm）
Contact
1N max.
1N to 2N
2N to 3N
3N to 4N
4N to 5N
Soft Feeling Type
Snap–in
Surface Mount
Radial
SKEG
SKEG
SKPF
SKPS
NEW
SKPM
SKPG
SKPR
SKPL
SKPD
—
—
—
—
●
—
□6
See the relevant pages for
respective product descriptions
—
—
—
—
—
●
7.5
9.9
7.3
Carbon
High operation force Low contact Low contact
Long travel
resistance
resistance
—
—
—
●
—
8
9
10
Silver
—
—
—
●
—
5.9
6
5
—
—
—
●
—
—
—
—
—
●
—
6.6
6.3
High operation force
Round terminal
Low contact resistance Low contact resistance
—
—
—
●
—
7.5
7.8
6.5
—
—
—
●
—
—
—
—
—
●
—
□7.8
See the relevant pages for
respective product descriptions
D
H
V
6.45
5
Silver
Carbon
Carbon
Operation
force
coverage
Travel（mm）
Ground terminal
Operating temperature
range
Automotive use
Life Cycle
Rating（max.）
（Resistive load）
Rating（min.）
Electrical （Resistive load）
performance
Insulation
resistance
Voltage proof
Vibration
Durability
Lifetime
Cold
Environmental
performance
Dry heat
Damp heat
Page
—
1
—
See the relevant pages
for respective product
descriptions
1.05
—
—
1.3
—
−40℃ to ＋90℃
1
—
1.3
—
See the relevant pages
for respective product
descriptions
—
—
−20℃ to ＋70℃
●
●
●
●
●
●
●
●
●
5mA 12V DC
50mA
16V DC
10μA 1V DC
100MΩ min. 100V DC 1min.
250V AC 1min.
5mA
12V DC
50mA
16V DC
5mA
12V DC
50MΩ min. 100V DC 1min.
SKPDAF: 100MΩ min.
100V DC 1min.
100V AC 1min.
SKPDAF: 250V DC 1min.
10 to 55 to 10Hz/min., the amplitude is 1.5mm for all the frequencies,
in the 3 direction of X, Y and Z for 2 hours respectively
Shall be in accordance with individual specifications.
−30℃ 96h
80℃ 96h
−40℃ 96h
90℃ 96h
−40℃ 1,000h
90℃ 1,000h
60℃, 90 to 95%RH 1,000h
259
260
−40℃ 96h
90℃ 96h
60℃, 90 to
95%RH 96h
261
−40℃ 1,000h
90℃ 1,000h
60℃, 90 to 95%RH
1,000h
262
263
−40℃ 96h
90℃ 96h
60℃, 90 to
95%RH 96h
264
60℃, 90 to 95%RH 96h
256
258
W：Width. The most outer dimension excluding terminal portion.
D ：Depth. The most outer dimension excluding terminal portion.
H ：Height. The minimum dimension if there are variances.
TACT Switch
TM
Soldering Conditions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 265
TACT Switch
TM
Cautions ・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 266
1. The automotive operating temperature range to be individually discussed upon request.
2.
●
Indicates applicability to all products in the series.
Notes
194
TACT Switch
TM
Soldering Conditions
■
Condition for Reflow
Available for Surface Mount Type.
1. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA（K）or CC（T）at solder joints
（copper foil surface）
.
A heat resistive tape should be used to fix thermocouple.
2. Temperature profile
Temperature (˚C )
180
150
Time
Soft
Soft
Feeling
Feeling
TACT Switch
TM
検
出
260˚C max. 3 sec max.
230˚C
Sharp
Sharp
Feeling
Feeling
120 sec max.
（pre-heating）
3 to 4min.
Time inside soldering equipment
40s max.
Notes
1. The above temperature shall be measured of the top of switch. There are cases where the PC board's temperature greatly
differs from that of the switch, depending on the material, size, thickness of PC boards and others.
The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines.
Prior verification of soldering condition is highly recommended.
Snap-in
Snap-in
Type
Type
Surface
Surface
Mount Type
Mount Type
■
Conditions for Auto-dip
Available for Snap-in Type and Radial Type.
Items
Flux built-up
Condition
Mounting surface should not be exposed to flux
■
Manual Soldering
Items
Soldering temperature
Duration of soldering
Capacity of soldering iron
Condition
350℃ max.
3s max.
60W max.
Radial
Radial
Type
Type
Preheating temperature
Ambient temperature of the soldered surface of PC board. 100℃ max.
Preheating time
Soldering temperature
Duration of immersion
Number of soldering
60s max.
260℃ max.
5s max.
2times max.
SKHH, SKHW, SKRG, SKPD Series
Items
Soldering temperature
Duration of soldering
Capacity of soldering iron
Condition
360℃ max.
3s max.
60W max.
SKHH, SKPD Series
Items
Flux built-up
Preheating temperature
Preheating time
Soldering temperature
Duration of immersion
Number of soldering
Condition
Mounting surface should not be exposed to flux
Ambient temperature of the soldered surface of PC board. 110℃ max.
60s max.
260℃ max.
5s max.
2times max.
SKTD, SKTG, SKQJ, SKQK, SKEG Series
Items
Soldering temperature
Duration of soldering
Capacity of soldering iron
Condition
350℃ max.
3s max.
20W max.
SKQJ, SKQK, SKEG Series
Items
Flux built-up
Preheating temperature
Preheating time
Soldering temperature
Duration of immersion
Number of soldering
Condition
Mounting surface should not be exposed to flux
Ambient temperature of the soldered surface of PC board. 100℃ max.
45s max.
255℃ max.
5s max.
2times max.
Notes
1.
2.
3.
4.
Prevent flux penetration from the top side of the TACT Switch
TM
.
Switch terminals and a PC board should not be coated with flux prior to soldering.
The second soldering should be done after the switch is stable with normal temperature.
Use the flux with a specific gravity of min 0.81.
（EC-19S-8 by TAMURA Corporation, or equivalents.）
265
stm32/stm8
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