DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8, MO-187CBA, MSOP-8
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | TSSOP |
包装说明 | TSSOP, |
针数 | 8 |
Reach Compliance Code | unknown |
Is Samacsys | N |
模拟集成电路 - 其他类型 | SPST |
JESD-30 代码 | S-PDSO-G8 |
JESD-609代码 | e0 |
长度 | 3 mm |
湿度敏感等级 | 1 |
信道数量 | 1 |
功能数量 | 2 |
端子数量 | 8 |
标称断态隔离度 | 55 dB |
通态电阻匹配规范 | 0.05 Ω |
最大通态电阻 (Ron) | 0.8 Ω |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TSSOP |
封装形状 | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 |
座面最大高度 | 1.1 mm |
最大供电电压 (Vsup) | 3.6 V |
最小供电电压 (Vsup) | 1.6 V |
标称供电电压 (Vsup) | 3 V |
表面贴装 | YES |
最长断开时间 | 16 ns |
最长接通时间 | 24 ns |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | GULL WING |
端子节距 | 0.65 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | 20 |
宽度 | 3 mm |
Base Number Matches | 1 |
MAX4742EUA | MAX4741EUA | MAX4741ELA+T | MAX4741EUA-T | MAX4742EKA | MAX4742EKA-T | MAX4743EUA | |
---|---|---|---|---|---|---|---|
描述 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8, MO-187CBA, MSOP-8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8, MO-187CBA, MSOP-8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, DSO8, 2 X 2 MM, 0.80 MM HEIGHT, MICRO, DFN-8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8, MO-187CBA, MSOP-8 | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8, MO-178BA, SOT-23, 8 PIN | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8, MO-178BA, SOT-23, 8 PIN | DUAL 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO8, MO-187CBA, MSOP-8 |
是否无铅 | 含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | TSSOP | TSSOP | DFN | TSSOP | SOIC | SOIC | TSSOP |
包装说明 | TSSOP, | TSSOP, | 2 X 2 MM, 0.80 MM HEIGHT, MICRO, DFN-8 | TSSOP, | MO-178BA, SOT-23, 8 PIN | MO-178BA, SOT-23, 8 PIN | TSSOP, |
针数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
JESD-30 代码 | S-PDSO-G8 | S-PDSO-G8 | S-XDSO-N8 | S-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | S-PDSO-G8 |
JESD-609代码 | e0 | e0 | e4 | e0 | e4 | e4 | e0 |
长度 | 3 mm | 3 mm | 2 mm | 3 mm | 2.9 mm | 2.9 mm | 3 mm |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
标称断态隔离度 | 55 dB | 55 dB | 55 dB | 55 dB | 55 dB | 55 dB | 55 dB |
通态电阻匹配规范 | 0.05 Ω | 0.05 Ω | 0.05 Ω | 0.05 Ω | 0.05 Ω | 0.05 Ω | 0.05 Ω |
最大通态电阻 (Ron) | 0.8 Ω | 0.8 Ω | 0.8 Ω | 0.8 Ω | 0.8 Ω | 0.8 Ω | 0.8 Ω |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TSSOP | TSSOP | VSON | TSSOP | LSSOP | LSSOP | TSSOP |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) | 240 | 240 | 260 | 240 | 240 | 240 | 240 |
座面最大高度 | 1.1 mm | 1.1 mm | 0.8 mm | 1.1 mm | 1.45 mm | 1.45 mm | 1.1 mm |
最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
最小供电电压 (Vsup) | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V | 1.6 V |
标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
最长断开时间 | 16 ns | 16 ns | 16 ns | 16 ns | 16 ns | 16 ns | 16 ns |
最长接通时间 | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns | 24 ns |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | GOLD | TIN LEAD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | TIN LEAD |
端子形式 | GULL WING | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.65 mm | 0.65 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | 20 | 20 | NOT SPECIFIED | 20 | 20 | 20 | 20 |
宽度 | 3 mm | 3 mm | 2 mm | 3 mm | 1.625 mm | 1.625 mm | 3 mm |
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