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GD16521-D

产品描述Support Circuit, 1-Func, DIE
产品类别电信电路   
文件大小162KB,共13页
制造商Intel(英特尔)
官网地址http://www.intel.com/
下载文档 详细参数 选型对比 全文预览

GD16521-D概述

Support Circuit, 1-Func, DIE

GD16521-D规格参数

参数名称属性值
厂商名称Intel(英特尔)
零件包装代码DIE
包装说明DIE,
Reach Compliance Codeunknown
Is SamacsysN
JESD-30 代码X-XUUC-N
功能数量1
封装主体材料UNSPECIFIED
封装代码DIE
封装形状UNSPECIFIED
封装形式UNCASED CHIP
认证状态Not Qualified
标称供电电压3.3 V
表面贴装YES
电信集成电路类型ATM/SONET/SDH SUPPORT CIRCUIT
端子形式NO LEAD
端子位置UPPER
Base Number Matches1

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an Intel company
2.5 Gbit/s
Re-timing
Laser Driver
GD16521
Preliminary
General Description
The GD16521 is a high performance low
power 2.5 Gbit/s Laser Driver with
optional on chip re-timing of data.
The GD16521 is designed to meet and
exceed ITU-T STM-16 and SONET
OC-48 fiberoptic communication systems
requirements.
The GD16521 is designed to sink a Mod-
ulation Current into the IM pin and a
Pre-Bias Current into the IB pin. The
Modulation Current is adjustable up to
50 mA and the Pre-Bias Current is ad-
justable up to 100 mA. The device fea-
tures two control loops for stabilizing the
laser diode operating conditions. An au-
tomatic optical power control loop main-
tains a constant average optical power
out of the laser diode, independent of
changes in the threshold current of the
laser diode. A modulation current control
loop maintains a constant modulation
current for the laser diode, or alterna-
tively maintains a constant extinction ra-
tio of the laser diode.
Re-timing of the data signal connected to
the pins SDIP/SDIN is made by means of
a DFF-clocked by an external clock sig-
nal at the data rate fed to the pins SCIP/
SCIN.
The GD16521 requires a single +3.3 V
supply.
The circuit is available as:
u
48 lead 7 × 7 mm TQFP power
enhanced plastic package
u
die.
Features
l
Differential CML data and clock
inputs with internal 50
W
load termi-
nation.
Selectable on chip retiming-FF.
Output modulation current pulse duty
width adjustable
(Compensates for LD emission delay)
Modulation/Bias current monitor
output.
Modulation/Bias current shutdown
input.
Single supply operation: +3.3 V.
Power dissipation: 410 mW (typ.).
Available as:
– 48 lead 7 × 7 mm TQFP power
enhanced plastic package
– die
l
l
l
l
l
l
l
FFSET
DUTY
IMB IM
AR
PD
IB
IBM
TDlP
TDlN
SDlP
SDlN
SClP
SClN
TClP
TClN
IMC
IMM
VCC
VCCCONT
VCCCM
VCCR
Applications
l
DFF
SEL
Duty
Adjust
VEE
VEER
MTJ
Tele Communication:
– SDH STM-16 modules
– SONET OC-48 modules
Data Communication.
Electro Absorption laser driver.
Direct Modulation laser driver.
OPSET
+ -
+ -
l
l
Mark/Space
Monitor
1/20
1/20
l
MARKN
MARKP
SHDW IMSET
IBSET
Data Sheet Rev.: 11

GD16521-D相似产品对比

GD16521-D GD16521-48BA
描述 Support Circuit, 1-Func, DIE Support Circuit, 1-Func, PQFP48, 7 X 7 MM, 1.40 MM HEIGHT, HEAT SINK, PLASTIC, TQFP-48
厂商名称 Intel(英特尔) Intel(英特尔)
零件包装代码 DIE QFP
包装说明 DIE, HLFQFP,
Reach Compliance Code unknown compliant
JESD-30 代码 X-XUUC-N S-PQFP-G48
功能数量 1 1
封装主体材料 UNSPECIFIED PLASTIC/EPOXY
封装代码 DIE HLFQFP
封装形状 UNSPECIFIED SQUARE
封装形式 UNCASED CHIP FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
认证状态 Not Qualified Not Qualified
标称供电电压 3.3 V 3.3 V
表面贴装 YES YES
电信集成电路类型 ATM/SONET/SDH SUPPORT CIRCUIT ATM/SONET/SDH SUPPORT CIRCUIT
端子形式 NO LEAD GULL WING
端子位置 UPPER QUAD
Base Number Matches 1 1

 
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