REVISION S
DO NOT
SCALE FROM
THIS PRINT
QTE-XXX-01-XXX-D-DP-EMX-XX
No OF POSITIONS
-014, -028, -042
**-056, **-070
(PER ROW)
**SEE NOTE 12
LEAD STYLE
-01: .1680 [4.267]
({No OF POS / 14} x .7875 [20.003]) + .3900 [9.906] REF
(No OF POS / 14) x .7875 [20.003] REF
.7875 20.003 REF
01
* = SEE NOTE 11
OPTION
-GP: GUIDE POST
(USE QTE-20-01-D-EMX-XX-GP
(SEE FIG. 2, SHEET 2)
EDGE MOUNT THICKNESS
-EM2: .064[1.63] +/-.004 PCB
(USE QTE-20-01-D-EM2-XX & T-1S42-01-XXX)
*-EM3:(USE QTE-20-01-D-EM3-XX &
T-1S42-02-XXX)
SEE NOTE 11
DIFFERENTIAL PAIR
.1550 3.937 REF
02
.2350 5.969
REF
ROW SPECIFICATION
-D: DOUBLE (USE QTE-20-XX-D-EMX-XX)
* = NOT ENGINEERING
APPROVED
.0400 1.016
.0333 0.845 REF
6 EQ SPACES
@ .0945[2.400]
.160 4.06 REF
.6440 16.358
QTE-20-01-D-EMX-XX
FIG. 1
T-1G1-01-XXX
No OF BANKS
PLATING SPECIFICATION
-F: FLASH SELECTIVE GOLD WITH MATTE TIN TAILS
(USE T-1S42-XX-F & T-1G1-01-F)(SEE NOTE 6)
-L: LIGHT SELECTIVE GOLD WITH MATTE TIN TAILS
(USE T-1S42-XX-L & T-1G1-01-L)
-H: HEAVY GOLD (USE T-1S42-XX-H & T-1G1-01-G)
-FTL: FLASH SELECTIVE GOLD,TIN/LEAD TAIL
(USE T-1S42-XX-FTL & T-1G1-01-FTL)
-STL: SELECTIVE GOLD, TIN/LEAD TAIL
(USE T-1S42-XX-STL &T-1G1-01-STL)
T-1S42-XX-XXX
"A"
.1750 4.445
REF
C2
.118 3.00
.1680 4.267
(SEE NOTE 7)
"A"
"A" REF
.0400 1.016
REF
SEE TABLE
.7450 18.923 REF
2 MAX SWAY
(TYP)
.0315 0.800 REF
.2782 7.067
REF
C3
C1
"C" REF
.1420 3.607 REF
.1275 3.239 REF
.0150 0.381 REF
.0945 2.400 REF
.0080 0.203 REF
"B" .0030
(INSIDE TO INSIDE OF PIN)
SECTION "A"-"A"
.0300 0.762 REF
.1000 2.540 REF
NOTES:
C
.1200 3.048 REF
C4
1.
REPRESENTS A CRITICAL DIMENSION.
2. BURR ALLOWANCE: .0015 [.038] MAX.
3. MINIMUM TERMINAL RETENTION: 6 OZ.
4. MINIMUM GROUND PLANE RETENTION: 1 LB.
5. PARTS TO BE MOLD-TO-POSITION.
6. -L PLATING CAN BE SUBSTITUTED FOR -F PLATING.
7. MAX VARIANCE OF .002 [.05].
8. NOTE DELETED.
9. BOARD THICKNESS TO BE MEASURED FROM SOLDER PAD TO SOLDER PAD.
10. Http://www.samtec.com/processing/edgemt_tectalk/index.htm
FOR INFORMATION ON PROCESSING EM PARTS.
11. -EM3 IS NOT A STANDARD OFFERING; AVAILABLE AS AN ASP ONLY. PLEASE CONTACT SAMTEC
INTERCONNECT PROCESSING GROUP WITH ORDER INQUIRIES
12. FOR NEW APPLICATIONS REQUIRING THESE POSITIONS, PLEASE CONTACT
SAMTEC INTERCONNECT PROCESSING GROUP.
S 13. PARTS WITHOUT -TY OPTION SHALL BE PACKAGED IN TRAYS.
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
.XX: .01 [.3]
2
.XXX: .005 [.13]
.XXXX: .0020 [.051]
MATERIAL:
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
DECIMALS
ANGLES
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
DESCRIPTION:
DO NOT SCALE DRAWING
SHEET SCALE: 1.5:1
INSULATOR: LCP, COLOR: BLACK
TERMINAL & GROUND PLANE: PHOS BRONZE
.8mm HS EDGEMOUNT TERMINAL ASSEMBLY
DWG. NO.
QTE-XXX-01-XXX-D-DP-EMX-XX
12/12/00
SHEET
1
OF
2
F:\DWG\MISC\MKTG\QTE-XXX-01-XXX-D-DP-EMX-XX-MKT.SLDDRW
BY:
KEVIN B
REVISION S
({No OF POS / 14} x .7875 [20.003])+ .7875 [20.003] REF
({No OF POS / 14} x .7875 [20.003]) + .2255 [5.728] REF
QTE-20-01-D-EMX-XX-GP
"B"
.125 3.18 REF
.300 7.62 REF
.235 5.96 REF
.040 1.02 REF
"B"
SECTION "B"-"B"
"C"
"C"
FIG. 2
-GP OPTION SHOWN
( SAME AS FIG. 1, UNLESS OTHERWISE STATED )
.0700 1.778 REF
.2887 7.332 REF
SECTION "C"-"C"
F:\DWG\MISC\MKTG\QTE-XXX-01-XXX-D-DP-EMX-XX-MKT.SLDDRW
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail: info@SAMTEC.com
code: 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SHEET SCALE: 1.5:1
.8mm HS EDGEMOUNT TERMINAL ASSEMBLY
QTE-XXX-01-XXX-D-DP-EMX-XX
12/12/00
SHEET
2
OF
2
BY:
KEVIN B
DSP 与 ARM 处理器
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