AND Gate, LS Series, 4-Func, 2-Input, TTL, CDFP14, CERAMIC, FP-14
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | DFP |
| 包装说明 | CERAMIC, FP-14 |
| 针数 | 14 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 系列 | LS |
| JESD-30 代码 | R-GDFP-F14 |
| JESD-609代码 | e0 |
| 长度 | 9.21 mm |
| 逻辑集成电路类型 | AND GATE |
| 功能数量 | 4 |
| 输入次数 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 传播延迟（tpd） | 20 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 6.29 mm |
| Base Number Matches | 1 |
| SN54LS08W | SN5408J | SN5408W | SNJ5408J | SN54LS08FK | SNJ5408W | SN54S08FK | SN54S08W | |
|---|---|---|---|---|---|---|---|---|
| 描述 | AND Gate, LS Series, 4-Func, 2-Input, TTL, CDFP14, CERAMIC, FP-14 | AND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, CDIP14, CERAMIC, DIP-14 | AND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, CDFP14, CERAMIC, FP-14 | AND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, CDIP14 | AND Gate, LS Series, 4-Func, 2-Input, TTL, CQCC20, CERAMIC, CC-20 | AND Gate, TTL/H/L Series, 4-Func, 2-Input, TTL, CDFP14, CERAMIC, FP-14 | AND Gate, S Series, 4-Func, 2-Input, TTL, CQCC20, CERAMIC, CC-20 | AND Gate, S Series, 4-Func, 2-Input, TTL, CDFP14, CERAMIC, FP-14 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 包装说明 | CERAMIC, FP-14 | DIP, | DFP, | DIP, | QCCN, | DFP, | QCCN, | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 系列 | LS | TTL/H/L | TTL/H/L | TTL/H/L | LS | TTL/H/L | S | S |
| JESD-30 代码 | R-GDFP-F14 | R-GDIP-T14 | R-GDFP-F14 | R-GDIP-T14 | S-CQCC-N20 | R-GDFP-F14 | S-CQCC-N20 | R-GDFP-F14 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 9.21 mm | 19.56 mm | 9.21 mm | 19.56 mm | 8.89 mm | 9.21 mm | 8.89 mm | 9.21 mm |
| 逻辑集成电路类型 | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE | AND GATE |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 输入次数 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 | 20 | 14 | 20 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DIP | DFP | DIP | QCCN | DFP | QCCN | DFP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | FLATPACK | IN-LINE | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 传播延迟（tpd） | 20 ns | 19 ns | 19 ns | 19 ns | 20 ns | 19 ns | 7.5 ns | 7.5 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.03 mm | 5.08 mm | 2.03 mm | 5.08 mm | 2.03 mm | 2.03 mm | 2.03 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES | YES | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | THROUGH-HOLE | FLAT | THROUGH-HOLE | NO LEAD | FLAT | NO LEAD | FLAT |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 6.29 mm | 7.62 mm | 6.29 mm | 7.62 mm | 8.89 mm | 6.29 mm | 8.89 mm | 6.29 mm |
| 零件包装代码 | DFP | DIP | DFP | - | QFN | DFP | QFN | DFP |
| 针数 | 14 | 14 | 14 | - | 20 | 14 | 20 | 14 |
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