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MT5C2561C-55XT

产品描述256KX1 STANDARD SRAM, 55ns, CDIP24, 0.300 INCH, CERAMIC, DIP-24
产品类别存储   
文件大小79KB,共11页
制造商Micross
官网地址https://www.micross.com
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MT5C2561C-55XT概述

256KX1 STANDARD SRAM, 55ns, CDIP24, 0.300 INCH, CERAMIC, DIP-24

MT5C2561C-55XT规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称Micross
零件包装代码DIP
包装说明DIP,
针数24
Reach Compliance Codeunknown
Is SamacsysN
最长访问时间55 ns
JESD-30 代码R-CDIP-T24
JESD-609代码e0
内存密度262144 bit
内存集成电路类型STANDARD SRAM
内存宽度1
功能数量1
端子数量24
字数262144 words
字数代码256000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织256KX1
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
认证状态Not Qualified
座面最大高度5.08 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层TIN LEAD
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度7.62 mm
Base Number Matches1

文档预览

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SRAM
Austin Semiconductor, Inc.
256K x 1 SRAM
SRAM MEMORY ARRAY
AVAILABLE AS MILITARY
SPECIFICATIONS
• SMD 5962-88725
• SMD 5962-88544
• MIL-STD-883
MT5C2561
PIN ASSIGNMENT
(Top View)
24-Pin DIP (C)
(300 MIL)
A6
A7
A8
A9
A10
A11
A14
A15
A0
Q
WE\
Vss
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
Vcc
A5
A4
A3
A2
A1
A17
A16
A13
A12
D
CE\
FEATURES
High Speed: 35, 45, 55, and 70
Battery Backup: 2V data retention
Low power standby
High-performance, low-power, CMOS double-metal
process
• Single +5V (+10%) Power Supply
• Easy memory expansion with CE\
• All inputs and outputs are TTL compatible
28-Pin LCC (EC)
• Timing
35ns access
45ns access
55ns access
70ns access
• Package(s)
Ceramic DIP (300 mil)
Ceramic LCC
A8
A7
A6
Vcc
A17
OPTIONS
MARKING
-35
-45
-55*
-70*
NC 4
A9 5
A10 6
A11 7
A14 8
A15 9
A0 10
Q 11
NC 12
3 2 1 28 27
26
25
24
23
22
21
20
19
18
13 14 15 16 17
A12
D
CE\
Vss
WE\
NC
A4
A3
A2
A1
A17
A16
A13
NC
C
EC
No. 106
No. 204
• Operating Temperature Ranges
Industrial (-40
o
C to +85
o
C)
IT
o
o
Military (-55 C to +125 C)
XT
• 2V data retention/low power
L
GENERAL DESCRIPTION
The Austin Semiconductor SRAM family employs
high-speed, low-power CMOS and are fabricated using double-
layer metal, double-layer polysilicon technology.
For flexibility in high-speed memory applications,
Austin Semiconductor offers chip enable (CE\) on all organiza-
tions. This enhancement can place the outputs in High-Z for
additional flexibility in system design. The x1 configuration
features separate data input and output.
Writing to these devices is accomplished when write
enable (WE\) and CE\ inputs are both LOW. Reading is accom-
plished when WE\ remains HIGH and CE\ goes LOW. The
device offers a reduced power standby mode when disabled.
This allows system designs to achieve low standby power re-
quirements.
These devices operate from a single +5V power sup-
ply and all inputs and outputs are fully TTL compatible.
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
*Electrical characteristics identical to those provided for the 45ns
access devices.
For more products and information
please visit our web site at
www.austinsemiconductor.com
MT5C2561
Rev. 2.6 06/05
1

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