Memory Circuit, 8X8, CMOS, CPGA68, CAVITY UP, PGA-68
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | PGA |
| 包装说明 | CAVITY UP, PGA-68 |
| 针数 | 68 |
| Reach Compliance Code | not_compliant |
| Is Samacsys | N |
| JESD-30 代码 | S-CPGA-P68 |
| JESD-609代码 | e0 |
| 长度 | 29.464 mm |
| 内存密度 | 64 bit |
| 内存集成电路类型 | MEMORY CIRCUIT |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 68 |
| 字数 | 8 words |
| 字数代码 | 8 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 8X8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA |
| 封装等效代码 | PGA68,11X11 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.207 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 29.464 mm |
| Base Number Matches | 1 |
| IDT79R2020A16G | IDT79R2020A16GB | IDT79R2020A12JB | IDT79R2020A12J | IDT79R2020A16J | IDT79R2020A16JB | IDT79R2020A12GB | IDT79R2020A12G | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Memory Circuit, 8X8, CMOS, CPGA68, CAVITY UP, PGA-68 | Memory Circuit, 8X8, CMOS, CPGA68, CAVITY UP, PGA-68 | Memory Circuit, 8X8, CMOS, PQCC68, PLASTIC, LCC-68 | Memory Circuit, 8X8, CMOS, PQCC68, PLASTIC, LCC-68 | Memory Circuit, 8X8, CMOS, PQCC68, PLASTIC, LCC-68 | Memory Circuit, 8X8, CMOS, PQCC68, PLASTIC, LCC-68 | Memory Circuit, 8X8, CMOS, CPGA68, CAVITY UP, PGA-68 | Memory Circuit, 8X8, CMOS, CPGA68, CAVITY UP, PGA-68 |
| 零件包装代码 | PGA | PGA | LCC | LCC | LCC | LCC | PGA | PGA |
| 包装说明 | CAVITY UP, PGA-68 | CAVITY UP, PGA-68 | QCCJ, | PLASTIC, LCC-68 | PLASTIC, LCC-68 | QCCJ, | CAVITY UP, PGA-68 | CAVITY UP, PGA-68 |
| 针数 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| Reach Compliance Code | not_compliant | not_compliant | unknown | not_compliant | not_compliant | unknown | not_compliant | not_compliant |
| JESD-30 代码 | S-CPGA-P68 | S-CPGA-P68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-CPGA-P68 | S-CPGA-P68 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 29.464 mm | 29.464 mm | 24.2062 mm | 24.2062 mm | 24.2062 mm | 24.2062 mm | 29.464 mm | 29.464 mm |
| 内存密度 | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit | 64 bit |
| 内存集成电路类型 | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 | 68 | 68 |
| 字数 | 8 words | 8 words | 8 words | 8 words | 8 words | 8 words | 8 words | 8 words |
| 字数代码 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C |
| 组织 | 8X8 | 8X8 | 8X8 | 8X8 | 8X8 | 8X8 | 8X8 | 8X8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA | PGA | QCCJ | QCCJ | QCCJ | QCCJ | PGA | PGA |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | GRID ARRAY | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | GRID ARRAY | GRID ARRAY |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.207 mm | 5.207 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 5.207 mm | 5.207 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | YES | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG | PIN/PEG | J BEND | J BEND | J BEND | J BEND | PIN/PEG | PIN/PEG |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm |
| 端子位置 | PERPENDICULAR | PERPENDICULAR | QUAD | QUAD | QUAD | QUAD | PERPENDICULAR | PERPENDICULAR |
| 宽度 | 29.464 mm | 29.464 mm | 24.2062 mm | 24.2062 mm | 24.2062 mm | 24.2062 mm | 29.464 mm | 29.464 mm |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 封装等效代码 | PGA68,11X11 | PGA68,11X11 | - | LDCC68,1.0SQ | LDCC68,1.0SQ | - | PGA68,11X11 | PGA68,11X11 |
| 电源 | 5 V | 5 V | - | 5 V | 5 V | - | 5 V | 5 V |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
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