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IDT74LVC125AP

产品描述Bus Driver, LVC/LCX/Z Series, 4-Func, 1-Bit, True Output, CMOS, PDSO14, TSSOP-14
产品类别逻辑   
文件大小68KB,共6页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 选型对比 全文预览

IDT74LVC125AP概述

Bus Driver, LVC/LCX/Z Series, 4-Func, 1-Bit, True Output, CMOS, PDSO14, TSSOP-14

IDT74LVC125AP规格参数

参数名称属性值
厂商名称IDT (Integrated Device Technology)
零件包装代码TSSOP
包装说明TSSOP-14
针数14
Reach Compliance Codeunknown
Is SamacsysN
系列LVC/LCX/Z
JESD-30 代码R-PDSO-G14
JESD-609代码e0
长度5 mm
逻辑集成电路类型BUS DRIVER
位数1
功能数量4
端口数量2
端子数量14
最高工作温度85 °C
最低工作温度-40 °C
输出特性3-STATE
输出极性TRUE
封装主体材料PLASTIC/EPOXY
封装代码TSSOP
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
传播延迟(tpd)6.3 ns
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层TIN LEAD
端子形式GULL WING
端子节距0.65 mm
端子位置DUAL
宽度4.4 mm
Base Number Matches1

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IDT74LVC125A
3.3V CMOS QUADRUPLE BUS BUFFER GATE WITH 3-STATE OUTPUTS
INDUSTRIAL TEMPERATURE RANGE
3.3V CMOS QUADRUPLE
BUS BUFFER GATE
WITH 3-STATE OUTPUTS
AND 5 VOLT TOLERANT I/O
FEATURES:
• 0.5 MICRON CMOS Technology
• ESD > 2000V per MIL-STD-883, Method 3015; > 200V using
machine model (C = 200pF, R = 0)
• V
CC
= 3.3V ± 0.3V, Normal Range
• V
CC
= 2.7V to 3.6V, Extended Range
• CMOS power levels (0.4μ W typ. static)
μ
• Rail-to-Rail output swing for increased noise margin
• All inputs, outputs, and I/Os are 5V tolerant
• Supports hot insertion
• Available in SOIC and TSSOP packages
IDT74LVC125A
DESCRIPTION:
The LVC125A quadruple bus buffer gate is built using advanced dual
metal CMOS technology. The LVC125A features independent line drivers
with 3-state outputs. Each output is disabled when the associated output-
enable (OE) input is high.
To ensure the high impedance state during power up or power down,
OE
should be tied to Vcc through a pullup resistor; the minimum value of the
resistor is determined by the current-sinking capability of the driver.
Inputs can be driven from either 3.3V or 5V devices. This feature allows
the use of this device as a translator in a mixed 3.3V/5V system environment.
The LVC125A has been designed with a ±24mA output driver. This
driver is capable of driving a moderate to heavy load while maintaining
speed performance.
DRIVE FEATURES:
• High Output Drivers: ±24mA
• Reduced system switching noise
APPLICATIONS:
• 5V and 3.3V mixed voltage systems
• Data communication and telecommunication systems
FUNCTIONAL BLOCK DIAGRAM
1
OE
1
3
OE
10
1
A
2
3
1
Y
3
A
9
8
3
Y
2
OE
4
4
OE
13
2
A
5
6
2
Y
4
A
12
11
4
Y
The IDT logo is a registered trademark of Integrated Device Technology, Inc.
INDUSTRIAL TEMPERATURE RANGE
1
©2004 Integrated Device Technology, Inc.
MAY 2004
DSC-4557/3

IDT74LVC125AP相似产品对比

IDT74LVC125AP IDT74LVC125APGG IDT74LVC125ADCG IDT74LVC125APGG8 IDT74LVC125ADCG8
描述 Bus Driver, LVC/LCX/Z Series, 4-Func, 1-Bit, True Output, CMOS, PDSO14, TSSOP-14 Bus Driver, LVC/LCX/Z Series, 4-Func, 1-Bit, True Output, CMOS, PDSO14, TSSOP-14 Bus Driver, LVC/LCX/Z Series, 4-Func, 1-Bit, True Output, CMOS, PDSO14, SOIC-14 Bus Driver, LVC/LCX/Z Series, 4-Func, 1-Bit, True Output, CMOS, PDSO14, TSSOP-14 Bus Driver, LVC/LCX/Z Series, 4-Func, 1-Bit, True Output, CMOS, PDSO14, SOIC-14
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 TSSOP TSSOP SOIC TSSOP SOIC
包装说明 TSSOP-14 TSSOP-14 SOIC-14 TSSOP-14 SOIC-14
针数 14 14 14 14 14
Reach Compliance Code unknown compliant compliant compliant compliant
系列 LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z LVC/LCX/Z
JESD-30 代码 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14 R-PDSO-G14
JESD-609代码 e0 e3 e3 e3 e3
长度 5 mm 5 mm 9.9314 mm 5 mm 9.9314 mm
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
位数 1 1 1 1 1
功能数量 4 4 4 4 4
端口数量 2 2 2 2 2
端子数量 14 14 14 14 14
最高工作温度 85 °C 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSSOP TSSOP SOP TSSOP SOP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
传播延迟(tpd) 6.3 ns 6.3 ns 6.3 ns 6.3 ns 6.3 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm 1.7272 mm 1.2 mm 1.7272 mm
最大供电电压 (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V 2.7 V 2.7 V 2.7 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 TIN LEAD MATTE TIN MATTE TIN MATTE TIN MATTE TIN
端子形式 GULL WING GULL WING GULL WING GULL WING GULL WING
端子节距 0.65 mm 0.65 mm 1.27 mm 0.65 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL
宽度 4.4 mm 4.4 mm 3.937 mm 4.4 mm 3.937 mm
Base Number Matches 1 1 1 1 1
是否Rohs认证 - 符合 符合 符合 符合
峰值回流温度(摄氏度) - 260 260 260 260
处于峰值回流温度下的最长时间 - 30 30 40 40

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