1-ch, 8:1 general-purpose analog multiplexer with 1.8V logic control 16-TSSOP -40 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | TSSOP, TSSOP16,.25 |
| Reach Compliance Code | compliant |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER |
| 标称带宽 | 500 MHz |
| 最大输入电压 | 5.5 V |
| 最小输入电压 | |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e4 |
| 长度 | 5 mm |
| 湿度敏感等级 | 1 |
| 正常位置 | NO |
| 信道数量 | 8 |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 标称断态隔离度 | -100 dB |
| 通态电阻匹配规范 | 4 Ω |
| 最大通态电阻 (Ron) | 1700 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出 | COMMON OUTPUT |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装等效代码 | TSSOP16,.25 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 筛选级别 | AEC-Q100 |
| 座面最大高度 | 1.2 mm |
| 最大信号电流 | 0.025 A |
| 最大供电电流 (Isup) | 0.001 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.62 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 最长断开时间 | 105 ns |
| 最长接通时间 | 75 ns |
| 切换 | BREAK-BEFORE-MAKE |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 宽度 | 4.4 mm |
| TMUX1308QPWRQ1 | PTMUX1308QDYYRQ1 | PTMUX1308QPWRQ1 | TMUX1308QDYYRQ1 | TMUX1308-Q1 | |
|---|---|---|---|---|---|
| 描述 | 1-ch, 8:1 general-purpose analog multiplexer with 1.8V logic control 16-TSSOP -40 to 125 | 1-ch, 8:1 general-purpose analog multiplexer with 1.8V logic control 16-SOT-23-THN -40 to 125 | 1-ch, 8:1 general-purpose analog multiplexer with 1.8V logic control 16-TSSOP -40 to 125 | 1-ch, 8:1 general-purpose analog multiplexer with 1.8V logic control 16-SOT-23-THN -40 to 125 | 1-ch, 8:1 general-purpose analog multiplexer with 1.8V logic control 16-SOT-23-THN -40 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | - | - |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | - | - |
| 包装说明 | TSSOP, TSSOP16,.25 | TSSOP, TSSOP16,.13,20 | TSSOP, TSSOP16,.25 | - | - |
| Reach Compliance Code | compliant | compliant | unknown | - | - |
| 模拟集成电路 - 其他类型 | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | SINGLE-ENDED MULTIPLEXER | - | - |
| 标称带宽 | 500 MHz | 500 MHz | 500 MHz | - | - |
| 最大输入电压 | 5.5 V | 5.5 V | 5.5 V | - | - |
| JESD-30 代码 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | - | - |
| 长度 | 5 mm | 4.2 mm | 5 mm | - | - |
| 正常位置 | NO | NO | NO | - | - |
| 信道数量 | 8 | 8 | 8 | - | - |
| 功能数量 | 1 | 1 | 1 | - | - |
| 端子数量 | 16 | 16 | 16 | - | - |
| 标称断态隔离度 | -100 dB | -100 dB | -100 dB | - | - |
| 通态电阻匹配规范 | 4 Ω | 4 Ω | 4 Ω | - | - |
| 最大通态电阻 (Ron) | 1700 Ω | 1700 Ω | 1700 Ω | - | - |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | - | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | - | - |
| 输出 | COMMON OUTPUT | COMMON OUTPUT | COMMON OUTPUT | - | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - |
| 封装代码 | TSSOP | TSSOP | TSSOP | - | - |
| 封装等效代码 | TSSOP16,.25 | TSSOP16,.13,20 | TSSOP16,.25 | - | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | - |
| 筛选级别 | AEC-Q100 | AEC-Q100 | AEC-Q100 | - | - |
| 座面最大高度 | 1.2 mm | 1.1 mm | 1.2 mm | - | - |
| 最大信号电流 | 0.025 A | 0.025 A | 0.025 A | - | - |
| 最大供电电流 (Isup) | 0.001 mA | 0.001 mA | 0.001 mA | - | - |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | - |
| 最小供电电压 (Vsup) | 1.62 V | 1.62 V | 1.62 V | - | - |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | - | - |
| 表面贴装 | YES | YES | YES | - | - |
| 最长断开时间 | 105 ns | 105 ns | 105 ns | - | - |
| 最长接通时间 | 75 ns | 75 ns | 75 ns | - | - |
| 切换 | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE | - | - |
| 技术 | CMOS | CMOS | CMOS | - | - |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - | - |
| 端子形式 | GULL WING | GULL WING | GULL WING | - | - |
| 端子节距 | 0.65 mm | 0.5 mm | 0.65 mm | - | - |
| 端子位置 | DUAL | DUAL | DUAL | - | - |
| 宽度 | 4.4 mm | 2 mm | 4.4 mm | - | - |
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