Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) ................................ +300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Electrical Characteristics
(V
DD
= V
DDF
= +5V, V
SS
= 0V, T
A
= +25°C, unless otherwise noted.)
PARAMETER
GENERAL CHARACTERISTICS
Supply Voltage
EEPROM Supply Voltage
Supply Current
Maximum EEPROM Erase/
Write Current
Maximum EEPROM Read
Current
Oscillator Frequency
ANALOG INPUT
Input Impedance
Input-Referred Offset Tempco
Input-Referred Adjustable
Offset Range
Amplifier Gain Nonlinearity
Common-Mode Rejection Ratio
Input Referred Adjustable
FSO Range
ANALOG OUTPUT
Differential Signal-Gain Range
Selectable in 16 steps
Configuration [5:2] 0000bin
Configuration [5:2] 0001bin
Differential Signal Gain
Configuration [5:2] 0010bin
Configuration [5:2] 0100bin
Configuration [5:2] 1000bin
Maximum Output-Voltage Swing
No load from each supply
34
47
58
82
133
39 to 234
39
52
65
91
143
0.02
46
59
74
102
157
V
V/V
V/V
CMRR
R
IN
(Notes 2, 3)
Offset TC = 0 at minimum gain (Note 4)
Percent of +4V span, V
OUT
= +0.5V to
4.5V
Specified for common-mode voltages
between V
SS
and V
DD
(Note 2)
(Note 5)
1
P1
P150
0.01
90
4 to
60
MI
µV/°C
mV
%
dB
mV/V
V
DD
V
DDF
I
DD
I
DDFW
I
DDFR
f
OSC
0.85
(Note 1)
4.5
4.5
5.0
5.0
2.0
30
12
1
1.15
5.5
5.5
2.5
V
V
mA
mA
mA
MHz
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
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Maxim Integrated
│
2
MAX1452
Low-Cost Precision Sensor
Signal Conditioner
Electrical Characteristics (continued)
(V
DD
= V
DDF
= +5V, V
SS
= 0V, T
A
= +25°C, unless otherwise noted.)
PARAMETER
Output-Voltage Low
Output-Voltage High
Output Impedance at DC
Output Offset Ratio
Output Offset TC Ratio
Step Response and IC
(63% Final Value)
Maximum Capacitive Load
Output Noise
BRIDGE DRIVE
Bridge Current
Current Mirror Ratio
V
SPAN
Range (Span Code)
DIGITAL-TO-ANALOG CONVERTERS
DAC Resolution
ODAC Bit Weight
OTCDAC Bit Weight
FSODAC Bit Weight
FSOTCDAC Bit Weight
COARSE OFFSET DAC
IRODAC Resolution
IRODAC Bit Weight
FSOTC BUFFER
Minimum Output-Voltage Swing
Maximum Output-Voltage
Swing
Current Drive
INTERNAL RESISTORS
Current-Source Reference
Resistor
R
ISRC
75
kΩ
No load
No load
V
FSOTC
= +2.5V
V
DD
- 1.0
-40
+40
V
SS
+ 0.1
V
V
µA
ΔV
OUT
/
ΔCode
Including sign
Input referred, DAC reference =
V
DD
= +5.0V (Note 6)
4
9
Bits
mV/bit
ΔV
OUT
/
ΔCode
ΔV
OUT
/
ΔCode
ΔV
OUT
/
ΔCode
ΔV
OUT
/
ΔCode
DAC reference = V
DD
= +5.0V
DAC reference = V
BDR
= +2.5V
DAC reference = V
DD
= +5.0V
DAC reference = V
BDR
= +2.5V
16
76
38
76
38
Bits
µV/bit
µV/bit
µV/bit
µV/bit
I
BDR
AA
R
L
= 1.7kΩ
R
ISOURCE
= internal
T
A
= T
MIN
to T
MAX
0.1
10
4000
0.5
12
2
14
C000
mA
A/A
hex
DC to 1kHz (gain = minimum, source
impedance = 5kΩ V
DDF
filter)
ΔV
OUT
/
ΔOffset
ΔV
OUT
/
ΔOffset TC
0.90
0.9
SYMBOL
CONDITIONS
I
OUT
= 1mA sinking, T
A
= T
MIN
to T
MAX
I
OUT
= 1mA sourcing, T
A
= T
MIN
to T
MAX
4.75
MIN
TYP
0.100
4.87
0.1
1.05
1
150
1
0.5
1.20
1.2
MAX
0.20
UNITS
V
V
Ω
V/V
V/V
µs
µF
mV
RMS
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Maxim Integrated
│
3
MAX1452
Low-Cost Precision Sensor
Signal Conditioner
Electrical Characteristics (continued)
(V
DD
= V
DDF
= +5V, V
SS
= 0V, T
A
= +25°C, unless otherwise noted.)
PARAMETER
Current-Source Reference
Resistor Temperature Coefficient
FSOTC Resistor
FSOTC Resistor Temperature
Coefficient
Temperature ADC Resolution
Offset
Gain
Nonlinearity
Lowest Digital Output
Highest Digital Output
UNCOMMITTED OP AMP
Open-Loop Gain
Input Common-Mode Range
Output Swing
Output-Voltage High
Output-Voltage Low
Offset
Unity-Gain Bandwidth
EEPROM
Maximum Erase/Write Cycles
Minimum Erase Time
Minimum Write Time
Note
Note
Note
Note
Note
1:
2:
3:
4:
5:
(Note 7)
(Note 8)
10k
6
100
Cycles
ms
µs
No load, T
A
= T
MIN
to T
MAX
1mA source, T
A
= T
MIN
to T
MAX
1mA sink, T
A
= T
MIN
to T
MAX
V
IN+
= +2.5V, unity-gain buffer
-20
2
R
L
= 100kΩ
V
SS
V
SS
+
0.02
4.85
4.90
0.05
0.15
+20
90
V
DD
V
DD
-
0.02
dB
V
V
V
V
mV
MHz
SYMBOL
ΔR
ISRC
R
FTC
ΔR
FTC
CONDITIONS
MIN
TYP
1300
75
1300
MAX
UNITS
ppm/°C
kΩ
ppm/°C
TEMPERATURE-TO-DIGITAL CONVERTER
8
P3
1.45
P0.5
00
AF
Bits
LSB
°C/bit
LSB
hex
hex
Excludes sensor or load current.
All electronics temperature errors are compensated together with sensors errors.
The sensor and the MAX1452 must be at the same temperature during calibration and use.
This is the maximum allowable sensor offset.
This is the sensor’s sensitivity normalized to its drive voltage, assuming a desired full span output of +4V and a bridge volt-
age range of +1.7V to +4.25V.
Note 6:
Bit weight is ratiometric to V
DD
.
Note 7:
Programming of the EEPROM at room temperature is recommended.
Note 8:
Allow a minimum of 6ms elapsed time before sending any command.
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Maxim Integrated
│
4
MAX1452
Low-Cost Precision Sensor
Signal Conditioner
Typical Operating Characteristics
(V
DD
= +5V, T
A
= +25°C, unless otherwise noted.)
OFFSET DAC DNL
OUTPUT ERROR FROM STRAIGHT LINE (mV)
MAX1452 toc01
AMPLIFIER GAIN NONLINEARITY
ODAC = 6250hex
OTCDAC = 0
FSODAC = 4000hex
FSOTCDAC = 8000hex
PGA INDEX = 0
IRO = 2
MAX1452 toc02
5.0
5.0
2.5
DNL (mV)
2.5
0
0
-2.5
-2.5
-5.0
0
10k
20k
30k
40k
50k
60k
70k
-5.0
-50 -40 -30 -20 -10
0
10 20 30 40
50
DAC CODE
INPUT VOLTAGE [INP - INM] (mV)
OUTPUT NOISE
MAX1452 toc03
OUT
10mV/div
400µs/div
C = 4.7µF, R
LOAD
= 1kΩ
Pin Description
PIN
SSOP/TSSOP
1
2
3
4
5
6
7
—
8
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TQFN-EP
1
2
3
4
5
6
7
8, 9, 13, 16, 20, 22,
23, 24
10
NAME
ISRC
OUT
V
SS
INM
BDR
INP
V
DD
N.C.
TEST
FUNCTION
Bridge Drive Current Mode Setting
High ESD and Scan Path Output Signal. May need a 0.1µF capacitor, in
noisy environments. OUT may be parallel connected to DIO.
Negative Supply Voltage
Bridge Negative Input. Can be swapped to INP by configuration register.
Bridge Drive
Bridge Positive Input. Can be swapped to INM by configuration register.
Positive Supply Voltage. Connect a 0.1µF capacitor from V
DD
to V
SS
.
No Connection. Not internally connected; leave unconnected (TQFN
SMT贴片机是表面贴装技术（Surface Mount Technology）中的重要设备，它的性能状态对电子制造的质量和效率有着决定性的影响。因此，对SMT贴片机的主要指标性能进行定期检测非常重要。以下是一些主要的检测项目： 定位精度：定位精度是SMT贴片机的核心性能指标，它直接影响到贴片的准确性。通常，我们通过重复测量贴片机在X、Y轴上的移动误差来检测其定位精度。 贴片速度：贴片速度...[详细]
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