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FX11LB-140P-SV(21)

产品描述板对板与夹层连接器 140P M HDR STRT SMT NO GDE PST NO GRD PL
产品类别连接器    连接器   
文件大小717KB,共17页
制造商Hirose
官网地址http://www.hirose-connectors.com/
标准
下载文档 详细参数 全文预览

FX11LB-140P-SV(21)概述

板对板与夹层连接器 140P M HDR STRT SMT NO GDE PST NO GRD PL

FX11LB-140P-SV(21)规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Hirose
Reach Compliance Codeunknown
其他特性HIGH DENSITY, LOW PROFILE
板上安装选件PEG
主体宽度0.207 inch
主体深度0.075 inch
主体长度1.598 inch
主体/外壳类型RECEPTACLE
连接器类型BOARD STACKING CONNECTOR
联系完成配合NOT SPECIFIED
联系完成终止Gold Flash (Au)
触点性别MALE
触点材料NOT SPECIFIED
触点模式RECTANGULAR
触点电阻70 mΩ
触点样式BELLOWED TYPE
DIN 符合性NO
耐用性50 Cycles
滤波功能NO
IEC 符合性NO
绝缘电阻100000000 Ω
绝缘体颜色BEIGE
绝缘体材料LIQUID CRYSTAL POLYMER (LCP)
MIL 符合性NO
插接触点节距0.02 inch
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装选项1LOCKING
安装方式STRAIGHT
安装类型BOARD
连接器数ONE
PCB行数2
装载的行数2
最高工作温度85 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
PCB接触模式RECTANGULAR
PCB触点行间距4.7498 mm
电镀厚度4u inch
极化密钥POLARIZED HOUSING
额定电流(信号)0.3 A
参考标准UL
可靠性COMMERCIAL
端子节距0.5 mm
端接类型SURFACE MOUNT
触点总数140
UL 易燃性代码94V-0

文档预览

下载PDF文档
0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm
High-Speed Board-to-Board Connections
FX11 Series
Stacking height : 2mm
Stacking height : 2.5mm, 3mm
Dec.1.2018 Copyright 2018 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
■Features
1. Low Profile Design
The board-to-board mating height of 2mm, 2.5mm and 3mm suits
smaller, thinner case designs. (Fig.2)
10 Signal : 1 Ground Arrangement
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through a design
that fixes ground plates to both sides of the header and receptacle.
Housing
m
5m
0.7
Ground Plate
Signal contact
m
5m
0.7
mm
0.5
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10 : 1 with the ground plate connected to
the board Via SMT. The ground stability achieved serves to reduce noise. (Fig.1)
Metal fitting
Ground plate and metal fitting make contact
Fig.1
4. Metal Fittings for Added Strength
Metal fittings provide for greater adhesion to the board, which
protects the connector against sheaning forces. The unique
connector design provides a connection between the fitting and the
ground plate for a stronger ground.
Stacking Height Variation
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm affords a compact connector,
and reduces mounting space on the board.
Note: 2.0mm type product cannot be used or interchanged
with the 2.5mm or 3.0mm type product.
Fig.2
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT portion to
prevent solder wicking. (Fig.3)
Structure Prevent Solder Wicking
7. High Contact Reliability
Effective wipe length is 0.55mm (2mm height) and 1mm(2.5mm,
3mm height) for signal contacts.
8. Optional Ground Plate
An alternate style is also available without the ground plate. The
space provided by the absence of the ground plate is filled with
additional signal contacts.
Fig.3
Signal Integrity Features
●Insertion-Loss-to-Crosstalk
Ratio (ICR)
The insertion-loss-to-crosstalk
ratio (ICR) with five differential
FEXT aggressors meets the
extrapolated IEEE802.3ap
specification to 10
+
Gbps.
●Differential
Impedance
The differential impedance is
100 + /- 10ø for FX11 at 50 ps
rise time(20% to 80%).
ICR 3mm(Without GND)
60
50
40
30
20
10
0
ICR
IEEEspec
0
1
2
3
4
5
6
7
8
9
10
120
115
110
105
Impedance 3mm(Without GND)
ICR(dB)
Z(ø)
100
95
90
85
80
0.8
FX11- 3mm DifferentialTDR
0.9
1
1.1
1.2
1.3
1.4
1.5
Frequency(GHz)
Time(ns)
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
2017.11e
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