32GB (x72, ECC, DR) 288-Pin DDR4 RDIMM
Features
DDR4 SDRAM RDIMM
MTA36ASF4G72PZ – 32GB
Features
• DDR4 functionality and operations supported as
defined in the component data sheet
• 288-pin, registered dual in-line memory module
(RDIMM)
• Fast data transfer rates: PC4-3200, PC4-2933,
PC4-2666, or PC4-2400
• 32GB (4 Gig x 72)
• V
DD
= 1.20V (NOM)
• V
PP
= 2.5V (NOM)
• V
DDSPD
= 2.5V (NOM)
• Supports ECC error detection and correction
• Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
• Low-power auto self refresh (LPASR)
• On-die V
REFDQ
generation and calibration
• Dual-rank
• On-board I
2
C temperature sensor with integrated
serial presence-detect (SPD) EEPROM
• 16 internal banks; 4 groups of 4 banks each
• Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
• Selectable BC4 or BL8 on-the-fly (OTF)
• Gold edge contacts
• Halogen-free
• Fly-by topology
• Terminated control, command, and address bus
Table 1: Key Timing Parameters
Data Rate (MT/s)
CL =
PC4-
3200
2933
2666
24
3200,
2933
–
–
22
3200,
2933
2933
–
21
2933
2933
–
20 \
19
2666 \
2666
2666 \
2666
2666 \
2666
18 \
17
2400 \
2400
2400 \
2400
2400 \
2400
16 \
15
2133 \
2133
2133 \
2133
2133 \
2133
14 \
13
1866 \
1866
1866 \
1866
1866 \
1866
12 \
11
1600 \
1600
1600 \
1600
1600 \
1600
10 \
9
1333 \
–
t
RCD
t
RP
t
RC
Figure 1: 288-Pin RDIMM (MO-309, R/C-B1)
Module height: 31.25mm (1.23in)
Figure 2: 288-Pin RDIMM (MO-309, R/C-B2)
Module height: 31.25mm (1.23in)
Options
• Operating temperature
– Commercial (0°C
≤
T
OPER
≤
95°C)
• Package
– 288-pin DIMM (halogen-free)
• Frequency/CAS latency
– 0.62ns @ CL = 22 (DDR4-3200)
– 0.682ns @ CL = 21 (DDR4-2933)
– 0.75ns @ CL = 19 (DDR4-2666)
– 0.83ns @ CL = 17 (DDR4-2400)
Marking
None
Z
-3G2
-2G9
-2G6
-2G3
Speed
Grade
(ns)
13.75
(ns)
13.75
(ns)
45.75
-3G2
-2G9
-2G6
1333 \ 14.32
14.32
46.32
1
(13.75)
1
(45.75)
1
–
(13.75)
1333 \ 14.25
14.25
46.25
1
(13.75)
1
(45.75)
1
–
(13.75)
CCMTD-1725822587-9795
asf36c4gx72pz.pdf - Rev. I 11/18 EN
1
Products and specifications discussed herein are subject to change by Micron without notice.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
32GB (x72, ECC, DR) 288-Pin DDR4 RDIMM
Features
Table 1: Key Timing Parameters (Continued)
Data Rate (MT/s)
CL =
PC4-
2400
2133
24
–
–
22
–
–
21
–
–
20 \
19
–
–
18 \
17
2400 \
2400
–
16 \
15
2133 \
2133
2133 \
2133
14 \
13
1866 \
1866
1866 \
1866
12 \
11
1600 \
1600
1600 \
1600
10 \
9
t
RCD
t
RP
t
RC
Speed
Grade
(ns)
(ns)
(ns)
-2G3
-2G1
1333 \ 14.16
14.16
46.16
1
(13.75)
1
(45.75)
1
–
(13.75)
1333 \
1333
14.06
(13.5)
1
14.06
(13.5)
1
47.06
(46.5)
1
Note:
1. Down-bin timing, refer to component data sheet Speed Bin Tables for details.
Table 2: Addressing
Parameter
Row address
Column address
Device bank group address
Device bank address per group
Device configuration
Module rank address
32GB
128K A[16:0]
1K A[9:0]
4 BG[1:0]
4 BA[1:0]
8Gb (2 Gig x 4), 16 banks
2 CS_n[1:0]
Table 3: Part Numbers and Timing Parameters – 32GB Modules
Base device: MT40A2G4,
1
8Gb DDR4 SDRAM
Module
2
Part Number
Density
Configuration
MTA36ASF4G72PZ-3G2__
MTA36ASF4G72PZ-2G9__
MTA36ASF4G72PZ-2G6__
MTA36ASF4G72PZ-2G3__
Notes:
32GB
32GB
32GB
32GB
4 Gig x 72
4 Gig x 72
4 Gig x 72
4 Gig x 72
Module
Bandwidth
25.6 GB/s
23.47 GB/s
21.3 GB/s
19.2 GB/s
Memory Clock/
Data Rate
0.62ns/3200 MT/s
0.682ns/2933 MT/s
0.75ns/2666 MT/s
0.83ns/2400 MT/s
Clock Cycles
(CL-
t
RCD-
t
RP)
22-22-22
21-21-21
19-19-19
17-17-17
1. The data sheet for the base device can be found on micron.com.
2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions.
Consult factory for current revision codes. Example: MTA36ASF4G72PZ-3G2J1.
CCMTD-1725822587-9795
asf36c4gx72pz.pdf - Rev. I 11/18 EN
2
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
32GB (x72, ECC, DR) 288-Pin DDR4 RDIMM
Important Notes and Warnings
Important Notes and Warnings
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including without limitation specifications and product descriptions. This document supersedes and replaces all
information supplied prior to the publication hereof. You may not rely on any information set forth in this docu-
ment if you obtain the product described herein from any unauthorized distributor or other source not authorized
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costs, damages, and expenses and reasonable attorneys' fees arising out of, directly or indirectly, any claim of
product liability, personal injury, death, or property damage resulting directly or indirectly from any use of non-
automotive-grade products in automotive applications. Customer/distributor shall ensure that the terms and con-
ditions of sale between customer/distributor and any customer of distributor/customer (1) state that Micron
products are not designed or intended for use in automotive applications unless specifically designated by Micron
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CCMTD-1725822587-9795
asf36c4gx72pz.pdf - Rev. I 11/18 EN
4
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2014 Micron Technology, Inc. All rights reserved.
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