1-Axis Magnetic Sensor
HMC1041Z
The Honeywell HMC1041Z is a z-axis surface mount option
designed for low field magnetic sensing. By adding the
HMC1041Z to other 2-axis magneto-resistive sensors, a cost
effective and space-efficient 3-axis magnetometer or
compassing solution is enabled. This compact, low cost
solution is easy to assemble for high volume, cost effective
OEM designs. Applications for the HMC1041Z include
Compassing, Navigation Systems, Magnetometry, and
Current Sensing.
Advanced Information
The HMC1041Z utilizes Honeywell’s Anisotropic Magnetoresistive (AMR) technology that provides advantages over coil
based magnetic sensors. They are extremely sensitive, low field, solid-state magnetic sensors designed to measure
direction and magnitude of Earth’s magnetic fields, from tens of micro-gauss to 6 gauss. Honeywell’s Magnetic Sensors
are among the most sensitive and reliable low-field sensors in the industry.
Honeywell continues to maintain product excellence and performance by introducing innovative solid-state magnetic
sensor solutions. These are highly reliable, top performance products that are delivered when promised. Honeywell’s
magnetic sensor solutions provide real solutions you can count on.
FEATURES
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Low Height Magnetic Sensors (1.05mm)
Surface Mount Z-Axis Sensor
Low Voltage Operations (2.0V)
Low Cost
Available in Tape & Reel Packaging
Lead Free Package Construction
4-Element Wheatstone Bridge
Wide Magnetic Field Range (+/-6 Oe)
Patented Offset and Set/Reset Straps
BENEFITS
and Small Size for Low Profile Vertical Sensing
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Narrow DimensionsMounting, No Layout Constraints
Applications and
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Easy to Assemble & Compatible with High Speed SMT Assembly
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Compatible for Battery Powered Applications
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Designed for High Volume, Cost Effective OEM Designs
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High Volume OEM Assembly
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Complies with Current Environmental Standards
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Low Noise Passive Element Design
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Sensor Can Be Used in Strong Magnetic Field Environments
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Stray Magnetic Field Compensation
HMC1041Z
SPECIFICATIONS
Characteristics
Bridge Elements
Supply
Resistance
Field Range
Sensitivity
Resolution
Vbridge referenced to GND
Bridge current = 1mA
Full scale (FS) – total applied field
Set/Reset Current = 0.5A
1 kHz bandwidth, Vbridge = 5.0 volts
2.0
800
-6
0.8
1.0
0.16
1.44
Bridge Offset
Bandwidth
Disturbing Field
Max. Exposed
Field
Operating
Temperature
Storage
Temperature
Sensitivity
Tempco
Bridge Offset
Tempco
Bridge Ohmic
Tempco
Cross-Axis
Sensitivity
Linearity Error
Best fit straight line
± 1 gauss
± 3 gauss
± 6 gauss
Hysteresis Error
Repeatability Error
3 sweeps across ±3 gauss
3 sweeps across ±3 gauss
0.17
0.42
0.80
0.15
0.11
8.9
%FS
%FS
milli-grams
%FS
Cross field = 0.5 gauss, Happlied = ±3 gauss
±0.5%
%FS/gauss
T
A
= -40 to 125°C, No Set/Reset
T
A
= -40 to 125°C, With Set/Reset
Vbridge=5V, T
A
= -40 to 125°C
2100
±500
±10
2500
2900
ppm/°C
ppm/°C
T
A
= -40 to 125°C, Vbridge=5V
-3500
-3100
-2000
ppm/°C
Ambient, unbiased
-55
125
°C
Ambient
-40
125
°C
Offset = (OUT+) – (OUT-)
Field = 0 gauss after Set pulse
Magnetic signal (lower limit = DC)
Sensitivity starts to degrade.
Use S/R pulse to restore sensitivity.
No perming effect on zero reading
10000
gauss
5
20
MHz
gauss
-2.0
±0.5
+2.0
5.0
1050
20
1300
+6
1.25
Volts
ohms
gauss
mV/V/gauss
milli-gauss
(RMS)
milli-gauss
(pk – pk)
mV/V
Conditions*
Min
Typ
Max
Units
Weight
* Tested at 25°C except stated otherwise.
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HMC1041Z
SPECIFICATIONS
Characteristics
Set/Reset Strap
Resistance
Current
Resistance
Tempco
Offset Straps
Resistance
Offset
Constant
Resistance
Tempco
* Tested at 25°C except stated otherwise.
Measured from OFFSET+ to OFFSET-
DC Current
Field applied in sensitive direction
T
A
=-40 to 125°C
1800
2700
4500
ppm/°C
5
8
10
11
ohms
mA/gauss
Measured from S/R+ to S/R-
0.1% duty cycle, or less,
2µsec current pulse
T
A
=-40 to 125°C
3000
3900
4500
ppm/°C
3
0.4
5
0.5
6
2
ohms
Amp
Conditions*
Min
Typ
Max
Units
Schematic Diagram
HMC1041Z
Pin Configurations
pulse.)
(Arrow indicates direction of applied field that generates a positive output voltage after a SET
Back
View
8
7
6
5
4
3
2
1
Pin Number
1
2
3
4
5
6
7
8
Function
OFFSET-
Vbridge
OFFSET+
OUT+
OUT-
GND
S/R-
S/R+
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HMC1041Z
PACKAGE OUTLINES
PACKAGE DRAWING HMC1041Z (8-PIN LPCC, dimensions in millimeters)
D
41 - 00
E
Front
View
A
Bottom
View
Pin 1
e
L
b
Back
View
Dimension
D
E
A
b
L
e
Min
0.95
4.00
0.91
0.17
0.37
Millimeters
Nom
1.05
4.10
1.08
0.20
0.40
0.5 basic
Max
1.15
4.20
1.25
0.23
0.43
Mounting Considerations
The following is the recommend printed circuit board (PCB) footprint for the HMC1041Z. The two small (0.5mm by 0.5mm)
leveling pads are to hold the part square to the PCB and should receive the same pad finish as the rest of the pads but
without additional solder paste. The goal is to hold the part vertical surfaces perpendicular to the board surface. All
dimensions are nominal and in millimeters.
Back
View
0.20
0.50
0.40
Side
View
Pin Contact
Pin 1
0.50
0.60
Solder
Filet
No Paste
Pad
Pad
0.30
Bottom
View
1.05
0.50
0.50
1.75
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HMC1041Z
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the eight electrical contact pads. Do not apply paste on the
leveling pads. The HMC1041Z has been tested successfully with no-clean solder paste.
Pick and Place
Placement is machine dependant and no restrictions are recommended, and have be tested with mechanical centering.
Placement force should be equivalent 1206 SMT resistors and enough force should be used to squeeze the paste out
from the package/contact pad overlap and to keep the package pin contacts vertical. The low mass of the HMC1041Z
ensures that very little paste is required to hold the part until reflow.
Reflow and Rework
No special profile is required for the HMC1041Z, and compatible with lead eutectic and lead-free solder paste reflow
profiles. Honeywell recommends the adherence to solder paste manufacturer’s guidelines. The HMC1041Z may be
reworked with soldering irons, but extreme care must be taken not to overheat the copper pads from the part’s fiberglass
substrate. Irons with a tip temperature no greater than 315°C should be used. Excessive rework risks the copper pads
pulling away into the molten solder.
Basic Device Operation
The Honeywell HMC1041Z magnetoresistive sensor is a Wheatstone bridge device to measure magnetic fields. With
power supply applied to a bridge, the sensor converts any incident magnetic field in the sensitive axis direction to a
differential voltage output. In addition to the bridge circuit, the sensor has two on-chip magnetically coupled straps; the
offset strap and the set/reset strap. These straps are Honeywell patented features for incident field adjustment and
magnetic domain alignment; and eliminate the need for external coils positioned around the sensors.
The magnetoresistive sensors are made of a nickel-iron (Permalloy) thin-film deposited on a silicon wafer and patterned
as a resistive strip element. In the presence of a magnetic field, a change in the bridge resistive elements causes a
corresponding change in voltage across the bridge outputs.
These resistive elements are aligned together to have a common sensitive axis (indicated by arrows on the pinouts) that
will provide positive voltage change with magnetic fields increasing in the sensitive direction. Because the output only is in
proportion to the one-dimensional axis (the principle of anisotropy) and its magnitude, additional sensor bridges placed at
orthogonal directions permit accurate measurement of arbitrary field direction. The combination of sensor bridges in two
and three orthogonal axis permit applications such as compassing and magnetometry.
The offset strap allows for several modes of operation when a direct current is driven through it. These modes are: 1)
Subtraction (bucking) of an unwanted external magnetic field, 2) null-ing of the bridge offset voltage, 3) Closed loop field
cancellation, and 4) Auto-calibration of bridge gain.
The set/reset strap can be pulsed with high currents for the following benefits: 1) Enable the sensor to perform high
sensitivity measurements, 2) Flip the polarity of the bridge output voltage, and 3) Periodically used to improve linearity,
lower cross-axis effects, and temperature effects.
Offset Strap
The offset strap is a spiral of metallization that couples in the sensor element’s sensitive axis. The offset strap measures
nominally 8 ohms, and requires 10mA for each gauss of induced field. The straps will easily handle currents to buck or
boost fields through the ±6 gauss linear measurement range, but designers should note the extreme thermal heating on
the die when doing so.
With most applications, the offset strap is not utilized and can be ignored. Designers can leave one or both strap
connections (Off- and Off+) open circuited, or ground one connection node. Do not tie both strap connections together to
avoid shorted turn magnetic circuits.
Set/Reset Strap
The set/reset strap is another spiral of metallization that couples to the sensor elements easy axis (perpendicular to the
sensitive axis on the sensor die. Each set/reset strap has a nominal resistance of 5 ohms with a nominal required peak
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