Three-Axis Magnetic Sensor
HMC1043L
The Honeywell HMC1043L is a miniature three-axis surface mount sensor array
designed for low field magnetic sensing. By adding the HMC1043L with supporting
signal processing, a cost effective and space-efficient three-axis magnetometer or
compassing solution is enabled. This ultra-compact, low cost solution is easy to
assemble for high volume OEM designs. Applications for the HMC1043L include
Compassing, Navigation Systems, Magnetometry, and Current Sensing.
The HMC1043L utilizes Honeywell’s Anisotropic Magnetoresistive (AMR) technology
that provides advantages over coil based magnetic sensors. They are extremely
sensitive, low field, solid-state magnetic sensors designed to measure direction and magnitude of Earth’s magnetic fields,
from tens of micro-gauss to 6 gauss. Honeywell’s Magnetic Sensors are among the most sensitive and reliable low-field
sensors in the industry.
Honeywell continues to maintain product excellence and performance by introducing innovative solid-state magnetic
sensor solutions. These are highly reliable, top performance products that are delivered when promised. Honeywell’s
magnetic sensor solutions provide real solutions you can count on.
FEATURES
Low Height Magnetic Sensors (1.2mm)
Surface Mount Three-Axis Sensors
Low Voltage Operations (2.0V)
Low Cost
Available in Tape & Reel Packaging
4-Element Wheatstone Bridges
Wide Magnetic Field Range (+/-6 Oe)
Patented Offset and Set/Reset Straps
Lead Free Package Construction
BENEFITS
and Small Size for Low Profile Vertical Sensing
Narrow DimensionsMounting, No Layout Constraints
Applications and
Easy to Assemble & Compatible with High Speed SMT Assembly
Compatible for Battery Powered Applications
Designed for High Volume, Cost Effective OEM Designs
High Volume OEM Assembly
Low Noise Passive Element Design
Sensor Can Be Used in Strong Magnetic Field Environments
Stray Magnetic Field Compensation
RoHS Compliance
1 Preliminary Document. Subject to change.
www.magneticsensors.com
SPECIFICATIONS – PRELIMINARY DOCUMENT. SUBJECT TO CHANGE.
Characteristics
Bridge Elements
Supply
Resistance
Vbridge referenced to GND
Bridge current = 10mA
per bridge
measured Vb to Vss
Ambient
Ambient, unbiased
Tested at 85°C
Moisture Sensitivity Level
Full scale (FS) – total applied field
Best fit straight line
± 1 gauss
± 3 gauss
± 6 gauss
3 sweeps across ±3 gauss
3 sweeps across ±3 gauss
Offset = (OUT+) – (OUT-)
Field = 0 gauss after Set pulse
Set/Reset Current = 0.5A per strap
@ 1kHz, Vbridge=5V
50Hz Bandwidth, Vbridge=5V
Magnetic signal (lower limit = DC)
Sensitivity starts to degrade.
Use S/R pulse to restore sensitivity.
T
A
= -40 to 125°C, Vbridge=5V
T
A
= -40 to 125°C, Ibridge=5mA
T
A
= -40 to 125°C, No Set/Reset, ±1 gauss
T
A
= -40 to 125°C, With Set/Reset
Vbridge=5V, T
A
= -40 to 125°C
Cross field = 1 gauss, Happlied = ±1 gauss
No perming effect on zero reading
X toY sensors
X to Z or Y to Z
0.01
1.5
2100
20
-3700
-3400
-1000
±700
±10
2400
±0.3
10000
2700
-3100
-1.25
0.8
-6
0.1
0.4
1.4
0.06
0.1
±0.5
1.0
50
120
5
+1.25
1.2
3
+6
1.8
800
265
-40
-55
3.0
1000
333
10
1500
500
125
150
85
Volts
ohms
ohms
°C
°C
%
-
gauss
%FS
%FS
%FS
mV/V
mV/V/gauss
nV/sqrt Hz
gauss
MHz
gauss
ppm/°C
ppm/°C
ppm/°C
%FS
gauss
degree
Conditions*
Min
Typ
Max
Units
Operating Temperature
Storage Temperature
Humidity
MSL
Field Range
Linearity Error
Hysteresis Error
Repeatability Error
Bridge Offset
Sensitivity
Noise Density
Resolution
Bandwidth
Disturbing Field
Sensitivity Tempco
Bridge Offset Tempco
Bridge Ohmic Tempco
Cross-Axis Effect
Max. Exposed Field
X,Y, Z sensor
Orthogonality
Set/Reset Straps
Resistance
Current
Resistance Tempco
Offset Straps
Resistance
Offset Constant
Measured from S/R+ to S/R-
0.1% duty cycle, or less, 2sec current pulse
T
A
= -40 to 125°C
1.5
0.4
3300
2.5
0.5
3700
3
4
4100
ohms
Amp
ppm/°C
Measured from OFF+ to OFF-
DC Current
Field applied in sensitive direction
10
13
10
16
ohms
mA/gauss
Resistance Tempco
T
A
= -40 to 125°C
* Tested and specified at 25°C except stated otherwise.
3500
3900
4300
ppm/°C
2 Preliminary Document. Subject to change.
www.magneticsensors.com
SCHEMATIC DIAGRAM
VB (12)
OUT- X
(15)
OUT+ X
(3)
OUT- Y
(1)
OUT+ Y OUT- Z
(10)
(6)
OUT+ Z
(11)
VSS
(2)
OFF- XY
(4)
OFF- Z
(13)
OFF+ XY
(16)
OFF+ Z
(14)
SR-
(7)
SR+
(5)
PIN CONFIGURATIONS
(Arrow indicates direction of applied field that generates a positive output voltage after a SET pulse.)
Pin Number
1
2
3
4
5
6
7
8
Function
OUT- Y
VSS
OUT+ X
OFF- XY
SR+
OUT+ Y
SR-
NC
Pin Number
9
10
11
12
13
14
15
16
Function
NC
OUT- Z
OUT+ Z
VB
OFF- Z
OFF+ Z
OUT-X
OFF+ XY
3 Preliminary Document. Subject to change.
www.magneticsensors.com
PACKAGE OUTLINE
HMC1043L
PACKAGE DRAWING HMC1043 (16-PIN LPCC)
Dimensions
Drawing (mm)
Ref.
E1
D1
A1
L1
N1
N2
P1
P2
T1
T2
M1
M2
Min.
3.450
2.950
1.150
1.460
1.710
0.460
1.160
1.160
0.360
0.160
0.060
0.310
Typ.
3.500
3.000
1.200
1.500
0.750
0.500
1.200
1.200
0.400
0.200
0.100
0.350
Max.
3.550
3.050
1.250
1.540
0.790
0.540
1.240
1.240
0.440
0.240
0.140
0.390
Drawing (inches)
Min.
0.1358
0.1161
0.0453
0.0575
0.0673
0.0181
0.0457
0.0457
0.0142
0.0063
0.0024
0.0112
Typ.
0.1378
0.1181
0.0472
0.0591
0.0295
0.0197
0.0472
0.0472
0.0157
0.0079
0.0039
0.0137
Max.
0.1398
0.1201
0.0492
0.0606
0.0311
0.0213
0.0488
0.0488
0.0173
0.0094
0.0055
0.0153
4 Preliminary Document. Subject to change.
www.magneticsensors.com
MOUNTING CONSIDERATIONS
The following is the recommend printed circuit board (PCB) footprint for the HMC1043L.
NOTE: The HMC1043L is designed to fit on the
same landing pad designed for an HMC1043.
Top View
Each of the sixteen pads on the HMC1043L is spaced on 0.5mm centers with 4 pads per side. Each pad is nominally
0.20mm by 0.40mm with a tin over copper finish. Recommended PCB lands for the HMC1043L are outsized to 0.28mm
by 0.65mm for 0.025mm sides plus 0.05mm inside and 0.20mm outside areas. The extra area is for good reflow
attachment and enough pad contact exposure for test probing if necessary.
Stencil Design and Solder Paste
A 4 mil stencil and 100% paste coverage is recommended for the eight electrical contact pads. Do not apply paste on the
leveling pads. The HMC1043L
is expected to be
tested successfully with no-clean solder paste.
Pick and Place
Placement is machine dependant and no restrictions are recommended. The HMC1043L weight is 25.6 milli-grams.
Reflow and Rework
This device
is expected to be
classified as MSL 3 with 260
C
peak reflow temperature. A baking process (125
C,
24
hrs) is required if device is not kept continuously in a dry (< 10% RH) environment before assembly. No special reflow
profile is required for HMC1043 which is compatible with lead eutectic and lead-free solder paste reflow profiles.
Honeywell recommends the adherence to solder paste manufacturer’s guidelines.
5 Preliminary Document. Subject to change.
www.magneticsensors.com
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