RoHS Compliant
4GB DDR4 SDRAM UDIMM
Halogen free
Product Specifications
November 1, 2017
Version 0.4
Apacer Technology Inc.
1F., No.32, Zhongcheng Rd., Tucheng Dist., New Taipei City 236, Taiwan
Tel: +886-2-2267-8000
www.apacer.com
Fax: +886-2-2267-2261
Table of Contents
General Description ....................................................................................................... 2
Ordering Information ..................................................................................................... 2
Key Parameters .............................................................................................................. 2
Specifications: ................................................................................................................ 3
Features: ......................................................................................................................... 4
Pin Assignments ............................................................................................................. 5
Pin Descriptions ............................................................................................................. 7
Functional Block Diagram ............................................................................................. 8
Absolute Maximum Ratings .......................................................................................... 9
DRAM Component Operating Temperature Range..................................................... 10
Operating Conditions ................................................................................................... 11
Environmental Requirements....................................................................................... 12
Mechanical Drawing .................................................................................................... 13
©Apacer Technology Inc.
1
General Description
Apacer
78.B1GN3.4040B
is a 512M x 64 DDR4 SDRAM (Synchronous DRAM)
DIMM. This high-density memory module consists of 8 pieces 256M x 16 bits
with 4 banks DDR4 synchronous DRAMs in FBGA packages and a 4K Bits
EEPROM. The module is a 288-pins dual in-line memory module and is
intended for mounting into a connector socket. The following provides general
specifications of this module.
Ordering Information
Part Number
78.B1GN3.4040B
Bandwidth
19.2 GB/sec
Speed Grade
2400 Mbps
Max Frequency
1200 MHz
CAS Latency
CL17
Density
4GB
Organization
512M x 64
Component
256M x16*8
Rank
2
Key Parameters
MT/s
Grade
DDR4-1866
-CL13
1.07
13
13.92
13.92
34
47.92
13-13-13
DDR4-2133
-CL15
0.93
15
14.06
14.06
33
47.05
15-15-15
DDR4-2400
-CL17
0.83
17
14.16
14.16
32
46.16
17-17-17
Unit
ns
tCK
ns
ns
ns
ns
tCK
tCK (min)
CAS latency
tRCD (min)
tRP (min)
tRAS (min)
tRC (min)
CL-tRCD-tRP
©Apacer Technology Inc.
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Specifications:
On-DIMM thermal sensor : No
Organization: 512 words x 64 bits, 2 rank
Integrating 8 pieces of 4G bits DDR4 SDRAM sealed FBGA
Package: 288-pin socket type dual in-line memory module (DIMM)
PCB: height 31.25 mm, lead pitch 0.85 mm (pin),
Serial Presence Detect (SPD)
Power Supply: VDD=1.2V (1.14V to 1.26V)
VDDQ = 1.2V (1.14V to 1.26V)
VPP = 2.5V (2.375V to 2.75V)
VDDSPD = 2.2V to 3.6V
16 internal banks
TC of 0°C to 95°C
–64ms, 8192-cycle refresh at 0°C to 85°C
–32ms at 85°C to 95°C
Lead-free (RoHS compliant)
Halogen free
©Apacer Technology Inc.
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Features:
Functionality and operations comply with the DDR4 SDRAM datasheet
Bank Grouping is applied, and CAS to CAS latency (tCCD_L, tCCD_S) for
the banks in the same or dif-ferent bank group accesses are available
Bi-Directional Differential Data Strobe
8 bit pre-fetch
Burst Length (BL) switch on-the-fly BL8 or BC4(Burst Chop)
Per DRAM Addressability is supported
Internal Vref DQ level generation is available
Write CRC is supported at all speed grades
DBI (Data Bus Inversion) is supported(x8)
CA parity (Command/Address Parity) mode is supported
©Apacer Technology Inc.
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