ArrayC Series
Silicon Photomultiplier
(SiPM) 4-Side Scaleable
Arrays
ON Semiconductor’s range of C-Series, SMT (surface mount
technology) SiPM sensors have been used to create compact and
scaleable arrays. The sensors are mounted onto PCB boards with
minimal dead space. The ArrayC products are available in a variety of
formats, and formed of pixels of different sizes. Details of the arrays
available are given in the
Ordering Information
table on page 29 of
this document.
The back of each ArrayC has either one or more multi-way
connectors, or a BGA (ball grid array), that allow access to the fast
output* and
standard
I/O from each pixel in the array, and a
common
I/O from the summed substrates of the pixels. The ArrayC products
with connectors can be used to interface with the user’s own readout
via the mating connector, or to ON Semiconductor’s Breakout Boards
(BOBs). The BOBs allow for easy access to the pixel signals and
performance evaluation of the arrays.
ArrayC products with the BGA can be reflow soldered to the user’s
readout boards, or purchased ready-mounted on an Evaluation Board
(EVB) for easy testing. The BGA ArrayC products cannot be removed
from their EVBs. This contrasts with an ArrayC that has connectors,
where multiple arrays can be evaluated with a single BOB.
ArrayC Inputs and Outputs (I/O)
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S1
F1
S2
F2
Common
Sn+1
Fn+1
Sn+2
Fn+2
Figure 1 summarizes the array schematic for a portion of an ArrayC.
Each SiPM sensor in the array has three electrical connections: fast
output*, standard output and common.
The substrates (cathodes) of all sensors are summed together to
form the common I/O.
Each individual fast output* and standard I/O (anode) are routed to
its own output pin.
The pixel-level performance of the sensors in the array can be found
in the
C-Series
datasheet.
Table of Contents
ARRAYC−60035−4P−BGA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
ARRAYC−60035−4P−GEVB
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
ARRAYC−60035−64P−PCB
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ARRAYX−BOB6−64S
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
ARRAYX−BOB6−64S
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
ARRAYC−30035−16P−PCB
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
ARRAYX−BOB3−16P
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
ARRAYX−BOB3−16S
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
ARRAYC−30035−144P−PCB
. . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
ARRAYX−BOB3−144P
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Biasing and Readout from the Standard Breakout Boards . . . . 24
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Appendix B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Appendix C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
* The ARRAYC-60035-4P does not have access to the fast output.
©
Semiconductor Components Industries, LLC, 2018
Figure 1. Signal connections at the pixel
level of an ArrayC
ATTENTION!
Great care should be taken when disconnecting the
ArrayC PCBs from the mating connectors, either on one
of the BOBs, or the user’s own boards.
The board should be gently levered up, working
progressively around the board to lever the PCB from the
connector a little on all sides, and then repeating the
process until the connectors are free from each other.
Note that a BGA ArrayC cannot be removed from its EVB.
November, 2018
−
Rev. 5
1
Publication Order Number:
ARRAYC−SERIES/D
ArrayC Series
ARRAYC-60035-4P-BGA (2 x 2 ARRAY OF 6 mm SMT SENSORS)
Array Size
2x2
Sensor Type
60035
Readout
Pixel
Board Size
14.2 x 14.2 mm
2
Pixel Pitch
7.2 mm
No. Connections
9
No. Connectors
3 x 3 BGA
The ARRAYC-60035-4P is comprised of 4 individual
6mm C-Series sensors arranged in a 2 x 2 array.
The performance of the individual pixels and details of the
bias to apply can be found in the
C-Series
datasheet.
Connections to each sensor are provided by a BGA (ball
grid array). The BGA can be used to mount the array on the
user’s board using reflow soldering.
The 4 SiPM sensors have all substrate connections
(cathodes) connected together to form a common I/O. The
3 x 3 BGA provides connections as follows:
•
4 x standard I/O
•
5 x common I/O
•
There is NO fast output
Schematics for the ARRAYC-60035-4P-BGA
The complete ARRAYC-60035-4P-BGA CAD and solder footprint is available to
download.
www.onsemi.com
2
ArrayC Series
BGA Connections for the ARRAYC-60035-4P-BGA
The fiducial is indicated in the image below. It marks the
location of both pin A1 and pixel 1.
Pin. No
A1
Fiducial
Function
Anode 1
Anode 2
Common Cathode
Anode 3
Anode 4
Common Cathode
Common Cathode
Common Cathode
Common Cathode
A2
A3
B1
B2
B3
C1
C2
C3
ARRAYC-60035-4P-BGA - Solder Footprint and Reflow
Solder Profile
The BGA package is compatible with standard reflow
solder processes (J-STD-20) and so is ideal for high-volume
manufacturing. The ARRAYC-60035-4P-BGA should be
mounted according to specified soldering pad patterns, as
given in of the
CAD file.
Solder paste (we recommend using no-clean solder paste)
must be evenly applied to each soldering pad to insure
proper bonding and positioning of the array. After soldering,
allow at least three minutes for the component to cool to
room temperature before further operations.
Solder reflow conditions must be in compliance with
J-STD-20, table 5.2. This is summarized in Figure 2. The
number of passes should not be more than 2.
Solder Reflow Profile
300
Max 260°C
250
Temperature (5C)
200
150
100
50
0
0
50
100
150
Time (s)
200
250
300
Max 4°C/s
217°C
180°C
60 to 120 s
60~100 s
Max 10 s at 260°C
Max 6°C/s
Figure 2. Solder reflow profile. Conditions must be in compliance with J-STD-20, table 5.2
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3
ArrayC Series
ARRAYC-60035-4P-GEVB
(ARRAYC-60035-4P-BGA Evaluation Board)
The ARRAYC-60035-4P-GEVB is an evaluation board
allowing easy access to the signals of a ARRAYC-60035-
4P-BGA via pins.
The ARRAYC-60035-4P-GEVB has the array on the
front and pins on the back of the PCB. The pins are
compatible with a standard 8-pin DIL socket for evaluation
purposes. Alternatively, the pins can be directly soldered
into through-holes in the user’s readout PCB. Four of the
pins are connected to the anodes of the individual pixels and
the other four pins are connected to the common cathode. An
example
mating
8-pin
DIL
socket
is
the
110-93-308-41-001000 from Mill-Max.
The GEVB PCB is slightly smaller than the actual array,
allowing for tiling.
The GEVB does NOT provide access to the fast output.
Pin. No
1
2
3
4
5
6
7
8
Function
Anode 1
Common Cathode
Anode 3
Common Cathode
Common Cathode
Anode 4
Common Cathode
Anode 2
Schematics for the ARRAYC-60035-4P-GEVB
The complete ARRAYC-60035-4P-GEVB CAD and solder footprint is available to
download.
www.onsemi.com
4
ArrayC Series
ARRAYC-60035-64P-PCB (8 x 8 ARRAY OF 6 mm SMT SENSORS)
Array Size
8x8
Sensor Type
60035
Readout
Pixel
Board Size
57.4 x 57.4 mm
2
Pixel Pitch
7.2 mm
No. Connections
160
No. Connectors
2 x 80-way
The ARRAYC-60035-64P is comprised of 64 individual
6mm SMT sensors arranged in a 8 x 8 array.
The performance of the individual pixels and details of the
bias to apply can be found in the
C-Series
datasheet.
The connections to each array are provided by two
Samtec 80-way connectors, type QTE-040-03-F-D-A.
These connectors mate with the Samtec QSE-040-
01-F-D-A board-to-board connector and the Samtec EQCD
High Speed Cable Assemblies. The 64 SiPM pixels all have
substrate connections (cathode) summed to form a common
I/O. The 80-way connectors provide connections as follows:
•
64 x fast output
•
64 x standard I/O
•
32 x common I/O
Schematics for the ARRAYC-60035-64P-PCB
The complete ARRAYC-60035-64P-PCB CAD is available to
download.
www.onsemi.com
5
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