Bus Driver, FCT Series, 1-Func, 9-Bit, True Output, CMOS, PDSO24, 0.300 INCH, SOIC-24
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| 包装说明 | 0.300 INCH, SOIC-24 |
| Reach Compliance Code | unknown |
| Is Samacsys | N |
| 其他特性 | WITH CLEAR AND PRESET |
| 系列 | FCT |
| JESD-30 代码 | R-PDSO-G24 |
| 长度 | 15.4 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 9 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 传播延迟（tpd） | 6.4 ns |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 7.5 mm |
| Base Number Matches | 1 |
| IDT74FCT843CSO | IDT74FCT843AP | IDT74FCT843BE | IDT74FCT843BP | |
|---|---|---|---|---|
| 描述 | Bus Driver, FCT Series, 1-Func, 9-Bit, True Output, CMOS, PDSO24, 0.300 INCH, SOIC-24 | Bus Driver, FCT Series, 1-Func, 9-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Bus Driver, FCT Series, 1-Func, 9-Bit, True Output, CMOS, CDFP24, CERPACK-24 | Bus Driver, FCT Series, 1-Func, 9-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 包装说明 | 0.300 INCH, SOIC-24 | DIP, | DFP, | DIP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Is Samacsys | N | N | N | N |
| 其他特性 | WITH CLEAR AND PRESET | WITH CLEAR AND PRESET | WITH CLEAR AND PRESET | WITH CLEAR AND PRESET |
| 系列 | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-PDSO-G24 | R-PDIP-T24 | R-GDFP-F24 | R-PDIP-T24 |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DFP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | FLATPACK | IN-LINE |
| 传播延迟（tpd） | 6.4 ns | 12 ns | 8 ns | 8 ns |
| 座面最大高度 | 2.65 mm | 4.191 mm | 2.286 mm | 4.191 mm |
| 最大供电电压 (Vsup) | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | FLAT | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.5 mm | 7.62 mm | 9.144 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
| 长度 | 15.4 mm | 31.6865 mm | - | 31.6865 mm |
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