r
esIsTor
P
ower
T
hIn
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Ilm
rhf s
erIes
k
ey
F
eatureS
• Resistances from 0.01 Ohm to 51K Ohms
• Low Stability to 1%
• Resistance Tolerances to ± 1%
• TCR to ± 50ppm/ºC
• Power Rating to 35 Watt
• Solder Reflow Secure at 260ºC / 20s
• TO-263 Housing (D-Pak)
• Isolated Back Plate
a
pplicationS
• Power Inverters
• Braking Systems
• Lighting (LED)
• Power Supplies
p
roduct
r
ange
S
ummary
POWER RATING
(with heatsink)
1
RESISTANCE
RANGE (Ω)
0.01 to 0.099
Ω
0.1 to 9.9
Ω
10 to 51K
Ω
TEMPERATURE
COEFFICIENT
± 250 ppm/ºC
± 100 ppm/ºC
± 50 ppm/ºC
TOLERANCE
RANGE
2
± 5%
±
1% /
±
5%
± 1%
OPERTING
TEMPERATURE
RANGE
-55ºC to+155ºC
35 W
1
2
2W on simple solder pad
Consult factory for other tolerances not listed
H
ow
t
o
o
rder
RHF
RESISTOR
POWER THIN FILM
RHF
H4
PACKAGE CODE
WATTS
H4, 35W, TO-263
Q
TEMPERATURE
COEFFICIENT OF
RESISTANCE (TCR)
Q = ± 50 ppm/ºC
N = ± 100 ppm/ºC
K = ±250 ppm/ºC
038K0
RESISTANCE
F
TOLERANCE
E
PACKING
0R038 = 0.038Ω
003K8 = 3.8KΩ
038K0 = 38.0KΩ
F = ± 1.0%
J = ± 5.0%
E = Embossed Tape & Reel
For Tin/Lead coated leads, add “-Pb” to part numbers.
Standard Termination Finish: Matte Tin (Sn)
Example P/N:
RHFH4Q038K0FE
is Resistor Power Thin, 35W, ±50ppm/ºC, 38.0KΩ, ±1.0%, embossed tape & reel
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ower
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ecHanical
c
HaracteriSticS
Dimensions
Units
mm
tol. (± mm)
inches
tol. (± inches)
A
10.3
0.2
0.405
0.008
B
10.1
0.2
0.400
0.008
C
15.3
1.0
4.54
0.04
D
5.08
0.1
0.200
0.004
E
1.5
0.05
0.060
0.002
F
0.75
0.05
0.030
0.002
G
2.2
0.2
0.087
0.008
H
4.5
0.2
0.177
0.008
J
0.5
0.05
0.020
0.002
K
2.5
0.5
0.10
0.02
L
5.0
1.0
0.20
0.04
S
peciFicationS
Specifications
Resistor Material
Terminals
Power Rating (with heatsink)
Inductance
Resistance Range
Temperature Coefficient
Tolerances (contact factory for other values)
Operating Temperature
Thermal Resistance Rthj-c
Max Operating Voltage
Voltage Proof
Insulation Resistance
Load Life
Humidity
Temperature Cycle
Solder Heat
Vibration
Reflow soldering
Moisture Sensitivity Level: MSL-1
±1%
±1%
±0.25%
±0.1%
±0.25%
0.01 to 0.099Ω
±250 ppm/°C
± 5%
Values
Thin Film
2
35 W ( 2W on Simple Solder Pad )
8.4 nH
0.1 to 9.9Ω
±100 ppm/°C
±1% / ±5%
-55°C to 155°C
3.3 K/W
500V
2.0kV DC
Over 1,000 MΩ
90 min ON, 30 min OFF, 1000 hrs @ 25ºC
90-95% RH, 0.1W, 1000 hrs @ 40ºC
-55ºC for 30 min, +155ºC for 30 min, 5 cycles
350ºC ±5C for 3 seconds
IEC60068-2-6
Lead-free soldering 260°C / 20s
10 to 51KΩ
±50 ppm/°C
±1%
60
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POWER RATING NOTES:
RHF Resistors must be attached to a suitable heatsink.
The maximum internal resistor temperature is 175°C.
Use the following formula to specify appropriate heatsink:
Power Derating Curve
Power (% Nominal)
120
100
80
60
40
20
0
25
50
85
100
115
130
145
155
Where: R
qH
=
Thermal Resistance of Heatsink ( K/W )
R
qR
= T
hermal Resistance of Resistor ( K/W )
T
MAX
=
Maximum Temperature of Resistor ( °C )
T
A
=
Ambient Temperature of Heatsink ( °C )
P
=
Power Through Resistor ( W )
Temperature of the Backplate (°C)
Load life test will be necessary in actual equipment
This datasheet is subject to change without notice.
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61
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