High Current Molded Power Inductor - PA4346.XXXANLT Series
Height:
5.0mm Max
Footprint:
14.0mm x 12.8mm Max
Current Rating:
up to 50.0A
Inductance Range:
0.22uH to 15.0uH
Shielded construction and compact design
High current, low DCR, and high efficiency
Minimized acoustic noise and minimized leakage flux
Electrical Specifications @ 25°C - Operating Temperature -55°C to +155°C
Part
Number
PA4346.221ANLT
PA4346.471ANLT
PA4346.681ANLT
PA4346.102ANLT
PA4346.152ANLT
PA4346.222ANLT
PA4346.332ANLT
PA4346.472ANLT
PA4346.682ANLT
PA4346.103ANLT
PA4346.153ANLT
Notes:
Inductance
100KHz, 1V
uH±20%
0.22
0.47
0.68
1.00
1.50
2.20
3.30
4.70
6.80
10.0
15.0
Rated
Current
A
50.0
34.0
31.0
27.0
22.0
15.5
14.0
12.5
11.0
9.0
8.2
DC
Resistance
MAX.
mΩ
0.61
0.9
1.55
1.9
3.8
4.8
7.0
10.2
16.0
22.0
36.0
TYP.
mΩ
0.50
0.77
1.3
1.6
3.2
4.0
6.0
8.8
13.0
19.2
30.0
Saturation
Current
Max.
A
60
58.0
42.0
34.0
28.0
23.0
20.5
16.0
15.0
10.5
9.2
Mechanical
Footprint 1
Footprint 1
Footprint 1
Footprint 1
Footprint 2
Footprint 2
Footprint 2
Footprint 2
Footprint 2
Footprint 2
Footprint 2
1. Actual temperature of the component during system operation (ambient plus tempera- 3.
ture rise) must be within the standard operating range.
2. The saturation current is the current at which the initial inductance drops approximately
30% at the stated ambient temperature. This current is determined by placing the com-
ponent in the specified ambient environment and applying a short duration pulse cur- 4.
rent (to eliminate self-heating effect) to the component.
The rated current is the DC current required to raise the component temperature by
approximately 40½C. Take note that the components’ performanc varies depending on the
system condition. It is suggested that the component be tested at the system level, to
verify the temperature rise of the component during system operation.
The part temperature (ambient+temp rise) should not exceed 155½C under worst case
operating conditions. Circuit design, PCB trace size and thickness, airflow and other cool-
ing provisions all affect the part temperature. Part temperature should be verified in the
end application.
1
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P797.B (09/17)
http://www.power.pulseelectronics.com/contact
SMT Power Inductor
High Current Molded Power Inductor - PA4346.XXXANLT Series
Mechanical
PA4346.XXXANLT
A
C
D
B
E
Footprint 1
A
C
D
L
B
E
G
Footprint 2
Final Layout
Series
PA4346.XXXANLT
Mechanical
Footprint 1
A
13.5
±
0.5
13.5
±
0.5
B
12.6
±
0.2
12.6
±
0.2
C
4.7
±
0.3
4.7
±
0.3
D
2.3
±
0.3
2.3
±
0.3
E
4.0
±
0.3
4.7
±
0.3
SUGGESTED PAD LAYOUT
L
14.5
14.5
G
8.0
8.0
H
5.0
5.0
PA4346.XXXANLT
Footprint 2
All Dimensions in mm.
TAPE & REEL INFO
Blank portions
Chip cavity
Blank portions
W
K
0
P
1
200mm or more
400mm or more
A
Direction of tape
SURFACE MOUNTING TYPE, REEL/TAPE LIST
FYPE
PA4346.XXXANLT
REEL SIZE (mm)
A
Ø330
G
24.4
P
1
16
TAPE SIZE (mm)
W
24
K
0
5.5
QTY
PCS/REEL
500
2
power.pulseelectronics.com
P797.B (09/17)
http://www.power.pulseelectronics.com/contact
H
G
SMT Power Inductor
High Current Molded Power Inductor - PA4346.XXXANLT Series
Typical Performance Curves
3
power.pulseelectronics.com
P797.B (09/17)
http://www.power.pulseelectronics.com/contact
SMT Power Inductor
High Current Molded Power Inductor - PA4346.XXXANLT Series
For More Information
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Headquarters
Pulse Electronics GmbH
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U.S.A.
Germany
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D708, Shenzhen Academy of
Aerospace Technology,
The 10th Keji South Road,
Nanshan District, Shenzhen,
P.R. China 518057
Tel: 86 755 33966678
Fax: 86 755 33966700
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Shanghai 200336
China
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#03-02
PM Industrial Bldg.
Singapore 368363
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1F., No.111 Xiyuan Rd
Zhongli City
Taoyuan City 32057
Taiwan (R.O.C)
Tel: 858 674 8100
Fax: 858 674 8262
Tel: 49 2354 777 100
Fax: 49 2354 777 168
Tel: 65 6287 8998
Fax: 65 6280 0080
Tel: 886 3 4356768
Fax: 886 3 4356820
Performance warranty of products offered on this data sheet is limited to the parameters specified. Data is subject to change without notice. Other brand and product names mentioned herein may
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