C 091 B
Characteristics
Standard
Characteristics
3
2
1
3
1
General Characteristics
Number of contacts
View on termination side
of male contact insert
Contact arrangement
Contact arrangement
Electrical Characteristics
Rated voltage
Rated voltage
Pollution degree
Installation category
Insulation group
Current rating
Insulation resistance
Contact resistance
Climatic Characteristics
Climatic category
Temperature range
Mechanical Characteristics
IP-degree
4
2 3
2
4
1
5
3
4
5
5 Stereo
4
1
2
5
3
3
2
1
6
4
6
5
5
6
7
4
7
1
3
2
7
4
1
6
7
2
5
3
4
1
8
G
12
E
F
14
E
F
G
D C
2
6
8
7
5
3
DC
L
O N
M
K
H J
M
K
H J
L
A
B
B
A
DIN EN
61076-2-106
IEC 60130-9
1)
IEC 60664-1
UL 1977
03-a
04-a
05-a
05-b
06-a
07-a
07-b
08-a
12-a
14-a
300 V ≃
1500 V
100 V ≃
250 V
1200 V
300 V ≃
1500 V
1
I
II, 400 ≤ CTI < 600
150 V ≃
60 V
1200 V
Rated impulse withstand voltage IEC 60664-1
IEC 60664-1
IEC 60664-1
IEC 60664-1
IEC 60512-5-2
UL 1977
IEC 60512-3-1
IEC 60512-2-1
IEC 60668-1
IEC 60668-1
IEC 60529
25 N
90.oz
5 A / + 40 °C / + 104 °F
please refer also to current derating curves page 59
> 10
10
Ω
2)
<5mΩ
40 / 100 / 56
- 40 °C ... + 100 °C / - 40 °F ... + 212 °F
IP 40
30 N
110.oz
35 N
125.oz
50 N
180.oz
55 N
200.oz
60 N
220.oz
3 A / + 40 °C /
+ 104 °F
Insertion and withdrawal forces IEC 60512-13-2
Mechanical operation
Materials
Housing material
Dielectric material
Contact plating
Further Characteristics
Termination technique
Wire gauge
IEC 60512-9-1
50 N
180.oz
Silver ≥ 500 mating cycles
Gold ≥ 1000 mating cycles
die cast, nickel plated
thermoplastic
silver plated / gold plated
3)
solder, crimp
solder: ≤ 0,5 mm
2
/ 20 AWG
crimp: 2 - 6 pol (excluding 5S): 0,09 - 1,00 mm
2
/ 28 - 18 AWG
crimp: 5S, 7, 7S and 8-pol.: 0,09 - 0,75 mm
2
/ 28 - 20 AWG
UL 94 V0
bayonet
solder: ≤ 0,25 mm² /
24 AWG
crimp: 0,09-0,25 mm²
/ 28 – 24 AWG
Flammability
Locking system
Caution:
Do not connect or disconnect under load. Metal housing parts shall be securely incorporated to protected ground.
1)
Edition 2000-05
2)
under operating conditions >10
8
Ω
3)
Remark for gold plated contacts: In order to avoid brittle inter-metallic connections, gold-plated terminals have to be tin-plated in the solder area.
IEC 60 664 ^ DIN VDE 0110; IEC 60 512-x ^ DIN EN 60 512-x; IEC 60 130-9 ^ DIN EN 60 130-9; IEC 61076-2-106 ^ DIN EN 61076-2-106
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25
NXP MCU
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