®
2220-VF
VOC-Free Organic Water-Soluble Liquid Flux
For Lead-bearing and Lead-free alloys
Product Description
Kester 2220-VF is a high activity, organic flux
designed for lead-free automated wave solder
applications. The flux will provide maximum
capillary wetting action up plated through-holes,
making it ideal for use on multilayer boards. Along
with this enhanced activity, 2220-VF flux produces
bright, shiny solder joints and the residue after
soldering is effectively removed in standard water
cleaning systems.
2220-VF is free of volatile organic compounds
(VOC’s), which provides optimal heat stability for
the
lead-free wave soldering process. The use
of VOC-Free solvents eliminates the use of ozone
depleting chemicals which results in an
environmentally friendly process.
Physical Properties
Specific Gravity:
1.060 ± 0.003
Antoine Paar DMA 35 @ 25°C
Percent Solids (typical):
7
Tested to J-STD-004, IPC-TM-650, Method 2.3.34
Thinner:
DI Water
Reliability Properties
Copper Mirror Corrosion:
High
Tested to J-STD-004, IPC-TM-650, Method 2.3.32
Corrosion Test:
High
Tested to J-STD-004, IPC-TM-650, Method 2.6.15
Silver Chromate:
Fail
Tested to J-STD-004, IPC-TM-650, Method 2.3.33
Performance Characteristics:
• Thermally Stable and VOC-Free to allow for
effective high temperature soldering
• High activity
• Minimizes icicling and bridging
• Chemically compatible with most solder masks
and board laminates
• High ionic cleanliness and no surface insulation
resistance degradation
• Compatible with leaded and lead-free wave
soldering applications
• Classified as ORH1 per J-STD-004
Chloride and Bromides:
2.4% ± 0.24%
Tested to J-STD-004, IPC-TM-650, Method 2.3.35
Fluorides by Spot Test:
Pass
Tested to J-STD-004, IPC-TM-650, Method 2.3.35.1
SIR, IPC (typical):
Pass
Tested to J-STD-004, IPC-TM-650, Method 2.6.3.3
Blank
Day 1
Day 4
Day 7
2220-VF
RoHS Compliance
This product meets the requirements of the RoHS
(Restriction of Hazardous Substances) Directive,
2002/95/EC Article 4 for the stated banned
substances.
9.5
´10
9
W
8.3
´10
9
W
8.4
´10
9
W
6.0
´
10
8
W
7.8
´
10
8
W
1.0
´
10
9
W
Application Notes
Flux Application:
2220-VF
Kester 2220-VF can be applied to circuit boards by a spray, dip, foam or wave process. An air knife after
the flux tank is recommended to remove excess flux from the circuit board and prevent dripping on the
preheater surface.
Process Considerations:
The optimum preheat temperature for most circuit assemblies is 104-116°C (220-240°F) as measured on the
top or component side of the printed circuit board. Dwell time in the wave is typically 2-4 seconds. The wave
soldering speed should be adjusted to accomplish proper preheating and evaporate excess solvent, which
could cause spattering. For best results, speeds of 1.1-1.8 m/min (3½-6 ft/min) are used. The surface tension
has been adjusted to help the flux form a thin film on the board surface allowing rapid solvent evaporation.
Elimination of Splattering:
Since VOC-free fluxes are water-based, splattering can be a problem. Splattering occurs when water comes
in contact with molten solder, so it may be necessary to use forced air to drive off the water. Manufacturers
have reported that blowing hot air at 0.28-0.85 m
3
/hr (10-30 ft
3
/hr) greatly assists in drying the water off the
circuit boards.
Flux Control:
Specific gravity is normally the most reliable method to control the flux concentration. To check concentration,
a hydrometer should be used. Control of the flux in the foam flux tank during use is necessary for assurance
of consistent flux distribution on the circuit boards. DI water can be used to replace evaporative losses.
When excessive debris from circuit boards, such as board fibers and from the air line build up in the flux tank,
these particulates will redeposit on the circuit boards which may create a build up of residues on probe test
pins. It is, therefore, necessary to clean the tank and then replenish it with fresh flux when excessive debris
accumulates in the flux tank.
Cleaning:
No neutralizer, saponifiers or detergents are necessary in the water wash system for complete removal of
flux residues. It is not recommended to use high mineral content tap water. Otherwise, tap, deionized or
softened water may be used for cleaning. The optimum water temperature is 49-60°C (120-140°F), although
lower temperatures may be sufficient.
Storage and Shelf Life:
Because this formulation is water based, it is subject to freezing. A minimum storage temperature of 4°C
(40°F) is recommended. If frozen, the Kester 2220-VF is easily reconstituted by stirring at room temperature.
Shelf life is 1 year from date of manufacture when handled properly and held at 4-25°C (40-77°F).
Health & Safety:
This product, during handling or use, may be hazardous to health or the environment. Read the Material
Safety Data Sheet and warning label before using this product.
World Headquarters:800
W. Thorndale Avenue, Itasca, Illinois, 60143 USA
Phone:
(+1) 630-616-4000 •
Email:
customerservice@kester.com •
Website:
www.kester.com
Asia Pacific Headquarters
500 Chai Chee Lane
Singapore 469024
(+65) 6449-1133
customerservice@kester.com.sg
European Headquarters
Zum Plom 5
08541 Neuensalz
Germany
(+49) 3741 4233-0
customerservice@kester-eu.com
Japanese Headquarters
20-11 Yokokawa 2-Chome
Sumida-Ku
Tokyo 130-0003 Japan
(+81) 3-3624-5351
jpsales@kester.com.sg
The data recommendations presented are based on tests, which we consider reliable. Because Kester has no control over the conditions of use, we disclaim any responsibility connected with the
use of any of our products or the information presented. We advise that all chemical products be used only by or under the direction of technically qualified personnel who are aware of the poten-
tial hazards involved and the necessity for reasonable care in their handling. The technical information contained herein is consistent with the properties of this material but should not be used in
the preparation of specifications as it is intended for reference only. For assistance in preparing specifications, please contact your local Kester office for details.
Rev: 04Jun07
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