conga-TFS
-
Power efficient high-performance x86 processing
-
Unprecedented integrated graphics performance
-
High performance parallel processing support
Formfactor
CPU
COM Express
™
Basic | (95 x 125 mm) | Type 6 Connector Layout
AMD Embedded R-464L
AMD Embedded R-460H
AMD Embedded R-272F
AMD Radeon
™
HD 7660G
Graphics
AMD Radeon
™
HD 7640G
Graphics
AMD Radeon
™
HD 7520G
Graphics
Quad-Core 2.3
Quad-Core 1.9
Dual-Core 2.7
3.2 GHz
2.8 GHz
3.2 GHz
TDP 35 W
TDP 35 W
TDP 35 W
PGA
PGA
PGA
AMD Embedded R-Series processors
DRAM
Chipset
Ethernet
I/O Interfaces
Sound
Graphics
LVDS
DisplayPort
HDMI or DVI
VGA
congatec Board Controller
Embedded BIOS Features
Security
Two 1.5V/1.35V DDR3 SO-DIMMs up to 1600MT/s and 8 GByte
AMD A70M Controller Hub
Realtek RTL8111E GbE LAN Controller
7x PCI Express
™
2.0 lane | PCI Express
™
2.0 x8 link | 4x SATA 6Gb/s with RAID 0/1 | 4x USB 3.0 | 8x USB 2.0 | 2x Express
™
Card | LPC bus | SDHC
| I²C bus
High Definition Audio Interface
High performance DirectX
®
11 GPU supports OpenCL
™
1.1 and OpenGL 4.2 | Three Independent Display Controllers | Dedicated Hardware (UVD) for
H.264 MPEG4 Part 2 VC-1 and MPEG2 decode | Dedicated Hardware (VCE) assisted encoding of HD video streams to H.264
18/24-bit Single/Dual Channel Interface | resolutions up to 1920X1200@60Hz | VESA standard or JEIDA data mapping | Automatic Panel Detection
via EDID/EPI
Three DisplayPort 1.2
Two Ports support one HDMI1.4a and two Single-Link DVI
One Port supports resolutions up to 1920x1200@60Hz
Multi Stage Watchdog | non-volatile User Data Storage | Manufacturing and Board Information | Board Statistics | BIOS Setup Data Backup | I2C
bus | Power Loss Controll
AMI Aptio
®
UEFI firmware
The conga-TFS can be optionally equipped with a discrete ”Trusted Platform Module” (TPM). It is capable of calculating efficient hash and
RSA algorithms with key lengths up to 2,048 bits and includes a real random number generator. Security sensitive applications such as gaming and
e-commerce will benefit also with improved authentication | integrity and confidence levels.
ACPI 3.0 with battery support
Microsoft
®
Windows 8 | Microsoft
®
Windows 7 | Linux | Microsoft
®
Windows
®
embedded Standard
Typ. application: tbd. | see manual for full details | CMOS Battery Backup
Operating: 0 .. +60°C | Storage: -20 .. +80°C
Operating: 10 - 90% r. H. non cond. | Storage: 5 - 95% r. H. non cond.
95 x 125 mm (3.74” x 4.92”)
Power Management
Operating Systems
Power Consumption
Temperature
Humidity
Size
www.congatec.com
conga-TFS
| Block diagram
A-B
PCIe Lanes 0, 1, 2, 3
LVDS
DDR3-SODIMM
Socket (top)
RTL8111GN
GPIOs / SDIO
Fan Control
8x USB 2.0
(Optional)
TPM
PCIe Lanes 4, 5
PCIe GbE
LPC Bus
4x SATA
SM Bus
Analogix
ANX3110
DDR3-SODIMM
Socket (bottom)
HDA
PCIe
VGA
I2C
DP0
Memory Bus
(DDR3-1600MT/s)
Watchdog
congatec
Board Controller
STM32F100R8
BC SPI
AMD A70M
Controller Hub
RTC
DP1 (to CRT)
UMI x4
AMD Embedded
R-Series APU
See the user’s guide for independent display configuration
DDI1 (DP2 or HDMI/DVI)
DDI2 (DP3 or HDMI/DVI)
PCIe Lane 6
4x USB 3.0
BIOS
Flash
C-D
conga-TFS
| Order Information
Article
conga-TFS/R-464L
conga-TFS/R-460H
conga-TFS/R-272F
conga-TFS/HSP-B
conga-TFS/HSP-T
conga-TFS/CSA-B
PN
041101
041102
041103
041150
041151
041154
Description
AMD embedded R-Series R-464L quad core processor with 2.3GHz | 2x2MB L2 cache and 1600MT/s DDR3 SODIMM memory
interface for up to 16GB
AMD embedded R-Series R-460H quad core processor with 1.9GHz | 2x2MB L2 cache and 1600MT/s DDR3 SODIMM memory
interface for up to 16GB
AMD embedded R-Series R-272F dual core processor with 2.7GHz | 1MB L2 cache and 1600MT/s DDR3 SODIMM memory
interface for up to 16GB
Standard heatspreader for high performance COM Express module conga-TFS with integrated flat heat pipe. All standoffs are
with 2.7mm bore hole
Standard heatspreader for high performance COM Express module conga-TFS with integrated flat heat pipe. All standoffs are
M2.5mm thread
Standard active cooling solution for high performance COM Express module conga-TFS with integrated flat heat pipe | 15mm
fins
20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole
Standard active cooling solution for high performance COM Express module conga-TFS with integrated flat heat pipe | 15mm
fins
20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 2GB RAM
DDR3L SODIMM memory module with 1600 MT/s (PC3L-12800S) and 4GB RAM
conga-TFS/CSA-T
041155
DDR3L-SODIMM-1600 (2GB)
DDR3L-SODIMM-1600 (4GB)
068755
068756
Accessories
conga-TEVAL
conga-Cdebug
conga-LDVI/EPI
conga-HDMI/Display Port adapter 4k
065800
047854
011115
500030
Evaluation carrier board for Type 6 COM-Express-modules
COM-Express debugging platform | Including cable for COM | PS/2 and VGA.
LVDS to DVI converter board for digital flat panels with onboard EEPROM
The conga-DP/HDMI adapter 4k is used for evlauation of the DP/HDMI graphics interface of x86 Qseven and COM Express
modules in combination with the congatec evaluation carrier boards conga-QEVAL and conga-TEVAL. It supports full 4k display
resolution.
Connector for COM-Express carrier boards | height 5mm | packing unit 4 pieces
Connector for COM-Express carrier boards | height 8mm | packing unit 4 pieces
COM-Express-carrierboard-Socket-5
COM-Express-carrierboard-Socket-8
400007
400004
© 2016 congatec AG. All rights reserved.
All data is for information purposes only. Although all the information contained within this document is carefully checked, no guarantee
of correctness is implied or expressed. Product names, logos, brands, and other trademarks featured or referred are the property of their
respective trademark holders. These trademark holders are not affiliated with congatec AG. Rev. July 05, 2018 WME
DDI3 (DP4 or HDMI/DVI)
SPI
PEG x8
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