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SEI-130-02-G-S-AB

产品描述板对板与夹层连接器 1.00 mm Single Row One-Piece Interface
产品类别连接器    连接器   
文件大小582KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
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SEI-130-02-G-S-AB概述

板对板与夹层连接器 1.00 mm Single Row One-Piece Interface

SEI-130-02-G-S-AB规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称SAMTEC
包装说明ROHS COMPLIANT
Reach Compliance Codenot_compliant
连接器类型CARD EDGE CONNECTOR
联系完成配合GOLD (10) OVER NICKEL (50)
联系完成终止GOLD (10) OVER NICKEL (50)
触点性别MALE
触点材料PHOSPHOR BRONZE
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e4
MIL 符合性NO
制造商序列号SEI
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数1
选件GENERAL PURPOSE
端子节距1 mm
端接类型SURFACE MOUNT
触点总数30

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F-219
SEI–110–02–GF–S–E–TR
SEI–120–02–GF–S
SIBF–05–F–S–AD
(1.00 mm) .0394"
(SEI)
(1.27 mm) .050"
(SIBF)
SIBF–10–F–S–AD
SIBF–25–F–S–AD
SEI, SIBF SERIES
ONE-PIECE INTERFACE
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?SEI or
see www.samtec.com?SIBF
Insulator Material:
SEI = Liquid Crystal Polymer
SIBF = Black Liquid
Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
SEI = Au over
50 µ" (1.27 µm) Ni
SIBF = Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
SEI = 2.3 A per pin
(1 pin powered)
SIBF = 2.5 A per pin
(1 pin powered)
Operating Temp Range:
-55 °C to +125 °C
Mating Force:
SEI = 50 g (0.49 N) per contact
Voltage Rating:
SEI = 250 VAC
SIBF = 155 VAC
Cycles:
SEI = 100 min
Contact Deflection:
SEI = (0.46 mm) .018" nominal
RoHS Compliant:
Yes
SEI
NO. OF
1
POSITIONS
02
PLATING
OPTION
S
INSERT
OPTION
Leave blank
for Short
Version
(No screw
down inserts
or holes)
ALIGNMENT
OPTION
Leave blank for
no Alignment Pin
OTHER
OPTION
05, 10, 15,
20, 25, 30
(Standard sizes)
= 10 µ" (0.25 µm) Gold
–G
= 3 µ" (0.08 µm) Gold flash
–GF
= Alignment Pin
Top Side
–AT
= Tape &
Reel
–TR
No. of positions x
(1.00) .03937 + (0.41) .016
(6.10) (4.95)
.240 .195
01
= #2-56 x 1/16"
screw thread
–E
= Alignment Pin
Bottom Side
–AB
(0.89)
.035
DIA
SHORT VERSION
(1.65)
.065
(0.31) .012
(1.27)
.050
(0.15) .006 (0.46)
.018
= 2.00 mm
x 0.40 mm
screw thread
–M
(1.27)
.050
(4.32)
.170
(0.89)
.035 DIA
– AB OPTION
(4.32)
.170
(1.27)
.050
((No. of positions-1) x
(1.00) .03937) + (7.62) .300
– AT OPTION
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity (SEI):
(0.10 mm) .004" max (05-25)
(0.15 mm) .006" max (30)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
SMT Lead Coplanarity (SIBF):
(0.10 mm) .004" max (05-20)
(0.15 mm) .006" max (25)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
(3.43)
.135
INSERT OPTIONS
Threaded
Insert (2)
• Threaded
insert
option
SIBF
NO. OF
POSITIONS
PLATING
OPTION
S
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
–05, –10, –20, –25
No. of positions x
(1.27) .050 + (0.43) .017
(6.25)
.246
(1.27)
.050
= Flash Gold,
Matte Tin on tail
–F
= Top & Bottom Alignment Pin
–AD
(7.50)
.295
ALSO AVAILABLE
(MOQ Required)
• Additional positions
• Top or bottom side only alignment pin
(0.70)
.028
(3.00)
.118
No. of positions
x (1.27) .050
- (3.81) .150
(4.00)
.158
(1.00)
.040
–AD OPTION
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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