电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

TW-23-03-F-S-120-120

产品描述板对板与夹层连接器 2.00 mm Flex Stack, Flexible Board Stacker, Surface Mount
产品类别连接器    板对板与夹层连接器   
文件大小949KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

TW-23-03-F-S-120-120在线购买

供应商 器件名称 价格 最低购买 库存  
TW-23-03-F-S-120-120 - - 点击查看 点击购买

TW-23-03-F-S-120-120概述

板对板与夹层连接器 2.00 mm Flex Stack, Flexible Board Stacker, Surface Mount

TW-23-03-F-S-120-120规格参数

参数名称属性值
厂商名称SAMTEC
产品种类板对板与夹层连接器
发货限制Mouser目前不销售该产品。
产品Connectors
位置数量23 Position
节距2 mm
排数1 Row
端接类型Through Hole
安装角Vertical
电流额定值5.2 A
系列TW
封装Bulk
应用Elevated Board Staking
触点电镀Gold
外壳材料Liquid Crystal Polymer (LCP)
触点材料Phosphor Bronze
可燃性等级UL 94 V-0
安装风格Straight Pin
最大工作温度+ 125 C
最小工作温度- 55 C
叠放高度3.05 mm
工厂包装数量1
端接柱长度1.27 mm

文档预览

下载PDF文档
F-219
TW–25–02–F–S–260–SM
TW–10–04–L–D–300–SM
(2.00 mm) .0787"
TW–20–07–T–D–550–SM
TW SERIES
SMT BOARD STACKERS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?TW-SM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating:
4.9 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +105 °C with Tin;
-55 °C to +125 °C with Gold
RoHS Compliant:
Yes
Board Mates:
CLT, SQT, SQW, ESQT,
TLE, SMM, MMS
Cable Mates:
TCSD
Available with
optional
pick & place
pads
OTHER SOLUTIONS
• Stacker height
ranges and standard
part numbers on
double row.
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.15 mm) .006" max*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
(2.00 mm)
.0787" pitch
Available
with optional
alignment pins
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
TW
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
below.
(2.00)
.0787
PLATING
OPTION
ROW
OPTION
STACKER
HEIGHT
SM
OTHER
OPTIONS
02 thru 36
FILE NO. E111594
= Gold flash
on post,
Matte Tin
on tail
–F
= Single
Row
–S
–“XXX”
= Stacker
Height
in inches
(0.13 mm)
.005"
increments
= Polarized Position
–“XXX”
–A
No. of positions
x (2.00) .0787
= 10 µ"
(0.25 µm)
Gold on post,
Matte Tin
on tail
–L
= Double
Row
–D
Example:
–250
= (6.35 mm)
.250"
= Alignment Pin
(Metal or plastic
at Samtec discretion)
(4.83 mm) .190" min.
board space
(–D only)
ALSO AVAILABLE
(MOQ Required)
• Other Platings
• End shrouds with or
without guide post
36
(2.00)
02
.0787
01
72
= Matte Tin
(4.00)
.1574
–T
A
(5.33)
.210
ROW
OPTION
= Pick & Place Pad
(1.91 mm) .075" min.
post height
(04-36 only)
–P
A
(5.08) .200
(6.35) .250
01
(1.27) .050 TYP
(0.00)
(0.51)
.000 MIN
.020 SQ
STACKER
HEIGHT OAL
(4.32)
.170
MIN
71
LEAD
STYLE
OAL
(7.85) .309
(11.86) .467
(12.37) .487
(15.37) .605
(17.35) .683
(9.86) .388
–S
–D
Notes:
For added mechanical
stability, Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
This Series is non-standard,
non-returnable.
–02
–03
–04
–06
–07
–09
–P OPTION
= Tape & Reel
Packaging
(–07 lead style
not available)
(–06 lead style with
–P option not available
as a standard)
–TR
(1.27)
.050
(1.09)
.043
DIA
(1.50)
.059
(2.00)
.0787
–A OPTION
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
跟夏老师学FPGA(9)verilog模块的基本构成要素
http://www.tudou.com/v/Fgq6EkYdWro/v.swf...
soso FPGA/CPLD
[请教]关于STM32F107的OTG开发
在F107上,个人打算使用OTG下host模式完成U盘的读写操作 目前有几个问题想请教大家: 1. STM32仅仅提供了OTG操作的库函数,关于OTG的上层协议没有任何的涉及对吧?提供的demo还是bin ......
drlin stm32/stm8
vxworks下的u盘问题
我目前在做vxworks下的u盘数据采集,请问:在工程中包含usb组件后,怎样在应用程序中实现对u盘的控制呢?这需不需要涉及到接口芯片的固件编程?...
xiaolu192 实时操作系统RTOS
找工作的迷惑
大家好,我马上就要开始找工作了,现在有个疑惑想请教大伙,我对单片机和嵌入式很感兴趣,大学里也自学了好多相关的知识,但是现在来招聘的公司似乎和我所学的有点出入,我不是很想放弃学了这 ......
牛肉拉面314 stm32/stm8
有人用zic2410或其模块吗?本人创建了一个QQ群:222013663验证码:zic123
有人用zic2410或其模块吗?本人创建了一个QQ群:222013663验证码:zic123,欢迎大家加入。 本帖最后由 cnsxgh 于 2012-3-19 17:52 编辑 ]...
cnsxgh 无线连接
关于放大倍数与单位增益带宽Fc问题
本帖最后由 dontium 于 2015-1-23 12:50 编辑 求大神谈谈心得。。。 关于这个问题发表下自己的意见 为什么运放放大倍数大了,单位增益带宽会下来 ...
zenghao616 模拟与混合信号

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2674  245  2304  1906  2688  15  8  50  51  6 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved