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SEAF8-40-1-S-08-2-RA

产品描述板对板与夹层连接器 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket
产品类别连接器    板对板与夹层连接器   
文件大小1MB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
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SEAF8-40-1-S-08-2-RA概述

板对板与夹层连接器 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Socket

SEAF8-40-1-S-08-2-RA规格参数

参数名称属性值
厂商名称SAMTEC
产品种类板对板与夹层连接器
发货限制Mouser目前不销售该产品。
产品Connectors
位置数量320 Position
节距0.8 mm
排数8 Row
端接类型SMD/SMT
安装角Right Angle
电流额定值1.3 A
电压额定值220 VAC
系列SEAF8
封装Reel
应用Power, Signal
触点电镀Gold
外壳材料Liquid Crystal Polymer (LCP)
触点材料Copper Alloy
安装风格SMD
最大工作温度+ 125 C
最小工作温度- 55 C
工厂包装数量100

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F-219
SEAF8–50–05.0–S–10–2–K
SEAF8–30–05.0–S–04–2–K
(0.80 mm) .0315"
SEAF8 SERIES
ULTRA-HIGH DENSITY OPEN-PIN-FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAF8
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Current Rating:
1.3 A per pin
(10 adjacent pins powered)
Working Voltage:
220 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Board Mates:
SEAM8
Cable Mates:
ESCA
Standoffs:
JSO
Signal Integrity optimized
Edge Rate
®
contact
Lead-Free
solder charge
terminations
POWER/SIGNAL
APPLICATION
7 mm and 10 mm
stack heights
4, 6, 8 and
10 rows
Up to 500 I/Os
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
HIGH-SPEED CHANNEL PERFORMANCE
SEAM8/SEAF8 @ 7 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data
visit Samtec.com or contact
SIG@samtec.com
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
SEAF8
NO. PINS
PER ROW
05.0
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
K
= Polyimide
film Pick &
Place Pad
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Other pin counts
–10, – 20, – 30, –40, –50
(Standard sizes)
= 10 µ"
(0.25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–L
=Four Rows
– 04
– 06
– 08
– 10
= Lead-Free
Solder Charge
–2
–K
=Six Rows
MATED HEIGHT*
SEAF8
LEAD
STYLE
SEAM8 LEAD STYLE
–S02.0
–S05.0
(10.00) .394
–05.0
(7.00) .276
= 30 µ"
(0.76 µm)
Gold on
contact area,
Matte Tin on
solder tail
–S
=Eight Rows
=Ten Rows
*Processing conditions will affect
mated height.
NO. OF
ROWS
–04
A
(4.30)
.169
(6.30)
.248
(8.30)
.327
(10.30)
.406
No. of positions x
(0.80) .0315 + (5.84) .230
(0.75)
.029
06
–06
–08
A
01
–10
(1.27)
.050
Notes:
Patent Pending
Tape & Reel packaging
is standard.
Some sizes, styles and
options are non-standard,
non-returnable.
(4.57)
.180
(1.10) (1.32)
(1.32)
.043 x .052
.052 DIA
No. of positions x
(0.80) .0315 + (2.56) .101
(2.87)
.113
(0.80)
.0315
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

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