电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C1812X185K5RACTU

产品描述多层陶瓷电容器MLCC - SMD/SMT 50volts 1.8uF 10% X7R
产品类别无源元件    电容器    陶瓷电容器    MLCC - 多层陶瓷电容器    多层陶瓷电容器MLCC - SMD/SMT   
文件大小1MB,共25页
制造商KEMET(基美)
官网地址http://www.kemet.com
标准
下载文档 详细参数 全文预览

C1812X185K5RACTU在线购买

供应商 器件名称 价格 最低购买 库存  
C1812X185K5RACTU - - 点击查看 点击购买

C1812X185K5RACTU概述

多层陶瓷电容器MLCC - SMD/SMT 50volts 1.8uF 10% X7R

C1812X185K5RACTU规格参数

参数名称属性值
厂商名称KEMET(基美)
产品种类多层陶瓷电容器MLCC - SMD/SMT
发货限制Mouser目前不销售该产品。
终端Flexible (Soft)
电容1.8 uF
电压额定值 DC50 VDC
电介质X7R
容差10 %
外壳代码 - in1812
外壳代码 - mm4532
高度1.3 mm
最小工作温度- 55 C
最大工作温度+ 125 C
产品General Type MLCCs
端接类型SMD/SMT
系列SMD Comm X7R Flex
封装Cut Tape
封装MouseReel
封装Reel
长度4.5 mm
封装 / 箱体1812 (4532 metric)
宽度3.2 mm
电容-nF1800 nF
Class 2
工厂包装数量1000

文档预览

下载PDF文档
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric,
6.3 – 250 VDC (Commercial Grade)
Overview
The KEMET Flexible Termination (FT-CAP) multilayer
ceramic capacitor in X7R dielectric incorporates a unique,
flexible termination system that is integrated with the
KEMET standard termination materials. A conductive silver
epoxy is utilized between the base metal and nickel barrier
layers of KEMET’s standard termination system in order
to establish pliability, while maintaining terminal strength,
solderability and electrical performance. This technology
was developed in order to address the primary failure
mode of MLCCs – flex cracks, which are typically the result
of excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the rigid
ceramic body, therefore mitigating flex cracks which can
result in low IR or short circuit failures.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide
superior flex performance over standard termination
systems. FT-CAP complements the KEMET Open Mode,
Floating Electrode (FE-CAP), Floating Electrode with
Flexible Termination (FF-CAP) and KEMET Power Solutions
Click image above for interactive 3D content
(KPS) product lines by providing a complete portfolio of flex
mitigation solutions.
Combined with the stability of an X7R dielectric and designed
to accommodate all capacitance requirements, these flex-
robust devices are RoHS-compliant, offer up to 5 mm of
flex-bend capability and exhibit a predictable change in
capacitance with respect to time and voltage. Capacitance
change with reference to ambient temperature is limited to
±15% from −55°C to +125°C.
In addition to commercial grade, automotive grade devices
are available which meet the demanding Automotive
Electronics Council's AEC–Q200 qualification requirements.
Ordering Information
C
1206
X
106
Capacitance
Code (pF)
Two
significant
digits and
number of
zeros
Open PDF in Adobe Reader for full functionality
K
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
4
R
A
C
Termination Finish
1
TU
Packaging/Grade
(C-Spec)
2
Case Size
Specification/
Ceramic
(L" x W")
Series
0603
0805
1206
1210
1808
1812
1825
2220
2225
1
Rated
Failure
Voltage
Dielectric Rate/
(VDC)
Design
9 = 6.3
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
R = X7R
X = Flexible
termination
A = N/A C = 100% Matte Sn
See "Packaging
L = SnPb (5% Pb minimum)
C-Spec
Ordering
Options Table"
Additional termination finish options may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 5/3/2019
1
ARM+WinCE6.0不能同时使用2个USB设备问题?
友善Micro2440板子单独接入CDMA 3G USB接口的上网模块好使,单独接入USB Wifi无线网卡也好使, 但同时使用两样,后接入的设备就无法识别,如果在同时接两样设备重启的话就会出现那个启动慢那个 ......
guanliheng 嵌入式系统
【2022得捷创新设计大赛】物料开箱STM32F7508-DK
非常荣幸参加并入围了2022年得捷创新设计大赛,感谢EEWORLD网站与得捷电子为广大电子工程师提供了一个展示自己技能的平台,也非常感谢得捷能提供丰富的物料清单供大家选择。本人此次参加的设计 ......
小米渣 DigiKey得捷技术专区
请在CE下用过SQLite的兄弟们看一下.关于发布SQLite的问题.都要做哪些准备工作啊?
小弟是第一次接触CE的东西.请大家帮帮忙. 程序代码如下,在WinForm的工程下可以运行.我就把代码复制到WINCE下的项目里了. 也添加了引用. 编译成功后,我将exe文件 数据库 和SQLite3.dll 一起复 ......
w_ujie 产业风云
关于rom.h文件的问题
我在写初始化的一些函数,但是编译的时候提示ROM_XXXXX这些函数未声明。Error: no definition for "ROM_GPIOPinTypeUART" rom.h文件已经加进去了,但是后来发现好像是条件编译的问题。文件 ......
ultrabenz 微控制器 MCU
帮我找错!
#include char count,a,b,c=0x7e; intial_timer0(); main() { a=0x80; b=0x01; intial_timer0(); while(1) { P0=c; } } intial_timer0() { TMOD= ......
alvin2263 单片机

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1986  917  2414  2558  2425  55  50  54  7  51 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved