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QTS-050-01-F-D-RA-WT-SP

产品描述板对板与夹层连接器 0.635 mm Q Strip High-Speed Ground Plane Terminal Strip
产品类别连接器    连接器   
文件大小939KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
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QTS-050-01-F-D-RA-WT-SP概述

板对板与夹层连接器 0.635 mm Q Strip High-Speed Ground Plane Terminal Strip

QTS-050-01-F-D-RA-WT-SP规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称SAMTEC
包装说明ROHS COMPLIANT
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time2 weeks
板上安装选件SOLDER HOLDING POSTS
主体宽度0.371 inch
连接器类型BOARD CONNECTOR
联系完成配合GOLD
联系完成终止Matte Tin (Sn)
触点性别MALE
触点材料PHOSPHOR BRONZE
触点模式RECTANGULAR
触点电阻15 mΩ
触点样式BELLOWED TYPE
DIN 符合性NO
介电耐压825VAC V
滤波功能NO
IEC 符合性NO
绝缘电阻15000000000 Ω
绝缘体材料LIQUID CRYSTAL POLYMER (LCP)
JESD-609代码e3
MIL 符合性NO
插接触点节距0.025 inch
插接信息MULTIPLE MATING PARTS AVAILABLE
混合触点NO
安装选项1LOCKING
安装方式RIGHT ANGLE
安装类型BOARD
连接器数ONE
装载的行数2
最高工作温度125 °C
最低工作温度-55 °C
选件GENERAL PURPOSE
电镀厚度FLASH inch
极化密钥POLARIZED HOUSING
额定电流(信号)2 A
可靠性COMMERCIAL
端子长度0.058 inch
端子节距0.635 mm
端接类型SOLDER
触点总数100

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F-219
QTS–025–01–L–D–A
®
QTS–075–01–F–D–A
QTS–050–01–F–D–A
(0.635 mm) .025"
QTS SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
1.8 A per pin
(2 pins powered)
Ground Plane:
23.1 A per ground plane
(1 ground plane powered)
Operating Temp:
-55 °C to +125 °C
Voltage Rating:
285 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSS
Cable Mates:
SQCD
Standoffs:
SO
Integral metal plane
for power or ground
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 50 µ" GOLD
POWER/SIGNAL
APPLICATION
(0.635 mm)
.025"
pitch
Alignment
Pin
HIGH-SPEED CHANNEL PERFORMANCE
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
QTS/QSS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
25
G b p s
Polarized
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (025-075)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
QTS
NO. OF POSITIONS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart.
PLATING
OPTION
D
A
OTHER
OPTION
–025, –050, –075
(50 total positions per bank)
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
= Gold Flash on Signal Pins
and Ground Plane,
Matte Tin on tails
–F
FILE NO. E111594
= 10 µ" (0.25 µm) Gold on
Signal Pins and Ground Plane,
Matte Tin on tails
–L
= (7.00 mm)
.275" DIA
Polyimide film
Pick &
Place Pad
–K
= Tape & Reel
–TR
ALSO AVAILABLE
(MOQ Required)
• 11 mm & 16 mm stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 100 & 125 positions per row
• Edge Mount
01
(No. of Positions per Row/25) x (20.00) .7875
(20.00) .7875
(7.11)
.280
(5.97)
.235
02
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min Au over
50 µ" (1.27 µm) Ni on Ground
Plane in contact area,
Matte Tin over 50 µ" (1.27 µm)
min Ni on all solder tails
*Note:
–C Plating passes
10 year MFG testing
LEAD
STYLE
–C*
(0.635) .025
(0.20) .008
A
(4.27) .168
(7.26) .286
MATED
HEIGHT
(5.00) .197
(8.00) .315
A
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(0.76)
.030
(0.89)
.035
DIA
Due to technical progress, all designs, specifications and components are subject to change without notice.
–01
–02
Processing conditions will affect
mated height. See SO Series
for board space tolerances
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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