Information Technology Equipment, General Requirements for Safety
EAC
RoHs 2+
Report / File Number
1602031
RU-AT.49.09571
Standard
IEC60950-1:2005, 2nd Edition + A2:2013
EN60950-1:2006 + A2:2013
TP TC 004/2011
RoHS-2011/65/EU + AM-2015/863
DIMENSION AND PHYSICAL CHARACTERISTICS
Parameter
Material
Dimension (LxWxH)
Weight
continued on next page
www.recom-power.com
REV.: 1/2018
ECO-4
Type
case
potting
PCB
Value
non-conductive black plastic (UL94 V-1)
epoxy, (UL94 V-0)
FR4, (UL94 V-0)
11.5 x 7.6 x 10.2mm
2.0g typ.
RI
DC/DC Converter
Specifications
(measured @ Ta= 25°C, nom. Vin and full load unless otherwise stated)
Dimension Drawing (mm)
Series
embossed logo
11.5
7.6
Pinning information
Pin #
1
2
3
4
Dual
-Vin
+Vin
-Vout
+Vout
10.2
0.51
Marking
Tolerance: xx.x= ±0.5mm
xx.xx= ±0.25mm
4.10
0.51
+0.10/-0.05
2.03
0.25
±0.05
Recommended Footprint Details
1.00 Ø
+0.15/-0
2.54
7.62
1.27
1 2 3 4
Bottom View
1 2 3 4
2.54
Top View
PACKAGING INFORMATION
Parameter
Packaging Dimension (LxWxH)
Packaging Quantity
Storage Temperature Range
Storage Humidity
Type
tube
tube
Value
520.0 x 16.0 x 9.0mm
42pcs
-55°C to +125°C
95% RH max.
The product information and specifications may be subject to changes even without prior written notice.The product has been designed for various applications; its suitability lies in the responsibility of each customer. The
products are not authorized for use in safety-critical applications without RECOM’s explicit written consent. A safety-critical application is an application where a failure may reasonably be expected to endanger or cause
loss of life, inflict bodily harm or damage property. The applicant shall indemnify and hold harmless RECOM, its affiliated companies and its representatives against any damage claims in connection with the unauthorized
use of RECOM products in such safety-critical applications.
VHDL 中的PACKAGE 定义：
package n_bit_int is ---用户定义类型
subtype bit15 is integer -2**14 to 2**14-1;---（-2^14 to 2^14-1)
end n_bit_int;
利用上面的声明，实现IIR滤波的递 ......
在全球半导体产业因景气不佳而纷传并购、整合之际，两大IT巨头三星、IBM日前却双双宣布，将强化半导体产业投资。 三星电子本周一宣布，已向韩国证券交易所提交一份申请文件，打算2008年投下10.5亿美元，用于升级内存芯片生产线、改进技术工艺，从而提高产能并降低成本。无独有偶。本周二IBM公司宣布，未来3年将投资10亿美元，用于扩充位于纽约州 East Fishkill 的半导体工厂，以消...[详细]
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