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LTM2887HY-5S#PBF

产品描述数字隔离器 SPI uModule Isolator Adjustable +/-5V Regulated Power
产品类别模拟混合信号IC    驱动程序和接口   
文件大小582KB,共39页
制造商ADI(亚德诺半导体)
官网地址https://www.analog.com
标准
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LTM2887HY-5S#PBF概述

数字隔离器 SPI uModule Isolator Adjustable +/-5V Regulated Power

LTM2887HY-5S#PBF规格参数

参数名称属性值
Brand NameAnalog Devices Inc
是否无铅含铅
是否Rohs认证符合
厂商名称ADI(亚德诺半导体)
包装说明LBGA, BGA32,8X11,50
针数32
制造商包装代码05-08-1851
Reach Compliance Codecompliant
ECCN代码EAR99
接口集成电路类型INTERFACE CIRCUIT
JESD-30 代码R-XBGA-B32
长度11.25 mm
湿度敏感等级4
功能数量1
端子数量32
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料UNSPECIFIED
封装代码LBGA
封装等效代码BGA32,8X11,50
封装形状RECTANGULAR
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)245
座面最大高度3.62 mm
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装YES
温度等级AUTOMOTIVE
端子形式BALL
端子节距1.27 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度15 mm

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FEATURES
n
n
n
LTM2887
SPI/Digital or I
2
C µModule
Isolator with Dual Adjustable
5V Regulators
DESCRIPTION
The
LTM
®
2887
is a complete galvanic digital µModule
®
(micromodule) isolator. No external components are
required. A single 3.3V or 5V supply powers both sides
of the interface through an integrated, isolated DC/DC
converter. A logic supply pin allows easy interfacing with
different logic levels from 1.62V to 5.5V, independent of
the main supply.
Available options are compliant with SPI and I
2
C (master
mode only) specifications.
The isolated side includes two 5V nominal power supplies,
including programmable current limit, each capable of
providing more than 100mA of load current. The supplies
may be adjusted from their nominal value using a single
external resistor.
Coupled inductors and an isolation power transformer
provide 2500V
RMS
of isolation between the input and out-
put logic interface. This device is ideal for systems where
the ground loop is broken, allowing for a large common
mode voltage range. Communication is uninterrupted for
common mode transients greater than 30kV/μs.
L,
LT, LTC, LTM, Linear Technology, the Linear logo and µModule are registered trademarks of
Analog Devices, Inc. All other trademarks are the property of their respective owners.
n
n
n
n
n
n
n
n
n
n
6-Channel Logic Isolator: 2500V
RMS
for 1 Minute
UL-CSA Recognized
File #E151738
Isolated DC Power:
n
1.8V to 5V Logic Supply at Up to 100mA
n
0.6V to 5V Auxiliary Supply at Up to 100mA
No External Components Required
SPI/Digital (LTM2887-S) or I
2
C (LTM2887-I) Options
High Common Mode Transient Immunity: 30kV/μs
High Speed Operation:
n
10MHz Digital Isolation
n
4MHz/8MHz SPI Isolation
n
400kHz I
2
C Isolation
3.3V (LTM2887-3) or 5V (LTM2887-5) Operation
1.62V to 5.5V Logic Supply
±10kV ESD HBM Across the Isolation Barrier
Maximum Continuous Working Voltage: 560V
PEAK
Low Current Shutdown Mode (<10µA)
Low Profile 15mm × 11.25mm × 3.42mm BGA Package
Isolated SPI or I
2
C Interfaces
Industrial Systems
Test and Measurement Equipment
Breaking Ground Loops
APPLICATIONS
n
n
n
n
TYPICAL APPLICATION
Isolated 4MHz SPI Interface
LTM2887-5S
5V
V
CC
V
L
ON
ISOLATION BARRIER
V
CC2
AV
CC2
IV
CC2
V
L2
AV
L2
IV
L2
1.15k
CS2
SDI2
SCK2
I2
SDO2
I1
GND2
2887 TA01a
LTM2887 Operating Through 50kV/µs CM Transients
5V AT 100mA
SCK
SD0
SCK2 = SD02
1.15k
3.3V AT 100mA
27.4k
5V/DIV
SDOE
CS
SDI
SCK
CS
SDI
SCK
DO2
SDO
SDO
DO1
GND
REPETITIVE
COMMON MODE
TRANSIENTS
GND2 TO GND
CS
SDI
SCK
6.04k
200V/DIV
20ns/DIV
2887 TA01b
SDO
2887fb
For more information
www.linear.com/LTM2887
1

LTM2887HY-5S#PBF相似产品对比

LTM2887HY-5S#PBF LTM2887IY-3I#PBF LTM2887IY-5S#PBF LTM2887HY-3S#PBF LTM2887IY-5I#PBF LTM2887HY-3I#PBF
描述 数字隔离器 SPI uModule Isolator Adjustable +/-5V Regulated Power 数字隔离器 I2C uModule Isolator Adjustable +/-5V Regulated Power 数字隔离器 SPI uModule Isolator Adjustable +/-5V Regulated Power 数字隔离器 SPI uModule Isolator Adjustable +/-5V Regulated Power 数字隔离器 I2C uModule Isolator Adjustable +/-5V Regulated Power 数字隔离器 I2C uModule Isolator Adjustable +/-5V Regulated Power
Brand Name Analog Devices Inc Analog Devices Inc Analog Devices Inc Analog Devices Inc Analog Devices Inc Analog Devices Inc
是否无铅 含铅 含铅 含铅 含铅 含铅 含铅
是否Rohs认证 符合 符合 符合 符合 符合 符合
厂商名称 ADI(亚德诺半导体) ADI(亚德诺半导体) ADI(亚德诺半导体) ADI(亚德诺半导体) ADI(亚德诺半导体) ADI(亚德诺半导体)
包装说明 LBGA, BGA32,8X11,50 LBGA, BGA32,8X11,50 LBGA, BGA32,8X11,50 LBGA, BGA32,8X11,50 LBGA, BGA32,8X11,50 LBGA, BGA32,8X11,50
针数 32 32 32 32 32 32
制造商包装代码 05-08-1851 05-08-1851 05-08-1851 05-08-1851 05-08-1851 05-08-1851
Reach Compliance Code compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
接口集成电路类型 INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 代码 R-XBGA-B32 R-XBGA-B32 R-XBGA-B32 R-XBGA-B32 R-XBGA-B32 R-XBGA-B32
长度 11.25 mm 11.25 mm 11.25 mm 11.25 mm 11.25 mm 11.25 mm
湿度敏感等级 4 4 4 4 4 4
功能数量 1 1 1 1 1 1
端子数量 32 32 32 32 32 32
最高工作温度 125 °C 85 °C 85 °C 125 °C 85 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
封装代码 LBGA LBGA LBGA LBGA LBGA LBGA
封装等效代码 BGA32,8X11,50 BGA32,8X11,50 BGA32,8X11,50 BGA32,8X11,50 BGA32,8X11,50 BGA32,8X11,50
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度) 245 245 245 245 245 245
座面最大高度 3.62 mm 3.62 mm 3.62 mm 3.62 mm 3.62 mm 3.62 mm
最大供电电压 5.5 V 3.6 V 5.5 V 3.6 V 5.5 V 3.6 V
最小供电电压 4.5 V 3 V 4.5 V 3 V 4.5 V 3 V
标称供电电压 5 V 3.3 V 5 V 3.3 V 5 V 3.3 V
表面贴装 YES YES YES YES YES YES
温度等级 AUTOMOTIVE INDUSTRIAL INDUSTRIAL AUTOMOTIVE INDUSTRIAL AUTOMOTIVE
端子形式 BALL BALL BALL BALL BALL BALL
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 15 mm 15 mm 15 mm 15 mm 15 mm 15 mm
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