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C1206X333K2RAC3124

产品描述多层陶瓷电容器MLCC - SMD/SMT 200V .033uF X7R 1206 10%
产品类别无源元件    电容器    陶瓷电容器    MLCC - 多层陶瓷电容器    多层陶瓷电容器MLCC - SMD/SMT   
文件大小1MB,共25页
制造商KEMET(基美)
官网地址http://www.kemet.com
标准
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C1206X333K2RAC3124概述

多层陶瓷电容器MLCC - SMD/SMT 200V .033uF X7R 1206 10%

C1206X333K2RAC3124规格参数

参数名称属性值
厂商名称KEMET(基美)
产品种类多层陶瓷电容器MLCC - SMD/SMT
发货限制Mouser目前不销售该产品。
终端Flexible (Soft)
电容0.033 uF
电压额定值 DC200 VDC
电介质X7R
容差10 %
外壳代码 - in1206
外壳代码 - mm3216
高度0.78 mm
最小工作温度- 55 C
最大工作温度+ 125 C
产品General Type MLCCs
端接类型SMD/SMT
资格AEC-Q200
系列SMD Comm X7R Flex
长度3.2 mm
封装 / 箱体1206 (3216 metric)
宽度1.6 mm
电容-nF33 nF
电容-pF33000 pF
Class 2
工厂包装数量10000

文档预览

下载PDF文档
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), X7R Dielectric,
6.3 – 250 VDC (Commercial Grade)
Overview
The KEMET Flexible Termination (FT-CAP) multilayer
ceramic capacitor in X7R dielectric incorporates a unique,
flexible termination system that is integrated with the
KEMET standard termination materials. A conductive silver
epoxy is utilized between the base metal and nickel barrier
layers of KEMET’s standard termination system in order
to establish pliability, while maintaining terminal strength,
solderability and electrical performance. This technology
was developed in order to address the primary failure
mode of MLCCs – flex cracks, which are typically the result
of excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the rigid
ceramic body, therefore mitigating flex cracks which can
result in low IR or short circuit failures.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide
superior flex performance over standard termination
systems. FT-CAP complements the KEMET Open Mode,
Floating Electrode (FE-CAP), Floating Electrode with
Flexible Termination (FF-CAP) and KEMET Power Solutions
Click image above for interactive 3D content
(KPS) product lines by providing a complete portfolio of flex
mitigation solutions.
Combined with the stability of an X7R dielectric and designed
to accommodate all capacitance requirements, these flex-
robust devices are RoHS-compliant, offer up to 5 mm of
flex-bend capability and exhibit a predictable change in
capacitance with respect to time and voltage. Capacitance
change with reference to ambient temperature is limited to
±15% from −55°C to +125°C.
In addition to commercial grade, automotive grade devices
are available which meet the demanding Automotive
Electronics Council's AEC–Q200 qualification requirements.
Ordering Information
C
1206
X
106
Capacitance
Code (pF)
Two
significant
digits and
number of
zeros
Open PDF in Adobe Reader for full functionality
K
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
4
R
A
C
Termination Finish
1
TU
Packaging/Grade
(C-Spec)
2
Case Size
Specification/
Ceramic
(L" x W")
Series
0603
0805
1206
1210
1808
1812
1825
2220
2225
1
Rated
Failure
Voltage
Dielectric Rate/
(VDC)
Design
9 = 6.3
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
R = X7R
X = Flexible
termination
A = N/A C = 100% Matte Sn
See "Packaging
L = SnPb (5% Pb minimum)
C-Spec
Ordering
Options Table"
Additional termination finish options may be available. Contact KEMET for details.
One world. One KEMET
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1013_X7R_FT-CAP_SMD • 5/3/2019
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