专业电源管理 (PMIC) Positive High Voltage Ideal Diode Controller
| 参数名称 | 属性值 |
| Brand Name | Analog Devices Inc |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 包装说明 | HVSON, |
| 针数 | 6 |
| 制造商包装代码 | 05-08-1715 |
| Reach Compliance Code | compliant |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-N6 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 6 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.8 mm |
| 最大供电电压 (Vsup) | 80 V |
| 最小供电电压 (Vsup) | 9 V |
| 标称供电电压 (Vsup) | 20 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 2 mm |
| Base Number Matches | 1 |
| LTC4357IDCB#TRPBF | LTC4357HMS8#TRPBF | LTC4357HDCB#PBF | LTC4357IMS8#TRPBF | LTC4357HDCB#TRPBF | LTC4357IDCB#PBF | LTC4357HMS8#PBF | LTC4357MPMS8#PBF | LTC4357IMS8#PBF | LTC4357HDCB#TRMPBF | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 专业电源管理 (PMIC) Positive High Voltage Ideal Diode Controller | Power Management Specialized - PMIC Positive High Voltage Ideal Diode Controller | Power Management Specialized - PMIC LTC4357 - Positive High Voltage Ideal Diode Controller | Power Management Specialized - PMIC Positive High Voltage Ideal Diode Controller | Power Management Specialized - PMIC Positive High Voltage Ideal Diode Controller | Power Management Specialized - PMIC LTC4357 - Positive High Voltage Ideal Diode Controller | Power Management Specialized - PMIC Positive High Voltage Ideal Diode Controller | Power Management Specialized - PMIC Positive High Voltage Ideal Diode Controller | Power Management Specialized - PMIC Positive High Voltage Ideal Diode Controller | Power Management Specialized - PMIC Positive High Voltage Ideal Diode Controller |
| Brand Name | Analog Devices Inc | Analog Devices Inc | - | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc | Analog Devices Inc |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 包装说明 | HVSON, | TSSOP, | - | TSSOP, | HVSON, | HVSON, | TSSOP, | TSSOP, | TSSOP, | HVSON, |
| 针数 | 6 | 8 | - | 8 | 6 | 6 | 8 | 8 | 8 | 6 |
| 制造商包装代码 | 05-08-1715 | 05-08-1660 | - | 05-08-1660 | 05-08-1715 | 05-08-1715 | 05-08-1660 | 05-08-1660 | 05-08-1660 | 05-08-1715 |
| Reach Compliance Code | compliant | compliant | - | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| 可调阈值 | NO | NO | - | NO | NO | NO | NO | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-N6 | S-PDSO-G8 | - | S-PDSO-G8 | R-PDSO-N6 | R-PDSO-N6 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-N6 |
| JESD-609代码 | e3 | e3 | - | e3 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | 3 mm | - | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 湿度敏感等级 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 信道数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 6 | 8 | - | 8 | 6 | 6 | 8 | 8 | 8 | 6 |
| 最高工作温度 | 85 °C | 125 °C | - | 85 °C | 125 °C | 85 °C | 125 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -55 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HVSON | TSSOP | - | TSSOP | HVSON | HVSON | TSSOP | TSSOP | TSSOP | HVSON |
| 封装形状 | RECTANGULAR | SQUARE | - | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 | 260 | - | 260 | 260 | 250 | 260 | 225 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 0.8 mm | 1.1 mm | - | 1.1 mm | 0.8 mm | 0.8 mm | 1.1 mm | 1.1 mm | 1.1 mm | 0.8 mm |
| 最大供电电压 (Vsup) | 80 V | 80 V | - | 80 V | 80 V | 80 V | 80 V | 80 V | 80 V | 80 V |
| 最小供电电压 (Vsup) | 9 V | 9 V | - | 9 V | 9 V | 9 V | 9 V | 9 V | 9 V | 9 V |
| 标称供电电压 (Vsup) | 20 V | 20 V | - | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V | 20 V |
| 表面贴装 | YES | YES | - | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | AUTOMOTIVE | - | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | MILITARY | INDUSTRIAL | AUTOMOTIVE |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | - | MATTE TIN (SN) | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN (SN) | MATTE TIN (SN) | MATTE TIN (SN) | MATTE TIN |
| 端子形式 | NO LEAD | GULL WING | - | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 0.65 mm | - | 0.65 mm | 0.5 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | - | 30 | 30 | NOT SPECIFIED | 30 | NOT SPECIFIED | 30 | 30 |
| 宽度 | 2 mm | 3 mm | - | 3 mm | 2 mm | 2 mm | 3 mm | 3 mm | 3 mm | 2 mm |
| 厂商名称 | - | ADI(亚德诺半导体) | - | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
