Ultra-Low Pressure
Digital Sensor
SM9333/SM9336 Series
Differential Pressure Sensors
FEATURES
•
•
•
•
•
Pressure ranges: 125 and 250 Pa Differential
Accuracy after Autozero: < 1%FS
16 bit I
2
C Digital interface
Pressure calibrated and temperature compensated output
Compensated temperature range: -20 to 85
o
C
DESCRIPTION
The SM9333/SM9336 are digital, ultra-low pressure sensors offering
state-of-the-art MEMS pressure transducer technology and CMOS
mixed signal processing technology to produce a digital, fully
conditioned, multi-order pressure and temperature compensated
sensor in JEDEC standard SOIC-16 package with a dual vertical
porting option. It is available in a differential pressure configuration.
The total accuracy after board mount and system level autozero is
less than 1%FS. The excellent warmup behavior and long term
stability further assures its expected performance over the life of the
part.
Combining the pressure sensor with a signal-conditioning ASIC in a
single package simplifies the use of advanced silicon micro-machined
pressure sensors. The pressure sensor can be mounted directly on a
standard printed circuit board and a high level, calibrated pressure
signal can be acquired from the digital interface. This eliminates the
need for additional circuitry, such as a compensation network or
microcontroller containing a custom correction algorithm.
The SM9333/SM9336 are shipped in sticks or tape & reel.
Medical
Sleep Apnea
CPAP
Ventilators
Gas Flow Instrumentation
Air Flow Monitors
Life Sciences
Industrial
HVAC
Airflow Measurement
Pressure Transmitters
Pneumatic Gauges
Pressure Switches
Safety Cabinets
Gas Flow Instrumentation
Silicon Microstructures, Inc. 2001-2018. All rights reserved
DOC # 40DS9302.02
+1-(408) 577-0100
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sales@si-micro.com
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SM9333/SM9336 Series
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1. Absolute Maximum Ratings
All parameters are specified at Vdd = 3.3 V supply voltage at 25
o
C, unless otherwise noted.
No.
1
2
3
4
5
6
Characteristic
Supply Voltage
Digital IO Voltage
Max. Digital IO Current (DC)
Storage Temperature
(a,b)
Proof Pressure
(a, c)
Burst Pressure
(a, d)
Symbol
V
DD
V
IO,DIG
I
IO,DIG
T
STG
P
Proof
P
Burst
Minimum
3.0
-0.3
-10
-40
7 (1.0)
20 (2.9)
Maximum
5.5
VDD+0.3
+10
+125
Units
V
V
mA
°C
kPa (PSI)
kPa (PSI)
Notes:
a. Tested on a sample basis.
b. Clean, dry air compatible with wetted materials. Wetted materials include silicon, glass, RTV (silicone), gold, aluminum, copper, nickel,
palladium, epoxy, stainless steel and plastic (mold compound).
c. Proof pressure is defined as the maximum pressure to which the device can be taken and still perform within specifications after
returning to the operating pressure range.
d. Burst pressure is the pressure at which the device suffers catastrophic failure resulting in pressure loss through the device.
2. ESD
No.
2.1
Description
ESD HBM Protection at all Pins
Symbol
V
ESD(HBM)
Minimum
-2
Maximum
2
Units
kV
3. External Components
No.
1
2
*
Description
Supply bypass capacitor
*
I2C Data and clock pull up resistors
*
Symbol
C
VDD
R
P
Min.
Typ.
100
4.7
Max.
Units
nF
kOhm
Not tested in production
4. Calibrated Pressure Ranges
No.
1
2
Calibrated Pressure Ranges
Device Type
P
MIN
(Pa)
SM9333 – 125 Differential
SM9336 – 250 Differential
-125
-250
P
MAX
(Pa)
+125
+250
Silicon Microstructures, Inc. 2001-2018. All rights reserved
DOC # 40DS9302.02
+1-(408) 577-0100
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sales@si-micro.com
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www.si-micro.com
Page 2
SM9333/SM9336 Series
5. Recommended Operating Conditions
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The recommended operating conditions must not be exceeded in order to ensure proper functionality of the device. All parameters
specified in the following sections refer to these recommended operating conditions unless stated otherwise.
No.
1
2
3
4
5
Description
Supply Voltage
Low level input voltage at SDA, SCL
High level input voltage at SDA, SCL
Compensated Temperature
(b)
Operating Temperature
Symbol
V
VDD
V
IN,I2C,lo
V
IN,I2C,hi
T
COMP
T
A
Min.
3.0
-0.3
0.8 * V
VDD
-20
-20
Typ.
3.3
Max.
3.6
0.9
V
VDD
+0.3
+85
85
Units
V
V
V
°C
°C
Notes:
b. Clean, dry air compatible with wetted materials.
6. OPERATING CHARACTERISTICS TABLE
All parameters are specified at Vdd = 3.3 V DC supply voltage at 25
o
C, unless otherwise noted.
No.
1
2
3
4
5
6
7
8
9
10
11
Characteristic
Supply Current
(e)
Digital Pressure Output
@
P
MIN
Digital Pressure Output
@
P
MAX
Digital Full Scale Span
Resolution (Digital Output)
Update Rate
Digital AZ SM9333 – 125 Differential
Output
Accuracy
(f, g, h)
SM9336 – 250 Differential
Digital Output SM9333 – 125 Differential
Accuracy
(f)
SM9336 – 250 Differential
Bandwidth
Position Sensitivity
Power-up
time
*
from supply VDD > 3.0 V
to output settled to 90%
of final value
Symbol
I
VDD
OUT
MIN
OUT
MAX
FS
Minimum
Typical
3.3
-26,215
+26,214
52,429
16
2000
Maximum
3.8
Units
mA
Counts
Counts
Counts
Bits
Hz
ACC
AZ
ACC
BW
S
G
t
UP
-1.25
-1
-2.75
-1.5
0.2
0.1
± 0.5
± 0.3
20
0.1
1.25
1
2.75
1.5
%FS
%FS
%FS
%FS
Hz
%FS/g
5
ms
12
pressure step response;
Step response
output rising from 10% to
time
*
90% of final value
Step response
settling time
*
pressure step response;
output settling to full
accuracy
t
RESP
1
10
ms
13
*
t
SETTLE
ms
Not tested in production
Notes:
e. Supply current given for continuous operation. Device can be set to sleep mode with significantly lower power consumption. Refer to
section 11 for details.
f. The accuracy specification applies over all operating conditions in dry clean air. This specification includes the combination of linearity,
repeatability, and hysteresis errors over pressure, temperature, and 3.3 V supply voltage.
g. Based on system level autozero at 25
o
C after board mount or solder reflow.
h. Based on sample testing during initial product qualification, not tested in production.
Silicon Microstructures, Inc. 2001-2018. All rights reserved
DOC # 40DS9302.02
+1-(408) 577-0100
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sales@si-micro.com
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SM9333/SM9336 Series
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7 I
2
C Interface
No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
*
Description
SDA output low voltage
*
Low-to-High transition threshold
*
High-to-Low transition threshold
*
I
2
C clock frequency
*
Bus free time between a START and STOP condition
*
Clock low time
*
Clock high time
*
START condition hold time
*
Data setup time
*
Data hold time
*
Setup time for repeated START condition
*
Setup time for STOP condition
*
Rise time of SDA and SCL signals
*
Fall time of SDA and SCL signals
*
Condition
I
SDA
= 3 mA
pins SA0, SCL
pins SA0, SCL
Symbol
V
SDA,OL
V
SDA,LH
V
SDA,HL
f
SCL
t
BUSF
t
LO
t
HI
t
SH
t
SU
t
H
t
RSH
t
PSU
t
R
t
F
Min.
0
0.5
0.3
Typ.
Max. Units
0.4
V
VDD
VDD
kHz
ns
ns
ns
ns
ns
ns
ns
ns
300
300
ns
ns
0.6
0.4
0.7
0.5
400
1300
1300
600
100
100
0
600
600
Not tested in production
8. Qualification Standards
REACH Compliant
RoHS Compliant
PFOS/PFOA Compliant
For qualification specifications, please contact Sales at sales@si-micro.com
Silicon Microstructures, Inc. 2001-2018. All rights reserved
DOC # 40DS9302.02
+1-(408) 577-0100
|
sales@si-micro.com
I
www.si-micro.com
Page 4
SM9333/SM9336 Series
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9. Package Reference
SOIC-16 (C) Vertical Package Dimensions
Notes:
•
•
•
•
•
•
•
•
•
All dimensions in units of [mm]
Moisture Sensitivity Level (MSL): Level 3
Clean, dry air compatible with wetted materials. Wetted materials include : Wetted materials include silicon, glass, RTV (silicone), gold,
aluminum, copper, epoxy and mold compound.
Tolerance on all dimensions ±0.13 mm unless otherwise specified.
[B] is tube connected to bottom side of sensor die.
[T] is tube connected to top side of sensor die. Topside pressure is positive pressure. An increase in topside pressure will result in an
increase in sensor output
Bottom plate is stainless steel
Robust JEDEC SOIC-16 package for automated assembly
Manufactured according to ISO9001 , ISO14001 and ISO/TS 16949 standards
Lot Number Identification
Silicon Microstructures, Inc. 2001-2018. All rights reserved
DOC # 40DS9302.02
+1-(408) 577-0100
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sales@si-micro.com
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www.si-micro.com
Page 5