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MCP2025-500E/SN

产品描述LIN 收发器 LIN Transceiver Vreg
产品类别无线/射频/通信    电信电路   
文件大小1MB,共39页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
下载文档 详细参数 选型对比 全文预览

MCP2025-500E/SN概述

LIN 收发器 LIN Transceiver Vreg

MCP2025-500E/SN规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Microchip(微芯科技)
包装说明SON,
Reach Compliance Codecompliant
Factory Lead Time11 weeks
Is SamacsysN
JESD-30 代码R-PDSO-N8
JESD-609代码e3
长度4.9 mm
湿度敏感等级3
功能数量1
端子数量8
最高工作温度125 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码SON
封装形状RECTANGULAR
封装形式SMALL OUTLINE
峰值回流温度(摄氏度)260
筛选级别TS 16949
座面最大高度1.75 mm
标称供电电压12 V
表面贴装YES
电信集成电路类型ETHERNET TRANSCEIVER
温度等级AUTOMOTIVE
端子面层Matte Tin (Sn) - annealed
端子形式NO LEAD
端子节距1.27 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
宽度3.9 mm
Base Number Matches1

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MCP2025
LIN Transceiver with Voltage Regulator
Features:
• Compliant with LIN Bus Specifications Version
1.3, 2.1 and with SAE J2602-2
• Supports Baud Rates up to 20 kBaud
• 43V Load Dump Protected
• Maximum Continuous Input Voltage: 30V
• Wide LIN-Compliant Supply Voltage: 6.0-18.0V
• Extended Temperature Range: -40°C to +125°C
• Interface to PIC
®
EUSART and Standard USARTs
• Wake-Up on LIN Bus Activity or Local Wake Input
• Local Interconnect Network (LIN) Bus Pin:
- Internal Pull-Up Termination Resistor and
Diode for Slave Node
- Protected Against V
BAT
Shorts
- Protected Against Loss of Ground
- High-Current Drive
• T
XD
and LIN Bus Dominant Time-Out Function
• Two Low-Power Modes:
- Transmitter Off: 90 µA (typical)
- Power Down: 4.5 µA (typical)
• MCP2025 On-Chip Voltage Regulator:
- Output Voltage of 5.0V or 3.3V
at 70 mA Capability with Tolerances of ±3%
Over the Temperature Range
- Internal Short-Circuit Current Limit
- External Components Limited to Filter
Capacitor and Load Capacitor
• Automatic Thermal Shutdown
• High Electromagnetic Immunity (EMI), Low
Electromagnetic Emission (EME)
• Robust ESD Performance: ±15 kV for L
BUS
and
V
BB
Pin (IEC61000-4-2)
• Transient Protection for L
BUS
and V
BB
pins in
Automotive Environment (ISO7637)
• Meets Stringent Automotive Design Requirements,
including “OEM Hardware Requirements for LIN,
CAN and FlexRay Interfaces in Automotive
Applications”, Version 1.3, May 2012
• Multiple Package Options, Including Small
4x4 mm DFN Package
Description:
The MCP2025 provides a bidirectional, half-duplex
communication physical interface to meet the LIN bus
specification Revision 2.1 and SAE J2602-2. The
device incorporates a voltage regulator with 5V or 3.3V
at 70 mA regulated power supply output. The device
has been designed to meet the stringent quiescent
current requirements of the automotive industry, and
will survive +43V load dump transients and double
battery jumps.
The MCP2025 family members include:
- MCP2025-500, 8-pin, LIN driver with 5.0V
regulator
- MCP2025-330, 8-pin, LIN driver with 3.3V
regulator
Package Types
MCP2025
PDIP, SOIC
V
BB
CS/LWAKE
V
SS
L
BUS
1
2
3
4
8
7
6
5
V
REG
RESET
T
XD
R
XD
MCP2025
4x4 DFN
V
BB
CS/LWAKE
V
SS
L
BUS
1
2
3
4
EP
9
8 V
REG
7 RESET
6 T
XD
5 R
XD
2012-2014 Microchip Technology Inc.
DS20002306B-page 1

MCP2025-500E/SN相似产品对比

MCP2025-500E/SN MCP2025T-330E/SN MCP2025T-330E/MD MCP2025-330E/P MCP2025T-500E/SN MCP2025T-500E/MD MCP2025-500E/P
描述 LIN 收发器 LIN Transceiver Vreg LIN Transceivers LIN Transceiver Vreg LIN Transceivers LIN Transceiver Vreg LIN 收发器 LIN Transceiver Vreg LIN 收发器 LIN Transceiver Vreg LIN 收发器 LIN Transceiver Vreg LIN 收发器 LIN Transceiver Vreg
是否Rohs认证 符合 符合 符合 符合 符合 符合 符合
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
包装说明 SON, SOIC-8 DFN-8 DIP-8 SOIC-8 DFN-8 DIP-8
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant
Factory Lead Time 11 weeks 11 weeks 13 weeks 13 weeks 7 weeks 1 day 18 weeks 7 weeks
JESD-30 代码 R-PDSO-N8 R-PDSO-N8 S-PDSO-N8 R-PDIP-T8 R-PDSO-N8 S-PDSO-N8 R-PDIP-T8
JESD-609代码 e3 e3 e3 e3 e3 e3 e3
长度 4.9 mm 4.9 mm 4 mm 9.271 mm 4.9 mm 4 mm 9.271 mm
功能数量 1 1 1 1 1 1 1
端子数量 8 8 8 8 8 8 8
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 SON SON VSON DIP SON VSON DIP
封装形状 RECTANGULAR RECTANGULAR SQUARE RECTANGULAR RECTANGULAR SQUARE RECTANGULAR
封装形式 SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE IN-LINE SMALL OUTLINE SMALL OUTLINE, VERY THIN PROFILE IN-LINE
峰值回流温度(摄氏度) 260 260 260 NOT APPLICABLE 260 260 NOT APPLICABLE
筛选级别 TS 16949 TS 16949 TS 16949 TS 16949 TS 16949 TS 16949 TS 16949
座面最大高度 1.75 mm 1.75 mm 1 mm 5.334 mm 1.75 mm 1 mm 5.334 mm
标称供电电压 12 V 12 V 12 V 12 V 12 V 12 V 12 V
表面贴装 YES YES YES NO YES YES NO
电信集成电路类型 ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER ETHERNET TRANSCEIVER
温度等级 AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
端子面层 Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed Matte Tin (Sn) - annealed
端子形式 NO LEAD NO LEAD NO LEAD THROUGH-HOLE NO LEAD NO LEAD THROUGH-HOLE
端子节距 1.27 mm 1.27 mm 0.8 mm 2.54 mm 1.27 mm 0.8 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 40 40 40 NOT APPLICABLE 40 40 NOT APPLICABLE
宽度 3.9 mm 3.9 mm 4 mm 7.62 mm 3.9 mm 4 mm 7.62 mm
湿度敏感等级 3 3 1 - 3 1 -

 
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