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5962R042293VZX

产品描述

LT1970CFE#TRPBF放大器基础信息:

LT1970CFE#TRPBF是来自Analog Devices Inc.的一款运算放大器 - 运放(Op Amps - Operational Amplifierss)。其隶属于LT1970系列的产品。

LT1970CFE#TRPBF放大器核心信息:

对应的工作电源电流为7 mA每个通道的输出电流为:800 mA

LT1970CFE#TRPBF的增益带宽积(GBP,增益带宽产品)为3.6 MHz,作为简单衡量放大器的性能的一个参数,如果你在不止如何选择你的放大器时,可以将这个做一个比较简单的衡量指标。其对应的输入电压噪声密度为15 nV/rtHz相应的输入噪声电流密度为3 pA/rtHz

LT1970CFE#TRPBF的相关尺寸:

共有通道数量(Number of chanels):1 Channel个。

LT1970CFE#TRPBF放大器其他信息:

而其更为详尽的单个封装形式是:TSSOP-20。市面上供应商销售LT1970CFE#TRPBF时,采用的形式是:Reel。

产品类别可编程逻辑器件    可编程逻辑   
文件大小928KB,共38页
制造商Cobham Semiconductor Solutions
器件替换:5962R042293VZX替换放大器
下载文档 详细参数 全文预览

5962R042293VZX概述

LT1970CFE#TRPBF放大器基础信息:

LT1970CFE#TRPBF是来自Analog Devices Inc.的一款运算放大器 - 运放(Op Amps - Operational Amplifierss)。其隶属于LT1970系列的产品。

LT1970CFE#TRPBF放大器核心信息:

对应的工作电源电流为7 mA每个通道的输出电流为:800 mA

LT1970CFE#TRPBF的增益带宽积(GBP,增益带宽产品)为3.6 MHz,作为简单衡量放大器的性能的一个参数,如果你在不止如何选择你的放大器时,可以将这个做一个比较简单的衡量指标。其对应的输入电压噪声密度为15 nV/rtHz相应的输入噪声电流密度为3 pA/rtHz

LT1970CFE#TRPBF的相关尺寸:

共有通道数量(Number of chanels):1 Channel个。

LT1970CFE#TRPBF放大器其他信息:

而其更为详尽的单个封装形式是:TSSOP-20。市面上供应商销售LT1970CFE#TRPBF时,采用的形式是:Reel。

5962R042293VZX规格参数

参数名称属性值
零件包装代码LGA
包装说明LGA,
针数484
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
CLB-Max的组合延迟1.01 ns
JESD-30 代码S-CBGA-N484
长度29 mm
可配置逻辑块数量1536
等效关口数量320640
端子数量484
最高工作温度125 °C
最低工作温度-55 °C
组织1536 CLBS, 320640 GATES
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码LGA
封装形状SQUARE
封装形式GRID ARRAY
可编程逻辑类型FIELD PROGRAMMABLE GATE ARRAY
认证状态Not Qualified
筛选级别MIL-PRF-38535 Class V
座面最大高度2.95 mm
最大供电电压2.7 V
最小供电电压2.3 V
标称供电电压2.5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子形式NO LEAD
端子节距1.27 mm
端子位置BOTTOM
总剂量100k Rad(Si) V
宽度29 mm

文档预览

下载PDF文档
Standard Products
RadHard Eclipse FPGA Family (6250 and 6325)
Advanced Data Sheet
June 16, 2006
www.aeroflex.com/RadHardFPGA
FEATURES
0.25µm, five-layer metal, ViaLink
TM
epitaxial CMOS
process for smallest die sizes
One-time programmable, ViaLink technology for
personalization
150 MHz 16-bit counters, 150 MHz datapaths, 60+ MHz
FIFOs
2.5V core supply voltage, 3.3V I/O supply voltage
Up to 320,000 usable system gates (non-volatile)
I/Os
- Interfaces with 3.3 volt
- PCI compliant with 3.3 volt
- Full JTAG 1149.1 compliant
- Registered I/O cells with individually controlled enables
Radiation-hardened design; total dose irradiation testing to
MIL-STD-883 Test Method 1019
- Total-dose: 300 krad(Si)
- SEL Immune: >120MeV-cm
2
/mg
- LET
TH
(0.25) MeV-cm
2
/mg:
>42 logic cell flip flops
>64 for embedded SRAM
- Saturated Cross Section (cm2) per bit
5.0E-7 logic cell flip flops
2.0E-7 embedded SRAM
Up to 24 dual-port RadHard SRAM modules, organized in
user-configurable 2,304 bit blocks
- 5ns access times, each port independently accessible
- Fast and efficient for FIFO, RAM, and initialized RAM
functions
100% routable with 100% utilization and 100% user fixed
I/O
Variable-grain logic cells provide high performance and
100% utilization
Comprehensive design tools include high quality Verilog/
VHDL synthesis and simulation
QuickLogic IP available for microcontrollers, DRAM
controllers, USART and PCI
Packaged in a 208-pin CQFP, 288 CQFP, 484 CCGA, and
484 CLGA,208 PQFP, 280 PBGA, 484 PBGA
Standard Microcircuit Drawing 5962-04229
- QML qualified
INTRODUCTION
The RadHard Eclipse Field Programmable Gate Array Family
(FPGA) offers up to 320,000 usable system gates including
Dual-Port RadHard SRAM modules. It is fabricated on 0.25µm
five-layer metal ViaLink CMOS process and contains a
maximum of 1,536 logic cells and 24 dual-port RadHard SRAM
modules (see Figure 1 Block Diagram). Each RAM module has
2,304 RAM bits, for a maximum total of 55,300 bits. Please
reference product family comparison chart on page 2.
RAM modules are Dual Port (one asynchronous/synchronous
read port, one write port) and can be configured into one of four
modes (see Figure 2). The RadHard Eclipse FPGA is available
in a 208-pin Cerquad Flatpack, allowing access to 99
bidirectional signal I/O, 1 dedicated clock, 8 programmable
clocks and 16 high drive inputs. Other package options include
a 288 CQFP, 484 CCGA and a 484 CLGA.
Designers can cascade multiple RAM modules to increase the
depth or width allowed in single modules by connecting
corresponding address lines together and dividing the words
between modules (see Figure 3). This approach allows a variety
of address depths and word widths to be tailored to a specific
application.
Aeroflex uses QuickLogic Corporation’s licensed ESP
(Embedded Standard Products) technology. QuickLogic is a
pioneer in the FPGA semiconductor and software tools field.
1

 
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