MCP1726
1A, Low-Voltage, Low Quiescent Current LDO
Regulator
Features:
•
•
•
•
•
•
•
•
•
•
•
•
•
1A Output Current Capability
Input Operating Voltage Range: 2.3V to 6.0V
Adjustable Output Voltage Range: 0.8V to 5.0V
Standard Fixed Output Voltages:
- 0.8V, 1.2V, 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
Low Dropout Voltage: 220 mV typical at 1A
Typical Output Voltage Tolerance: ±0.5%
Stable with 1.0 µF Ceramic Output Capacitor
Fast Response to Load Transients
Low Supply Current: 140 µA (typical)
Low Shutdown Supply Current: 0.1 µA (typical)
Adjustable Delay on Power Good Output
Short-Circuit Current Limiting and
Overtemperature Protection
3x3 DFN-8 and SOIC-8 Package Options
Description:
The MCP1726 is a 1A Low Dropout (LDO) linear
regulator that provides high current and low output
voltages in a very small package. The MCP1726
comes in fixed or adjustable output voltage versions,
with an output voltage range of 0.8V to 5.0V. The 1A
output current capability and low output voltage
capability make the MCP1726 a good choice for new
sub-1.8V output voltage LDO applications that have
high current demands.
The MCP1726 is stable using ceramic output
capacitors that inherently provide lower output noise
and reduce the size and cost of the entire regulator
solution. Only 1 µF of output capacitance is needed to
stabilize the LDO.
Using CMOS construction, the quiescent current
consumed by the MCP1726 is typically less than
140 µA over the entire input voltage range, making it
attractive for portable computing applications that
demand high output current. When the MCP1726 is
shut down, the quiescent current is reduced to less
than 0.1 µA.
The scaled-down output voltage is internally monitored
and a Power Good (PWRGD) output is provided when
the output is within 92% of regulation (typical). An
external capacitor can be used on the C
DELAY
pin to
adjust the delay from 1 ms to 300 ms.
The overtemperature and short-circuit current limiting
provide additional protection for the LDO during system
fault conditions.
Applications:
•
•
•
•
•
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High-Speed Driver Chipset Power
Networking Backplane Cards
Notebook Computers
Network Interface Cards
Palmtop Computers
2.5V to 1.XV Regulators
Package Types
MCP1726-ADJ
SOIC
V
IN
1
V
IN
2
SHDN 3
GND 4
8 V
OUT
7 ADJ
MCP1726-xx
SOIC
V
IN
1
V
IN
2
8 V
OUT
7 V
OUT
MCP1726-ADJ
3x3 DFN
V
IN
1
V
IN
2
EP
9
8 V
OUT
7 ADJ
5 PWRGD
MCP1726-xx
3x3 DFN
V
IN
1
V
IN
2
GND 4
EP
9
8 V
OUT
7 V
OUT
6 C
DELAY
5 PWRGD
6 C
DELAY
SHDN 3
5 PWRGD GND 4
6 C
DELAY
SHDN 3
5 PWRGD GND 4
6 C
DELAY
SHDN 3
2005-2014 Microchip Technology Inc.
DS20001936D-page 1
MCP1726
Typical Application
MCP1726 Fixed Output Voltage
V
IN
= 2.3V to 2.8V
C
1
4.7 µF
1 V
IN
2 V
IN
3 SHDN
4 GND
On
Off
PWRGD
V
OUT
8
V
OUT
7
C
DELAY
6
PWRGD 5
C
3
1000 pF
R
1
100 k
V
OUT
= 1.8V @ 1A
C
2
1 µF
MCP1726 Adjustable Output Voltage
V
IN
= 2.3V to 2.8V
C
1
4.7 µF
V
OUT
8
ADJ 7
C
DELAY
6
PWRGD 5
C
3
1000 pF
R
3
100 k
R
2
20 k
V
OUT
= 1.2V @ 1A
R
1
40 k
1 V
IN
2 V
IN
3 SHDN
4 GND
C
2
1 µF
On
Off
PWRGD
DS20001936D-page 2
2005-2014 Microchip Technology Inc.
MCP1726
Functional Block Diagram
PMOS
V
IN
V
OUT
Undervoltage
Lockout
(UVLO)
I
SNS
C
f
R
f
ADJ
SHDN
Overtemperature
Sensing
Driver w/ Limit
and SHDN
SHDN
V
REF
V
IN
SHDN
Soft-Start
Comp
GND
92% of V
REF
T
DELAY
Reference
+
EA
–
PWRGD
C
DELAY
2005-2014 Microchip Technology Inc.
DS20001936D-page 3
MCP1726
1.0
ELECTRICAL
CHARACTERISTICS
† Notice:
Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
Absolute Maximum Ratings †
V
IN
....................................................................................6.5V
Maximum Voltage on Any Pin .. (GND – 0.3V) to (V
DD
+ 0.3)V
Maximum Junction Temperature, T
J
........................... +150°C
Maximum Power Dissipation ......... Internally-Limited (Note
6)
Storage Temperature.....................................-65°C to +150°C
DC CHARACTERISTICS
Electrical Specifications:
Unless otherwise noted, V
IN
= (V
R
+ 0.5V) or 2.3V, whichever is greater, I
OUT
= 1 mA,
C
IN
= C
OUT
= 4.7 µF (X7R Ceramic), T
A
= +25°C.
Boldface
type applies for junction temperatures, T
J
(Note
7),
of
-40°C to +125°C.
Parameters
Input Operating Voltage
Input Quiescent Current
Input Quiescent Current for
SHDN Mode
Maximum Output Current
Line Regulation
Load Regulation
Output Short-Circuit Current
Adjust Pin Characteristics
Adjust Pin Reference Voltage
Adjust Pin Leakage Current
Adjust Temperature Coefficient
Fixed-Output Characteristics
Voltage Regulation
Dropout Characteristics
Dropout Voltage
Note 1:
2:
3:
4:
5:
6:
V
IN
– V
OUT
—
220
500
mV
I
OUT
= 1A, V
IN(MIN)
= 2.3V
(Note
5)
V
OUT
V
R
– 2.5%
V
R
± 0.5%
V
R
+ 2.5%
V
Note 2
V
ADJ
I
ADJ
TCV
OUT
0.402
-10
—
0.410
±0.01
40
0.418
+10
—
V
nA
ppm/°C
V
IN
= 2.3V to V
IN
= 6.0V,
I
OUT
= 1 mA
V
IN
= 6.0V, V
ADJ
= 0V to 6V
Note 3
Sym.
V
IN
I
q
I
SHDN
I
OUT
V
OUT
/
(V
OUT
x
V
IN
)
V
OUT
/V
OUT
I
OUT_SC
Min.
2.3
—
—
1
—
-1.5
—
140
0.1
—
0.05
±0.5
1.7
Typ.
Max.
6.0
220
3
—
0.3
1.5
—
Units
V
µA
µA
A
%/V
%
A
Note 1
I
L
= 0 mA, V
IN
= V
R
+ 0.5V,
V
OUT
= 0.8V to 5.0V
SHDN = GND
V
IN
= 2.3V to 6.0V (Note
1)
(V
R
+ 0.5)V
V
IN
6V
I
OUT
= 1 mA to 1A,
V
IN
= (V
R
+ 0.6)V (Note
4)
V
IN
= (V
R
+ 0.5)V,
R
LOAD
< 0.1, Peak Current
Conditions
7:
The minimum V
IN
must meet two conditions: V
IN
2.3V and V
IN
V
R
+ 2.5%
V
DROPOUT
.
V
R
is the nominal regulator output voltage for the fixed cases. V
R
= 1.2V, 1.8V, etc. V
R
is the desired set point output
voltage for the adjustable cases. V
R
= V
ADJ
x ((R
1
/R
2
) + 1). See
Figure 4-1.
TCV
OUT
= (V
OUT-HIGH
– V
OUT-LOW
) x 10
6
/(V
R
x
Temperature).
V
OUT-HIGH
is the highest voltage measured over the
temperature range. V
OUT-LOW
is the lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V
IN
= V
R
+ 0.5V.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T
A
, T
J
,
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 125°C can impact device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
DS20001936D-page 4
2005-2014 Microchip Technology Inc.
MCP1726
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications:
Unless otherwise noted, V
IN
= (V
R
+ 0.5V) or 2.3V, whichever is greater, I
OUT
= 1 mA,
C
IN
= C
OUT
= 4.7 µF (X7R Ceramic), T
A
= +25°C.
Boldface
type applies for junction temperatures, T
J
(Note
7),
of
-40°C to +125°C.
Parameters
Power Good Characteristics
Input Voltage Operating Range
for Valid PWRGD
V
PWRGD_VIN
1.0
1.2
PWRGD_THF
PWRGD_THR
PWRGD Output Voltage Low
PWRGD Leakage
PWRGD Time Delay
V
PWRGD_L
P
WRGD_LK
T
PG
—
—
92
92
94
93
0.2
0.1
200
30
300
170
6.0
6.0
%
%
%
%
V
µA
µs
ms
ms
µs
V
T
A
= +25°C
T
A
= -40°C to +125°C
I
SINK
= 100 µA
PWRGD Threshold Voltage
(Referenced to V
OUT
)
88
89
89
90
—
—
—
10
—
Detect Threshold to PWRGD
Active Time Delay
Shutdown Input
Logic-High Input
Logic-Low Input
SHDN Input Leakage Current
AC Performance
Output Delay from SHDN
Output Noise
T
OR
e
N
—
100
2.0
—
µs
µV/Hz
SHDN = GND to V
IN
V
OUT
= GND to 95% V
R
I
OUT
= 200 mA, f = 1 kHz,
C
OUT
= 1 µF (X7R Ceramic),
V
OUT
= 2.5V
f = 100 Hz, C
OUT
= 10 µF,
I
OUT
= 100 mA,
V
INAC
= 30 mV pk-pk,
C
IN
= 0 µF
I
OUT
= 100 µA,
V
OUT
= 1.8V, V
IN
= 2.8V
I
OUT
= 100 µA,
V
OUT
= 1.8V, V
IN
= 2.8V
V
SHDN-HIGH
V
SHDN-LOW
SHDN
ILK
45
—
-0.1
—
—
±0.001
—
15
+0.1
%V
IN
%V
IN
µA
V
IN
= 2.3V to 6.0V
V
IN
= 2.3V to 6.0V
V
IN
= 6V, SHDN = V
IN
,
SHDN = GND
T
VDET-PWRGD
—
96
95
98
96
0.4
—
—
55
—
—
V
OUT
< 2.5V, Falling Edge
V
OUT
> 2.5V, Falling Edge
V
OUT
< 2.5V, Rising Edge
V
OUT
> 2.5V, Rising Edge
I
PWRGD SINK
= 1.2 mA
V
PWRGD
= V
IN
= 6.0V
C
DELAY
= OPEN
C
DELAY
= 0.01 µF
C
DELAY
= 0.1 µF
Sym.
Min.
Typ.
Max.
Units
Conditions
Power Supply Ripple Rejection
Ratio
PSRR
—
54
—
dB
Thermal Shutdown Temperature
Thermal Shutdown Hysteresis
Note 1:
2:
3:
4:
5:
6:
T
SD
T
SD
—
—
150
10
—
—
°C
°C
7:
The minimum V
IN
must meet two conditions: V
IN
2.3V and V
IN
V
R
+ 2.5%
V
DROPOUT
.
V
R
is the nominal regulator output voltage for the fixed cases. V
R
= 1.2V, 1.8V, etc. V
R
is the desired set point output
voltage for the adjustable cases. V
R
= V
ADJ
x ((R
1
/R
2
) + 1). See
Figure 4-1.
TCV
OUT
= (V
OUT-HIGH
– V
OUT-LOW
) x 10
6
/(V
R
x
Temperature).
V
OUT-HIGH
is the highest voltage measured over the
temperature range. V
OUT-LOW
is the lowest voltage measured over the temperature range.
Load regulation is measured at a constant junction temperature using low duty-cycle pulse testing. Load regulation is
tested over a load range from 1 mA to the maximum specified output current.
Dropout voltage is defined as the input-to-output voltage differential at which the output voltage drops 2% below its
nominal value that was measured with an input voltage of V
IN
= V
R
+ 0.5V.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air. (i.e., T
A
, T
J
,
JA
). Exceeding the maximum allowable power
dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
junction temperatures above 125°C can impact device reliability.
The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired junction temperature. The test time is small enough such that the rise in the junction temperature over the
ambient temperature is not significant.
DS20001936D-page 5
2005-2014 Microchip Technology Inc.
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