电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

TAZB106K010CRSB0723

产品描述钽质电容器-固体SMD 10V 100uF 10% CASE B
产品类别无源元件    电容器    钽电容器    钽质电容器-固体SMD   
文件大小382KB,共14页
制造商AVX
标准
下载文档 详细参数 全文预览

TAZB106K010CRSB0723在线购买

供应商 器件名称 价格 最低购买 库存  
TAZB106K010CRSB0723 - - 点击查看 点击购买

TAZB106K010CRSB0723概述

钽质电容器-固体SMD 10V 100uF 10% CASE B

TAZB106K010CRSB0723规格参数

参数名称属性值
厂商名称AVX
产品种类钽质电容器-固体SMD
系列TAZ
电容10 uF
电压额定值 DC10 VDC
容差10 %
ESR8 mOhms
外壳代码 - in1505
外壳代码 - mm3813
高度1.27 mm
制造商库存号B Case
最小工作温度- 55 C
最大工作温度+ 125 C
封装Reel
长度1.27 mm
产品Tantalum Solid Standard Grade - Other Various
端接类型SMD/SMT
宽度1.27 mm
工厂包装数量2500

文档预览

下载PDF文档
TAZ Series
CWR09 - MIL-PRF-55365/4
Established Reliability, COTS-Plus & Space Level
All 4V to 50V ratings are qualified to
MIL-PRF-55365 Weibull “B”, “C”, “D” and “T”
levels, with all surge options (“A”, “B” & “C”)
available.
For Space Level applications, AVX SRC 9000
qualification is recommended (see ratings table
for part number availability).
There are four termination finishes available:
solder plated, fused solder plated, hot solder
dipped and gold plated (these are “H”, “K”, “C”
and “B” termination, respectively, per MIL-PRF-
55365). In addition, the molding compound has
been selected to meet the requirements of
UL94V-0 (Flame Retardancy) and outgassing
requirements of ASTM E-595.
For moisture sensitivity levels please refer to the
High Reliability Tantalum MSL section located in
the back of the High Reliability Tantalum Catalog.
This is the original high reliability molded
tantalum chip series and the case sizes still
represent the most flexible of surface mount
form factors. TAZ offers nine case sizes, eight of
which (A through H) are fully qualified to MIL-
PRF-55365/4, and also includes the original
sub-miniature R case (non-QPL).
This series is fully interchangeable with CWR06
conformal types, while offering the advantages of
molded body/compliant termination construction
(ensuring no TCE mismatch with any substrate).
This construction is compatible with a wide range
of SMT board assembly processes including
wave or reflow solder, conductive epoxy or com-
pression bonding techniques.
The parts also carry full polarity and
capacitance / voltage marking. The five smaller
cases are characterized by their low profile
construction, with the A case being the world’s
smallest molded military tantalum chip.
CASE DIMENSIONS:
Case
Length (L)
Width (W)
Height (H)
Code ±0.38 (0.015) ±0.38 (0.015) ±0.38 (0.015)
Term. Width (W
1
)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
1.27±0.13
(0.050±0.005)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
2.41+0.13/-0.25
(0.095+0.005/-0.010)
3.30±0.13
(0.130±0.005)
2.67±0.13
(0.105±0.005)
3.68+0.13/-0.51
(0.145+0.005/-0.020)
1.0±0.10
(0.039±0.004)
millimeters (inches)
Term. Length (A)
+0.25/-0.13
(+0.010/-0.005)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
0.76 (0.030)
1.27 (0.050)
1.27 (0.050)
0.50 (0.020)
+0.30 (0.012)
-0.20 (0.008)
S min
0.38
(0.015)
1.65
(0.065)
2.92
(0.115)
1.65
(0.065)
2.92
(0.115)
3.43
(0.135)
3.56
(0.140)
4.06
(0.160)
0.71
(0.028)
Typical
Weight (g)
0.016
0.025
0.035
0.045
0.065
0.125
0.205
0.335
0.010
MARKING
(White marking on black body)
Polarity Stripe (+)
Capacitance Code
Rated Voltage
A
B
C
D
E
F
G
H
R
2.54 (0.100)
3.81 (0.150)
5.08 (0.200)
3.81 (0.150)
5.08 (0.200)
5.59 (0.220)
6.73 (0.265)
7.24 (0.285)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
2.54 (0.100)
2.54 (0.100)
3.43 (0.135)
2.79 (0.110)
3.81 (0.150)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.27 (0.050)
1.78 (0.070)
2.79 (0.110)
2.79 (0.110)
1.20 (0.047)
max
1.30 (0.051)
2.05 (0.081) +0.20 (0.008)
±0.20 (0.008) -0.10 (0.004)
CWR09 MIL-PRF-55365/4
CAPACITANCE AND RATED VOLTAGE, V
R
(VOLTAGE CODE) RANGE (LETTER DENOTES CASE SIZE)
Capacitance
μF
Code
0.10
104
0.15
154
0.22
224
0.33
334
0.47
474
0.68
684
1.0
105
1.5
155
2.2
225
3.3
335
4.7
475
6.8
685
10
106
15
156
22
226
33
336
47
476
68
686
100
107
4V (C)
6V (D)
10V (F)
Rated Voltage DC (V
R
) at 85ºC
15V (H)
20V (J)
25V (K)
35V (M)
50V (N)
A
A
B
B
C
D
E
F
F
G
H
A
R
R
R
A
A/R
A
A/R
B
C
D
E
F
G
H
G
H
B
C
D
E
F
G
H
B
C
D
E
F
G
H
B
C
D
E
F
G
H
A
A
B
B
C
D
E
F
B
C
D
E
F
G
G
H
B
C
D
E
F
G
H
8
请问高手使用的GPRS模块类型的问题
因为设计要移植wap协议到arm开发板上,现在只是初步编译通过了kannel网关。接下来的购买GPRS模块不知道该怎么选择,不知道哪位大侠有这方面的经验的,可以介绍一下哪种模块比较适合。有没有 ......
七七零零 嵌入式系统
晶体二极管的分类
晶体二极管的分类 根据用途分类 1、检波用二极管   就原理而言,从输入信号中取出调制信号是检波,以整流电流的大小(100mA)作为界 线通常把输出电流小于100mA的叫检波。锗材料点 ......
fighting 能源基础设施
Vishay推出新型超薄电感2525CZ-11,厚度仅为3.0毫米
日前,Vishay Intertechnology, Inc.宣布推出占位面积为2525,厚度仅为3.0毫米并且具有1.0μH~22μH电感值的新型器件,从而扩展了其超薄、高电流的IHLP电感器系列。 凭借在各自封装尺寸类别中 ......
frozenviolet 分立器件
【TI首届低功耗设计大赛】试玩Hijack(5):暗送秋波——逻辑门小实验
本帖最后由 sacq 于 2014-11-29 16:27 编辑 闲话:虽已是冬季,但还是想八卦一下,在过去的秋季里,童鞋们都收获(送出)了多少“菠菜”呢? 这里借用手机里Hijack的“眼球”做个小实验,看 ......
sacq 微控制器 MCU
ST啥时候出第二代的Cortex-M3
ST啥时候出第二代的Cortex-M3 据说速度更快,LPC1700可达120M 另外,片内HSI振荡器进入PLL之前不要分频就好了!或者PLL倍数再增大一些...
seawave2000 stm32/stm8
解读高速数模转换器(DAC)的建立和保持时间
为了达到高速数/模转换器(DAC)的最佳性能,需要严格满足数字信号的时序要求。随着时钟频率的提高,数字接口的建立和保持时间成为系统设计人员需要重点关注的参数。本应用笔记对建立和保持时间进 ......
sairvee 模拟电子

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 631  1008  2429  463  2558  38  11  50  27  9 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved