UART 接口集成电路 UART I2C/SPI
| 参数名称 | 属性值 |
| Brand Name | NXP Semiconductor |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | QFN |
| 包装说明 | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN24 |
| 针数 | 24 |
| 制造商包装代码 | SOT616-3 |
| Reach Compliance Code | compliant |
| 其他特性 | ALSO OPERATES AT 2.5V SUPPLY |
| 地址总线宽度 | 2 |
| 边界扫描 | NO |
| 最大时钟频率 | 80 MHz |
| 通信协议 | ASYNC, BIT |
| 最大数据传输速率 | 0.625 MBps |
| JESD-30 代码 | S-PQCC-N24 |
| JESD-609代码 | e4 |
| 长度 | 4 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 1 |
| 串行 I/O 数 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HVQCCN |
| 封装等效代码 | LCC24,.16SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 2.5/3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1 mm |
| 最大供电电压 | 3.6 V |
| 最小供电电压 | 3 V |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | NICKEL PALLADIUM GOLD |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 4 mm |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
| SC16IS760IBS,151 | SC16IS750IBS,151 | SC16IS760IPW,112 | SC16IS750IBS,157 | SC16IS750IPW,112 | SC16IS740IPW/Q900, | |
|---|---|---|---|---|---|---|
| 描述 | UART 接口集成电路 UART I2C/SPI | UART Interface IC UART I2C/SPI | UART 接口集成电路 I2C/SPI-UARTBRIDGE W/IRDA AND GPIO | UART 接口集成电路 I2C/SPI-UARTBRIDGE | UART 接口集成电路 I2C/SPI-UARTBRIDGE | UART 接口集成电路 I2C/SPI-UART BRIDGE W/IRDA |
| Brand Name | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | NXP Semiconductor | - |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | - |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - | NXP(恩智浦) |
| 零件包装代码 | QFN | QFN | TSSOP2 | QFN | TSSOP2 | - |
| 包装说明 | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN24 | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN24 | 4.40 MM, PLASTIC, MO-153, SOT355-1, TSSOP-24 | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN-24 | TSSOP, TSSOP24,.25 | - |
| 针数 | 24 | 24 | 24 | 24 | 24 | - |
| 制造商包装代码 | SOT616-3 | SOT616-3 | SOT355-1 | SOT616-3 | SOT355-1 | - |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | - |
| 其他特性 | ALSO OPERATES AT 2.5V SUPPLY | ALSO OPERATES AT 2.5V SUPPLY | CAN ALSO OPERATES AT 2.5 V SUPPLY | CAN ALSO OPERATES AT 2.5 V SUPPLY | CAN ALSO OPERATES AT 2.5 V SUPPLY | - |
| 地址总线宽度 | 2 | 2 | 2 | 2 | 2 | - |
| 边界扫描 | NO | NO | NO | NO | NO | - |
| 最大时钟频率 | 80 MHz | 80 MHz | 80 MHz | 80 MHz | 80 MHz | - |
| 通信协议 | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | - |
| 最大数据传输速率 | 0.625 MBps | 0.625 MBps | 0.625 MBps | 0.625 MBps | 0.625 MBps | - |
| JESD-30 代码 | S-PQCC-N24 | S-PQCC-N24 | R-PDSO-G24 | S-PQCC-N24 | R-PDSO-G24 | - |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 | - |
| 长度 | 4 mm | 4 mm | 7.8 mm | 4 mm | 7.8 mm | - |
| 低功率模式 | YES | YES | YES | YES | YES | - |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | - |
| 串行 I/O 数 | 1 | 1 | 1 | 1 | 1 | - |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | - |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | HVQCCN | HVQCCN | TSSOP | HVQCCN | TSSOP | - |
| 封装等效代码 | LCC24,.16SQ,20 | LCC24,.16SQ,20 | TSSOP24,.25 | LCC24,.16SQ,20 | TSSOP24,.25 | - |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | - |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | - |
| 电源 | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | 2.5/3.3 V | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 1 mm | 1 mm | 1.1 mm | 1 mm | 1.1 mm | - |
| 最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - |
| 最小供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | - |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 表面贴装 | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子面层 | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | - |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | NO LEAD | GULL WING | - |
| 端子节距 | 0.5 mm | 0.5 mm | 0.65 mm | 0.5 mm | 0.65 mm | - |
| 端子位置 | QUAD | QUAD | DUAL | QUAD | DUAL | - |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | - |
| 宽度 | 4 mm | 4 mm | 4.4 mm | 4 mm | 4.4 mm | - |
| uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | - |
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