
监控电路 Push-Pull Low
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Microchip(微芯科技) |
| 零件包装代码 | SOT-23 |
| 包装说明 | TSOP, SOP3,.09,38 |
| 针数 | 3 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Factory Lead Time | 15 weeks |
| Samacsys Description | uP supervisor IC,MCP809T-300I/TT 2.925V |
| 可调阈值 | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G3 |
| JESD-609代码 | e3 |
| 长度 | 2.92 mm |
| 湿度敏感等级 | 1 |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 3 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP |
| 封装等效代码 | SOP3,.09,38 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 电源 | 1/5.5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.12 mm |
| 最大供电电流 (Isup) | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1 V |
| 标称供电电压 (Vsup) | 2.85 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed |
| 端子形式 | GULL WING |
| 端子节距 | 0.95 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 1.3 mm |

| MCP809T-300I/TT | MCP810T-300I-TT | MCP810T-460I-TT | MCP810T-475I-TT | MCP809T-460I/TT | MCP810T-450I/TT | MCP809T-450I/TT | |
|---|---|---|---|---|---|---|---|
| 描述 | 监控电路 Push-Pull Low | Supervisory Circuits Push-Pull High | Supervisory Circuits Push-Pull High | Supervisory Circuits Push-Pull High | 监控电路 Push-Pull Low | 监控电路 Push-Pull High | 监控电路 Push-Pull Low |
| 是否无铅 | 不含铅 | - | - | - | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | - | - | - | 符合 | 符合 | 符合 |
| 零件包装代码 | SOT-23 | - | - | - | SOT-23 | SOT-23 | SOT-23 |
| 包装说明 | TSOP, SOP3,.09,38 | - | - | - | TSOP, TO-236 | TSOP, TO-236 | TSOP, TO-236 |
| 针数 | 3 | - | - | - | 3 | 3 | 3 |
| Reach Compliance Code | compliant | - | - | - | compliant | compliant | compliant |
| ECCN代码 | EAR99 | - | - | - | EAR99 | EAR99 | EAR99 |
| Factory Lead Time | 15 weeks | - | - | - | 3 weeks 1 day | 15 weeks | 15 weeks |
| 可调阈值 | NO | - | - | - | NO | NO | NO |
| 模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | - | - | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
| JESD-30 代码 | R-PDSO-G3 | - | - | - | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 |
| JESD-609代码 | e3 | - | - | - | e3 | e3 | e3 |
| 长度 | 2.92 mm | - | - | - | 2.92 mm | 2.92 mm | 2.92 mm |
| 湿度敏感等级 | 1 | - | - | - | 1 | 1 | 1 |
| 信道数量 | 1 | - | - | - | 1 | 1 | 1 |
| 功能数量 | 1 | - | - | - | 1 | 1 | 1 |
| 端子数量 | 3 | - | - | - | 3 | 3 | 3 |
| 最高工作温度 | 85 °C | - | - | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | - | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP | - | - | - | TSOP | TSOP | TSOP |
| 封装等效代码 | SOP3,.09,38 | - | - | - | TO-236 | TO-236 | TO-236 |
| 封装形状 | RECTANGULAR | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | - | - | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | - | - | - | 260 | 260 | 260 |
| 电源 | 1/5.5 V | - | - | - | 1/5.5 V | 1/5.5 V | 1/5.5 V |
| 认证状态 | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.12 mm | - | - | - | 1.12 mm | 1.12 mm | 1.12 mm |
| 最大供电电流 (Isup) | 0.06 mA | - | - | - | 0.06 mA | 0.06 mA | 0.06 mA |
| 最大供电电压 (Vsup) | 5.5 V | - | - | - | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1 V | - | - | - | 1 V | 1 V | 1 V |
| 标称供电电压 (Vsup) | 2.85 V | - | - | - | 4.35 V | 4.25 V | 4.25 V |
| 表面贴装 | YES | - | - | - | YES | YES | YES |
| 温度等级 | INDUSTRIAL | - | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) - annealed | - | - | - | Matte Tin (Sn) | Matte Tin (Sn) - annealed | Matte Tin (Sn) |
| 端子形式 | GULL WING | - | - | - | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.95 mm | - | - | - | 0.95 mm | 0.95 mm | 0.95 mm |
| 端子位置 | DUAL | - | - | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | - | - | - | 40 | 40 | 40 |
| 宽度 | 1.3 mm | - | - | - | 1.3 mm | 1.3 mm | 1.3 mm |
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