Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> CPU - 中央处理器> CM8067703016211S R35V

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CM8067703016211S R35V: 产品描述CPU - 中央处理器 64BIT MPU; 产品类别半导体嵌入式处理器和控制器 CPU - 中央处理器; 文件大小779KB，共113页; 制造商Intel(英特尔); 官网地址http://www.intel.com/; 标准

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CM8067703016211S R35V概述

CPU - 中央处理器 64BIT MPU

CM8067703016211S R35V规格参数

参数名称	属性值
厂商名称	Intel(英特尔)
产品种类	CPU - 中央处理器
产品	Desktop Processors
封装 / 箱体	FCLGA-1151
系列	Intel Celeron
核心	Intel Celeron
代码名称	Kaby Lake
处理器系列	G3930T
嵌入式选项	Non-Embedded
内核数量	2 Core
TDP - 最大	35 W
最大时钟频率	2.7 GHz
数据总线宽度	64 bit
存储容量	64 GB
存储类型	DDR3L-1333/1600, DDR4-2133
系统总线类型	DMI3
系统总线速度	8 GT/s
高速缓冲存储器	2 MB
最大工作温度	+ 92 C
封装	Tray
系列	G3930T
封装 / 箱体尺寸	37.5 mm x 37.5 mm
安装风格	SMD/SMT
CPU配置 - 最大	1 Configuration
支持ECC存储器	Supported
Intel虚拟化技术 - VT	With VT
光刻工艺技术	14 nm
支持的显示器数量	3 Display
存储器通道数量	2 Channel
PCI Express通道数量	16 Lane
QPI链接数量	0
线程数量	2 Thread
工作电源电压	1.35 V
PCIe配置	1x16, 2x8, 1x8 + 2x4
PCIe修订版	Revision 3.0
工厂包装数量	1

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Desktop 3rd Generation Intel

Core™ Processor Family, Desktop

Intel

Pentium

Processor Family,

and Desktop Intel

Celeron

Processor Family

Datasheet – Volume 1 of 2

November 2013

Document Number: 326764-008

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED,

BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS

PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER

AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING

LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY

PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

A "Mission Critical Application" is any application in which failure of the Intel Product could result, directly or indirectly, in personal

injury or death. SHOULD YOU PURCHASE OR USE INTEL'S PRODUCTS FOR ANY SUCH MISSION CRITICAL APPLICATION, YOU

SHALL INDEMNIFY AND HOLD INTEL AND ITS SUBSIDIARIES, SUBCONTRACTORS AND AFFILIATES, AND THE DIRECTORS,

OFFICERS, AND EMPLOYEES OF EACH, HARMLESS AGAINST ALL CLAIMS COSTS, DAMAGES, AND EXPENSES AND REASONABLE

ATTORNEYS' FEES ARISING OUT OF, DIRECTLY OR INDIRECTLY, ANY CLAIM OF PRODUCT LIABILITY, PERSONAL INJURY, OR DEATH

ARISING IN ANY WAY OUT OF SUCH MISSION CRITICAL APPLICATION, WHETHER OR NOT INTEL OR ITS SUBCONTRACTOR WAS

NEGLIGENT IN THE DESIGN, MANUFACTURE, OR WARNING OF THE INTEL PRODUCT OR ANY OF ITS PARTS.

Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the

absence or characteristics of any features or instructions marked "reserved" or "undefined". Intel reserves these for future

definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The

information here is subject to change without notice. Do not finalize a design with this information.

The products described in this document may contain design defects or errors known as errata which may cause the product to

deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.

Copies of documents which have an order number and are referenced in this document, or other Intel literature, may be obtained

by calling 1-800-548-4725, or go to: http://www.intel.com/design/literature.htm.

No computer system can provide absolute security under all conditions. Intel

Trusted Execution Technology (Intel

TXT) requires

a computer system with Intel

Virtualization Technology, an Intel TXT-enabled processor, chipset, BIOS, Authenticated Code

Modules and an Intel TXT-compatible measured launched environment (MLE). The MLE could consist of a virtual machine monitor,

an OS or an application. In addition, Intel TXT requires the system to contain a TPM v1.2, as defined by the Trusted Computing

Group and specific software for some uses. For more information, see

http://www.intel.com/technology/security/

Intel

Virtualization Technology requires a computer system with an enabled Intel® processor, BIOS, virtual machine monitor

(VMM) and, for some uses, certain computer system software enabled for it. Functionality, performance or other benefits will vary

depending on hardware and software configurations and may require a BIOS update. Software applications may not be compatible

with all operating systems. Please check with your application vendor.

Intel

Active Management Technology requires the computer system to have an Intel(R) AMT-enabled chipset, network hardware

and software, as well as connection with a power source and a corporate network connection. Setup requires configuration by the

purchaser and may require scripting with the management console or further integration into existing security frameworks to

enable certain functionality. It may also require modifications of implementation of new business processes. With regard to

notebooks, Intel AMT may not be available or certain capabilities may be limited over a host OS-based VPN or when connecting

wirelessly, on battery power, sleeping, hibernating or powered off. For more information, see

http://www.intel.com/technology/

platform-technology/intel-amt/

Hyper-Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology-

enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. For

more information including details on which processors support HT Technology, see

http://www.intel.com/info/hyperthreading.

“Intel® Turbo Boost Technology requires a PC with a processor with Intel Turbo Boost Technology capability. Intel Turbo Boost

Technology performance varies depending on hardware, software and overall system configuration. Check with your PC

manufacturer on whether your system delivers Intel Turbo Boost Technology.For more information, see

http://www.intel.com/

technology/turboboost.”

Enhanced Intel SpeedStep

Technology See the

Processor Spec Finder

or contact your Intel representative for more information.

Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family,

not across different processor families. See

www.intel.com/products/processor_number for details.

64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device

drivers and applications enabled for Intel® 64 architecture. Performance will vary depending on your hardware and software

configurations. Consult with your system vendor for more information.

Intel, Pentium, Celeron, Intel Core, and the Intel logo are trademarks of Intel Corporation in the U.S. and other countries.

*Other names and brands may be claimed as the property of others.

Datasheet, Volume 1



Contents

Introduction

.............................................................................................................. 9

1.1

Processor Feature Details ................................................................................... 11

1.1.1 Supported Technologies .......................................................................... 11

1.2

Interfaces ........................................................................................................ 11

1.2.1 System Memory Support ......................................................................... 11

1.2.2 PCI Express* ......................................................................................... 12

1.2.3 Direct Media Interface (DMI).................................................................... 14

1.2.4 Platform Environment Control Interface (PECI) ........................................... 14

1.2.5 Processor Graphics ................................................................................. 14

1.2.6 Intel

Flexible Display Interface (Intel

FDI) ............................................. 15

1.3

Power Management Support ............................................................................... 15

1.3.1 Processor Core....................................................................................... 15

1.3.2 System ................................................................................................. 15

1.3.3 Memory Controller.................................................................................. 15

1.3.4 PCI Express* ......................................................................................... 16

1.3.5 Direct Media Interface (DMI).................................................................... 16

1.3.6 Processor Graphics Controller (GT) ........................................................... 16

1.3.7 Thermal Management Support ................................................................. 16

1.4

Processor SKU Definitions................................................................................... 16

1.5

Package ........................................................................................................... 17

1.6

Processor Compatibility ...................................................................................... 18

1.7

Terminology ..................................................................................................... 19

1.8

Related Documents ........................................................................................... 22

Interfaces................................................................................................................

2.1

System Memory Interface .................................................................................. 23

2.1.1 System Memory Technology Supported ..................................................... 23

2.1.2 System Memory Timing Support............................................................... 24

2.1.3 System Memory Organization Modes......................................................... 25

2.1.3.1 Single-Channel Mode................................................................. 25

2.1.3.2 Dual-Channel Mode – Intel

Flex Memory Technology Mode ........... 25

2.1.4 Rules for Populating Memory Slots ............................................................ 26

2.1.5 Technology Enhancements of Intel

Fast Memory Access (Intel

FMA).......... 27

2.1.5.1 Just-in-Time Command Scheduling.............................................. 27

2.1.5.2 Command Overlap .................................................................... 27

2.1.5.3 Out-of-Order Scheduling ............................................................ 27

2.1.6 Data Scrambling .................................................................................... 27

2.1.7 DDR3 Reference Voltage Generation ......................................................... 27

2.2

PCI Express* Interface....................................................................................... 28

2.2.1 PCI Express* Architecture ....................................................................... 28

2.2.1.1 Transaction Layer ..................................................................... 29

2.2.1.2 Data Link Layer ........................................................................ 29

2.2.1.3 Physical Layer .......................................................................... 29

2.2.2 PCI Express* Configuration Mechanism ..................................................... 30

2.2.3 PCI Express* Port................................................................................... 31

2.2.3.1 PCI Express* Lanes Connection .................................................. 31

2.3

Direct Media Interface (DMI)............................................................................... 32

2.3.1 DMI Error Flow....................................................................................... 32

2.3.2 Processor / PCH Compatibility Assumptions................................................ 32

2.3.3 DMI Link Down ...................................................................................... 32

2.4

Processor Graphics Controller (GT) ...................................................................... 33

Datasheet, Volume 1

2.5

2.6

3D and Video Engines for Graphics Processing ............................................33

2.4.1.1 3D Engine Execution Units ..........................................................33

2.4.1.2 3D Pipeline ...............................................................................34

2.4.1.3 Video Engine ............................................................................34

2.4.1.4 2D Engine ................................................................................35

2.4.2 Processor Graphics Display ......................................................................36

2.4.2.1 Display Planes ..........................................................................36

2.4.2.2 Display Pipes ............................................................................37

2.4.2.3 Display Ports ............................................................................37

2.4.3 Intel

Flexible Display Interface (Intel

FDI) .............................................37

2.4.4 Multi Graphics Controllers Multi-Monitor Support .........................................37

Platform Environment Control Interface (PECI) ......................................................38

Interface Clocking..............................................................................................38

2.6.1 Internal Clocking Requirements ................................................................38

2.4.1

Technologies............................................................................................................39

3.1

Intel

Virtualization Technology (Intel

VT) ..........................................................39

3.1.1 Intel

Virtualization Technology (Intel

VT) for

IA-32, Intel

64 and Intel

Architecture



(Intel

VT-x) Objectives ..........................................................................39

3.1.2 Intel

Virtualization Technology (Intel

VT) for

IA-32, Intel

64 and Intel

Architecture



(Intel

VT-x) Features ............................................................................40

3.1.3 Intel

Virtualization Technology (Intel

VT) for Directed

I/O (Intel

VT-d) Objectives ....................................................................40

3.1.4 Intel

Virtualization Technology (Intel

VT) for Directed

I/O (Intel

VT-d) Features.......................................................................41

3.1.5 Intel

Virtualization Technology (Intel

VT) for Directed

I/O (Intel

VT-d) Features Not Supported..................................................41

3.2

Intel

Trusted Execution Technology (Intel

TXT) .................................................42

3.3

Intel

Hyper-Threading Technology (Intel

HT Technology) ....................................42

3.4

Intel

Turbo Boost Technology ............................................................................43

3.4.1 Intel

Turbo Boost Technology Frequency..................................................43

3.4.2 Intel

Turbo Boost Technology Graphics Frequency.....................................43

3.5

Intel

Advanced Vector Extensions (Intel

AVX)....................................................44

3.6

Security and Cryptography Technologies...............................................................44

3.6.1 Intel

Advanced Encryption Standard New Instructions (Intel

AES-NI) ........44

3.6.2 PCLMULQDQ Instruction ..........................................................................44

3.6.3 RDRAND Instruction ................................................................................45

3.7

Intel

64 Architecture x2APIC .............................................................................45

3.8

Supervisor Mode Execution Protection (SMEP) .......................................................46

3.9

Power Aware Interrupt Routing (PAIR)..................................................................46

Power Management

.................................................................................................47

4.1

Advanced Configuration and Power Interface

(ACPI) States Supported.....................................................................................48

4.1.1 System States........................................................................................48

4.1.2 Processor Core / Package Idle States.........................................................48

4.1.3 Integrated Memory Controller States .........................................................48

4.1.4 PCI Express* Link States .........................................................................49

4.1.5 Direct Media Interface (DMI) States ..........................................................49

4.1.6 Processor Graphics Controller States .........................................................49

4.1.7 Interface State Combinations ...................................................................49

4.2

Processor Core Power Management ......................................................................50

4.2.1 Enhanced Intel

SpeedStep

Technology ..................................................50

4.2.2 Low-Power Idle States.............................................................................50

4.2.3 Requesting Low-Power Idle States ............................................................52

Datasheet, Volume 1



4.3

4.4

4.5

4.6

4.7

Core C-states ........................................................................................ 52

4.2.4.1 Core C0 State........................................................................... 52

4.2.4.2 Core C1 / C1E State .................................................................. 53

4.2.4.3 Core C3 State........................................................................... 53

4.2.4.4 Core C6 State........................................................................... 53

4.2.4.5 C-State Auto-Demotion ............................................................. 53

4.2.5 Package C-States ................................................................................... 54

4.2.5.1 Package C0 .............................................................................. 55

4.2.5.2 Package C1/C1E ....................................................................... 55

4.2.5.3 Package C3 State...................................................................... 56

4.2.5.4 Package C6 State...................................................................... 56

Integrated Memory Controller (IMC) Power Management ........................................ 56

4.3.1 Disabling Unused System Memory Outputs ................................................ 56

4.3.2 DRAM Power Management and Initialization ............................................... 57

4.3.2.1 Initialization Role of CKE ............................................................ 58

4.3.2.2 Conditional Self-Refresh ............................................................ 58

4.3.2.3 Dynamic Power Down Operation ................................................. 59

4.3.2.4 DRAM I/O Power Management .................................................... 59

4.3.3 DDR Electrical Power Gating (EPG) ........................................................... 59

PCI Express* Power Management ........................................................................ 60

DMI Power Management..................................................................................... 60

Graphics Power Management .............................................................................. 60

4.6.1 Intel

Rapid Memory Power Management (Intel

RMPM)



(also known as CxSR) ............................................................................. 60

4.6.2 Intel

Graphics Performance Modulation Technology (Intel

GPMT) .............. 60

4.6.3 Graphics Render C-State ......................................................................... 60

4.6.4 Intel

Smart 2D Display Technology (Intel

S2DDT) .................................. 61

4.6.5 Intel

Graphics Dynamic Frequency.......................................................... 61

Graphics Thermal Power Management .................................................................. 61

4.2.4

Thermal Management

.............................................................................................. 63

Signal Description

................................................................................................... 65

6.1

System Memory Interface Signals........................................................................ 66

6.2

Memory Reference and Compensation Signals ....................................................... 67

6.3

Reset and Miscellaneous Signals.......................................................................... 68

6.4

PCI Express*-based Interface Signals .................................................................. 69

6.5

Intel

Flexible Display (Intel

FDI) Interface Signals ............................................. 69

6.6

Direct Media Interface (DMI) Signals.................................................................... 70

6.7

Phase Lock Loop (PLL) Signals ............................................................................ 70

6.8

Test Access Points (TAP) Signals ......................................................................... 70

6.9

Error and Thermal Protection Signals ................................................................... 71

6.10 Power Sequencing Signals .................................................................................. 72

6.11 Processor Power Signals ..................................................................................... 73

6.12 Sense Signals ................................................................................................... 73

6.13 Ground and Non-Critical to Function (NCTF) Signals ............................................... 74

6.14 Processor Internal Pull-Up / Pull-Down Resistors.................................................... 74

Electrical Specifications

........................................................................................... 75

7.1

Power and Ground Lands.................................................................................... 75

7.2

Decoupling Guidelines ........................................................................................ 75

7.2.1 Voltage Rail Decoupling........................................................................... 75

7.3

Processor Clocking (BCLK[0], BCLK#[0]) .............................................................. 76

7.3.1 Phase Lock Loop (PLL) Power Supply......................................................... 76

7.4

VCC Voltage Identification (VID).......................................................................... 76

7.5

System Agent (SA) V

VID................................................................................ 80

7.6

Reserved or Unused Signals................................................................................ 80

Datasheet, Volume 1

CM8067703016211S R35V

CM8067703016211S R35V概述

CM8067703016211S R35V规格参数

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