Military COTS 270 V
IN
Filter
M-FIAM3
Actual size:
2.28 x 2.2 x 0.5in
57,9 x 55,9 x 12,7mm
Model Number
M-FIAM3M21*
Input Attenuator Module
Features & Benefits
•
EMI filtering-MIL-STD-461E
[1]
•
Transient protection-MIL-STD-704E/F
•
Environments-MIL-STD-810, MIL-STD-202
•
Environmental stress screening
•
Low profile mounting options
•
Output current up to 3A
•
Mini sized package
•
Inrush current limiting
Absolute Maximum Rating
Parameter
+IN to –IN
Mounting torque
Pin Soldering temperature
Rating
375
400
5 (0.57)
500 (260)
750 (390)
Unit
V
DC
V
DC
in-lbs
°F (°C)
°F (°C)
Notes
Continuous
100ms
6 each, #4-40 or M3
<5sec; wave solder
<7sec; hand solder
Thermal Resistance and Capacity
Parameter
Baseplate to sink
flat, greased surface
with thermal pad (P/N 20264)
Baseplate to ambient
Free convection
1000LFM
Min
Typ
0.16
0.1
7.9
2.2
Max
Unit
°C/Watt
°C/Watt
°C/Watt
°C/Watt
Product Highlights
The M-FIAM3 is a DC front-end module
that provides EMI filtering and transient
protection. The M-FIAM3 enables designers
using Vicor’s Maxi, Mini, Micro Series 300V
DC-DC converters to meet conducted emission/
conducted susceptibility per MIL-STD-461E;
and input transients per MIL-STD-704E/F. The
M-FIAM3 accepts an input voltage of
180 – 375V
DC
and delivers output
current up to 3A.
M-FIAM3 is housed in an industry
standard “half brick” module measuring
2.28” x 2.2” x 0.5” and depending upon
model selected, may be mounted on-board
or in-board for height critical applications.
MTBF per MIL-HDBK-217F (M-FIAM3M21)
Temperature
25°C
50°C
65°C
Environment
Ground Benign: G.B.
Naval Sheltered: N.S.
Airborne Inhabited Cargo: A.I.C.
MTBF
13,291
2,392
1,874
Unit
1,000Hrs
1,000Hrs
1,000Hrs
Part Numbering
Compatible Products
•
Maxi, Mini, Micro Series 300V Input
DC-DC converters
[1]
M-FIAM3
Product
M
Product Grade Temperatures (°C)
Grade
Operating
Storage
H
=
–40 to +100 – 55 to +125
M
=
–55 to +100 – 65 to +125
1
=
2
=
S
=
N
=
F
=
G
=
K
=
2
Pin Style
Short Pin
Long Pin
Short ModuMate
[2]
Long ModuMate
[2]
Short RoHS
Long RoHS
Extra Long RoHS
[3]
1
Baseplate
1
= Slotted
2
= Threaded
3
= Thru hole
EMI performance is subject to a wide variety of
external influences such as PCB construction, circuit
layout etc. External components in addition to those
listed herein may be required in specific instances
to gain full compliance to the standards specified at
various line and load conditions.
[2]
[3]
Compatible with SurfMate and InMate socketing system
Not intended for socket or Surfmate mounting
M-FIAM3
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M-FIAM3M21
Specifications
(Typical at T
BP
= 25°C, nominal line and 75% load, unless otherwise specified)
INPUT SPECIFICATIONS
Parameter
Input voltage
Inrush limiting
Transient immunity
Min
180
Typ
270
Max
375
0.018
Unit
V
DC
A/µF
Exceeds limits of MIL-STD-704E/F
Notes
Continuous
OUTPUT SPECIFICATIONS
Parameter
Output current
Efficiency
Internal voltage drop
External capacitance
10
22
µF
96
98
3.0
Min
Typ
Max
3
5.0
Unit
A
%
V
@ 3A, 100°C baseplate
See Figure 5 on page 4.
400V
Notes
CONTROL PIN SPECIFICATIONS
Parameter
ON/OFF control
Enable (ON)
Disable (OFF)
Min
0.0
3.5
Typ
Max
1.0
5.0
Unit
V
DC
V
DC
Notes
Referenced to – V
OUT
100kΩ internal pull-up resistor
SAFETY SPECIFICATIONS
Parameter
Min
1,500
2,121
Typ
Max
Unit
V
RMS
V
DC
Notes
Input/Output to Base
Input/Output to Base
D
ielectric withstand
EMI
Standard
MIL-STD-461E
Conducted emissions:
Conducted susceptibility:
Test Procedure
CE101, CE102
CS101, CS114, CS115, CS116
Notes
EMI performance is subject to a wide variety of external influences such as PCB construction, circuit layout etc. As such, external components in addition
to those listed herein may be required in specific instances to gain full compliance to the standards specified.
M-FIAM3
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M-FIAM3M21
Specifications (Cont.)
GENERAL SPECIFICATIONS
Parameter
Min
Typ
Max
Unit
Notes
Weight
Warranty
3.3 (94)
2
Ounces (grams)
Years
ENVIRONMENTAL QUALIFICATION
Altitude
MIL-STD-810F, Method 500.4, Procedure I & II, 40,000ft. and 70,000ft. Operational.
Explosive Atmosphere
MIL-STD-810F, Method 511.4, Procedure I, Operational.
Vibration
MIL-STD-810F, Method 514.5, Procedure I, Category 14, Sine and Random vibration per Table 514.5C for Helicopter AH-6J Main Rotor with overall level
of 5.6Grms for 4 hours per axis. MIL-STD-810F, Method 514.5C, General Minimum Integrity Curve per Figure 514.5C-17 with overall level of 7.7Grms
for 1 hour per axis.
Shock
MIL-STD-810F, Method 516.5, Procedure I, Functional Shock, 40g. MIL-S-901D, Lightweight Hammer Shock, 3 impacts/axis, 1,3,5 ft.
MIL-STD-202F, Method 213B, 60g, 9ms half sine. MIL-STD-202F, Method 213B, 75g, 11ms Saw Tooth Shock.
Acceleration
MIL-STD-810F, Method 513.5, Procedure II, table 513.5-II, Operational, 2-7g, 6 directions.
Humidity
MIL-STD-810F, Method 507.4.
Solder Test
MIL-STD-202G, Method 208H, 8 hour aging.
ENVIRONMENTAL STRESS SCREENING
Parameter
Operating temperature
Storage temperature
Temperature cycling*
Ambient test @ 25°C
Power cycling burn-in
Functional and parametric ATE tests
Hi-Pot test
Visual inspection
Test data
H-Grade
-40°C to +100°C
-55°C to +125°C
12 cycles
-65°C to +100°C
Yes
12 hours, 29 cycles
-40°C and +100°C
Yes
Yes
M-Grade
-55°C to +100°C
-65°C to +125°C
12 cycles
-65°C to +100°C
Yes
24 hours, 58 cycles
-55°C and +100°C
Yes
Yes
vicorpower.com
vicorpower.com
*Temperature cycled with power off, 17°C per minute rate of change.
Storage
Vicor products, when not installed in customer units, should be stored in ESD safe packaging in accordance with ANSI/ESD S20.20,
“Protection of Electrical and Electronic Parts, Assemblies and Equipment” and should be maintained in a temperature controlled factory/
warehouse environment not exposed to outside elements controlled between the temperature ranges of 15°C and 38°C. Humidity shall not
be condensing, no minimum humidity when stored in an ESD compliant package.
M-FIAM3
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M-FIAM3M21
Output
Input
Figure 1 —
Conducted noise; M-FIAM3 and V300A48C500BG
DC-DC converter operating at 270V
DC
input at 450W
Figure 2 —
Transient Immunity; M-FIAM3 output response to an
input transient
M-FIAM3 Diff. & Comm. Mode Insertion Loss
10.000
0.000
-10.000
IL [dB]
-20.000
-30.000
-40.000
-50.000
-60.000
-70.000
0.01
0.1
1
Diff. Mode IL
Comm. Mode IL
10
Frequency [MHz]
Figure 3 —
Inrush Limiting; Inrush current with 22µF external
capacitance, (C1 in Figure 5)
Figure 4 —
Insertion Loss Curve
Note:
The M-FIAM
3
is shown in the on state. To disable,
open the connection between ON/OFF and –OUT.
4700pF
Y2 type
+IN
+OUT
0.01µF
+IN
+OUT
F1
Input
MOV P/N
30076
NC
EMI
GND
–IN
M-FIAM3
NC
NC
ON
OFF
–OUT
C1
0.3µF
PC
PR
–IN
Maxi, Mini, Micro
300 Vdc Input
DC-DC Converter
+S
SC
–S
–OUT
4700pF
Y2 type
0.01µF
Component Suggestions
Recommended Fuse: (F1) 3A Max., Bussmann ABC style
Capacitance: (C1)10µF(min), 22µF(max)
Figure 5 —
Basic connection diagram with Transient, Surge Protection and Recommended Reverse Polarity Protection
M-FIAM3
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M-FIAM3M21
Mechanical Drawings
Module Pins
No.
1
2
3
4
5
2
3
4
Function
+IN
No
Connection
Label
+
NC
EMI/GND
–
–
ON/OFF
NC
NC
+
0.400
10,16
0.300
±0.015
7,62
±0,38
0.23
(REF)
5,8
0.300
±0.015
7,62
±0,38
2.20
55,9
1.76
44,7
0.50
±0.02
12,7
±0,5
0.01
(9X) PLATED
THROUGH HOLE DIA
– IN
Ground
– OUT
style 2 & 3
baseplates only
(4X)***
0.12* 0.20**
3,1 5,1
0.49
12,4
2.000
50,80
0.10
2,5
0.10
X 45˚
2,5
CHAMFER
FULL R (6X)
0.130
3,30
6
7
8
ON/OFF
No
Connection
No
Connection
+OUT
1
(ALL MARKINGS
THIS SURFACE)
2
3
4
1.900
48,26
0.35 (2X)
8,8
Pin C
L
ALUMINUM
BASEPLATE
2.28 1.30
57,9 33,0
0.65
16,5
(6X)
8
7
6
5
9
9
8
7
6
5
0.150 DIA,(2X)
3,81
0.080 DIA,(7X)
2,03
DIMENSION L
FULL R (6X)
0.43
10,9
R
0.700 *
17,78
1.000 *
25,40
1.400 *
35,56
Slotted
* DENOTES TOL=
±
0.003
±0,08
(6X)
0.13
3,3
ns
Threaded
4-40 UNC-2B (6X)
Thru Hole
#30 Drill Thru (6X)
(0.1285)
NOTES:
0.71
1. MATERIAL:
(9X)
Pin Style K
18,0
BASE:
6000 SERIES ALUMINUM
(Extra Long Pin)
COVER: LCP, ALUMINUM 3003 H14
PINS:
RoHS
Style 1 baseplate only
INCH MIN; NON-RoHS
*
PINS GOLD PLATE 30 MICRO
PINS:
TIN/LEAD 90/10 BRIGHT
NOTES:
** Style 2 & 3 baseplates
2. DIMENSIONS AND VALUES IN BRACKETS ARE METRIC
1. MATERIAL:
*** Reserved for Vicor accessories
3. MANUFACTURING CONTROL IS IN PLACE TO ENSURE THAT THE SPACING
BASE:
6000 SERIES ALUMINUM
BETWEEN THE
Not for mounting
MODULES LABEL SURFACE TO THE PRINTED CIRCUIT BOARD
COVER: LCP, ALUMINUM 3003 H14
OF THE APPLICATION RANGES FROM DIRECT CONTACT (ZERO), TO THE
C Pin center line
L
RoHS PINS GOLD PLATE 30 MICRO INCH MIN; NON-RoHS
MAXIMUM GAP AS CALCULATED FROM THE TOLERANCE STACK-UP
PINS:
AND IS NOT SUBJECT NEGATIVE TOLERANCE ACCUMULATION
PINS:
TIN/LEAD 90/10 BRIGHT
0.700
17,78
1.000
25,40
1.400
35,56
PIN SHORT – .55±.015 [14.0±.38]
PIN LONG–– .63±.015 [16.0±.38]
PIN EXTRA LONG–––- .71±.015 [18.0±.38]
0.54
(9X)
Pin Style 1&S
13,7
(Short Pin)
0.62
(9X)
Pin Style 2&N
15,7
(Long Pin)
0.06
(3X)
1,5
2.20
55,9
(REF.)
Use a 4-40 Screw (6X)
Torque to:
5 in-lbs
0.57 N-m
Figure 6 —
Mechanical diagram
2. DIMENSIONS AND VALUES IN BRACKETS ARE METRIC
3. MANUFACTURING CONTROL IS IN PLACE TO ENSURE THAT THE SPACING
BETWEEN THE MODULES LABEL SURFACE TO THE PRINTED CIRCUIT BOARD
OF THE APPLICATION RANGES FROM DIRECT CONTACT (ZERO), TO THE
MAXIMUM GAP AS CALCULATED FROM THE TOLERANCE STACK-UP
AND IS NOT SUBJECT NEGATIVE TOLERANCE ACCUMULATION
ALL MARKINGS
THIS SURFACE
INBOARD
SOLDER
MOUNT
0.062
±0.010
1,57
±0,25
1.790**
45,47
SHORT PIN STYLE
(7X)
PLATED
THROUGH HOLE
DIA
0.158
4,01
3
4
(2X)
0.094
±0.003
2,39
±0,08
0.164
±0.003
4,16
±0,08
ONBOARD
SOLDER
MOUNT
LONG PIN STYLE
0.094
±0.003
2,39
±0,08
0.164
±0.003
4,16
±0,08
ALUMINUM
BASEPLATE
INBOARD
SOCKET
MOUNT
SOCKET
0.183
±0.003
4,65
±0,08
0.266
±0.003
ONBOARD
SOCKET
SURFACE MOUNT
SURFACE MOUNT
N/A
N/A
PCB THICKNESS
R
0.06
(4X)
1,5
PINS: TIN / LEAD
6,76
±0,08
ALL MARKINGS
HOT SOLDER DIPPED
THIS SURFACE
1
2
1.900*
48,26
48.26
1.575**
40,00
ALUMINUM
BASEPLATE
PINS STYLES
SOLDER:TIN / LEAD PLATED
MODUMATE: GOLD PLATED COPPER
RoHS: GOLD PLATED COPPER
0 43
0.45
0.45
11,5
0.53
13,5
0.46
11,7
SOCKETS
0.080" DIA. PINS (7X)
P/N 13632 (100 pcs.)
0.150" DIA. PINS (2X)
P/N 13633 (100 pcs.)
P/N 16019 (9 pc. Kit)
0.56
14,2
SOCKET HEADERS
(SURFACE MOUNT)
KIT INCLUDES
INPUT & OUTPUT
P/N 16021
9
8
7
6
5
0.400*
10,16
0.700*
17,78
1.000*
25,40
1.400*
35,56
* DENOTES TOL =
** PCB WINDOW
±0.003
±0,08
0.195
4,95
Figure 7 —
PCB Mounting Specifications
M-FIAM3
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