NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX6SXCEC
Rev. 4, 11/2018
MCIMX6XxExxxxxB
MCIMX6XxExxxxxC
i.MX 6SoloX Applications
Processors for Consumer
Products
Package Information
Plastic Package
BGA 19 x 19 mm, 0.8 mm pitch
BGA 17 x 17 mm, 0.8 mm pitch
BGA 14 x 14 mm, 0.65 mm pitch
Ordering Information
See Table 1 on page 3
1
Introduction
1
The i.MX 6SoloX processors represent NXP
Semiconductor’s latest achievement in integrated
multimedia-focused products offering high performance
processing with a high degree of functional integration,
targeted towards the growing market of connected
devices.
The i.MX 6SoloX processor features NXP’s advanced
implementation of the single Arm
®
Cortex
®
-A9 core,
which operates at speeds of up to
1 GHz,
in addition to
the Arm Cortex-M4 core, which operates at speeds of up
to 227 MHz. This type of heterogeneous multicore
architecture provides greater levels of system
integration, smart low-power system awareness, and fast
real-time responsiveness. The i.MX 6SoloX includes a
GPU processor capable of supporting 2D and 3D
operations, a wide range of display and connectivity
options, and integrated power management. Each
processor provides a 32-bit
DDR3/DDR3L/LPDDR2-800 memory interface and a
number of other interfaces for connecting peripherals,
such as WLAN, Bluetooth™, GPS, displays, and camera
sensors.
2
3
4
5
6
7
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
3.1 Special Signal Considerations. . . . . . . . . . . . . . . . 19
3.2 Recommended Connections for Unused Analog
Interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Electrical Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 21
4.1 Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . . 21
4.2 Power Supplies Requirements and Restrictions . . 34
4.3 Integrated LDO Voltage Regulator Parameters . . 35
4.4 PLL Electrical Characteristics . . . . . . . . . . . . . . . . 37
4.5 On-Chip Oscillators . . . . . . . . . . . . . . . . . . . . . . . . 38
4.6 I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 39
4.7 I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 44
4.8 Output Buffer Impedance Parameters. . . . . . . . . . 47
4.9 System Modules Timing . . . . . . . . . . . . . . . . . . . . 50
4.10 Multi-mode DDR Controller (MMDC). . . . . . . . . . . 62
4.11 General-Purpose Media Interface (GPMI) Timing. 63
4.12 External Peripheral Interface Parameters . . . . . . . 71
4.13 A/D Converter . . . . . . . . . . . . . . . . . . . . . . . . . . . 114
Boot Mode Configuration . . . . . . . . . . . . . . . . . . . . . . . 118
5.1 Boot Mode Configuration Pins. . . . . . . . . . . . . . . 118
5.2 Boot Device Interface Allocation . . . . . . . . . . . . . 120
Package Information and Contact Assignments . . . . . . 128
6.1 i.MX 6SoloX Signal Availability by Package . . . . 128
6.2 Signals with Different States During Reset and After
Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 130
6.3 19x19 mm Package Information . . . . . . . . . . . . . 131
6.4 17x17 mm Package Information . . . . . . . . . . . . . 150
6.5 14x14 mm Package Information . . . . . . . . . . . . . 185
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
NXP Reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products
Introduction
The i.MX 6SoloX processors are specifically useful for applications such as:
• Graphics rendering for Human Machine Interfaces (HMI)
• Audio playback
• Connected devices
• Access control panels
• Human Machine Interfaces (HMI)
• Portable medical and health care
• IP phones
• Smart appliances
• Home energy management systems
The features of the i.MX 6SoloX processors include:
• Dual-core architecture with one Arm Cortex-A9 processor plus one Arm Cortex-M4 processor—
Dual-core architecture enables the device to run an open operating system like Linux on the
Cortex-A9 core and an RTOS like MQX™ or FreeRTOS™ on the Cortex-M4 core. The Cortex-M4
core is standard on all i.MX 6SoloX processors.
• Multilevel memory system—The multilevel memory system of each processor is based on the L1
instruction and data caches, L2 cache, and internal and external memory. The processors support
many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR
Flash, NAND Flash (MLC and SLC), OneNAND, Quad SPI, and managed NAND, including
eMMC up to rev 4.4/4.41/4.5.
• Smart speed technology—Power management implemented throughout the IC that enables
multimedia features and peripherals to consume minimum power in both active and various low
power modes.
• Dynamic voltage and frequency scaling—The processors improve the power efficiency of devices
by scaling the voltage and frequency to optimize performance.
• Multimedia powerhouse—The multimedia performance of each processor is enhanced by a
multilevel cache system, NEON™ MPE (Media Processor Engine) co-processor, a programmable
smart DMA (SDMA) controller, and an asynchronous sample rate converter.
• 2x Gigabit Ethernet with AVB—2x 10/100/1000 Mbps Gigabit Ethernet controllers with support
for Audio Video Bridging (AVB) for reliable, high-quality, low-latency multimedia streaming.
• Human-machine interface—Each processor provides a single integrated graphics processing unit
that supports an OpenGL ES 2.0 and OpenVG 1.1 3D and 2D graphics accelerator. In addition,
each processor provides up to two separate display interfaces (parallel display and LVDS display)
and a CMOS sensor interface (parallel).
• Interface flexibility—Each processor supports connections to a variety of interfaces: High-speed
USB on-the-go with PHY, high-speed USB host with PHY, High-Speed Inter-Chip USB, multiple
expansion card ports (high-speed MMC/SDIO host and other), 2 Gigabit Ethernet controllers with
support for Ethernet AVB, PCIe-II, two 12-bit ADC modules with 4 dedicated single-ended inputs,
two CAN ports, ESAI audio interface, and a variety of other popular interfaces (such as UART, I
2
C,
and I
2
S serial audio).
i.MX 6SoloX Applications Processors for Consumer Products, Rev. 4, 11/2018
2
NXP Semiconductors
Introduction
•
•
Advanced security—The processors deliver hardware-enabled security features that enable secure
e-commerce, digital rights management (DRM), information encryption, secure boot, and secure
software downloads. The security features are discussed in detail in the
i.MX 6SoloX Security
Reference Manual
(IMX6XSRM).
Integrated power management—The processors integrate linear regulators and internally generate
voltage levels for different domains. This significantly simplifies system power management
structure.
For a comprehensive list of the i.MX 6SoloX features, see
Section 1.2, “Features”.
1.1
Ordering Information
Table 1. Ordering Information
Table 1
provides examples of orderable sample part numbers covered by this data sheet.
Part Number
Options
Mask
Set
Cortex- Cortex-
Junction
Qualification
M4
A9
Temperature
Tier
1
Speed Speed
Range
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
Package
14x14NP (NP No PCIe)
Package code “VK”
14mm x 14mm
0.65pitch Map BGA
MCIMX6X1EVK10AB Features not 2N19K
supported:
or
- 2D&3D GPU 3N19K
- PCIe
- LVDS
- MLB
MCIMX6X1EVK10AC Features not 4N19K
supported:
- 2D&3D GPU
- PCIe
- LVDS
- MLB
MCIMX6X3EVK10AB Features not
supported:
- PCIe
- LVDS
- MLB
MCIMX6X3EVK10AC Features not
supported:
- PCIe
- LVDS
- MLB
2N19K
or
3N19K
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
14x14NP (NP No PCIe)
Package code “VK”
14mm x 14mm
0.65pitch Map BGA
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
14x14NP (NP=No PCIe)
Package code “VK”
14mm x 14mm
0.65pitch Map BGA
14x14NP (NP=No PCIe)
Package code “VK”
14mm x 14mm
0.65pitch Map BGA
17x17NP (NP=No PCIe)
Package code “VO”
17mm x 17mm
0.8pitch Map BGA
4N19K
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
MCIMX6X1EVO10AB Features not 2N19K
supported:
or
- 2D&3D GPU 3N19K
- PCIe
- LVDS
- MLB
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
i.MX 6SoloX Applications Processors for Consumer Products, Rev. 4, 11/2018
NXP Semiconductors
3
Introduction
Table 1. Ordering Information (continued)
Part Number
Options
Mask
Set
Cortex- Cortex-
Junction
Qualification
M4
A9
Temperature
Tier
1
Speed Speed
Range
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
Package
17x17NP (NP=No PCIe)
Package code “VO”
17mm x 17mm
0.8pitch Map BGA
MCIMX6X1EVO10AC Features not 4N19K
supported:
- 2D&3D GPU
- PCIe
- LVDS
- MLB
MCIMX6X3EVO10AB Features not
supported:
- PCIe
- LVDS
- MLB
MCIMX6X3EVO10AC Features not
supported:
- PCIe
- LVDS
- MLB
2N19K
or
3N19K
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
17x17NP (NP = No PCIe)
Package code “VO”
17mm x 17mm
0.8pitch Map BGA
17x17NP (NP = No PCIe)
Package code “VO”
17mm x 17mm
0.8pitch Map BGA
17x17WP (WP = With PCIe)
Package code “VN”
17mm x 17mm
0.8pitch Map BGA
17x17WP (WP = With PCIe)
Package code “VN”
17mm x 17mm
0.8pitch Map BGA
17x17WP (WP = With PCIe)
Package code “VN”
17mm x 17mm
0.8pitch Map BGA
17x17WP (WP = With PCIe)
Package code “VN”
17mm x 17mm
0.8pitch Map BGA
19x19
Package code “VM”
19mm x 19mm
0.8pitch Map BGA
19x19
Package code “VM”
19mm x 19mm
0.8pitch Map BGA
4N19K
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
MCIMX6X2EVN10AB Features not 2N19K
supported:
or
- 2D&3D GPU 3N19K
- LVDS
- MLB
MCIMX6X2EVN10AC Features not 4N19K
supported:
- 2D&3D GPU
- LVDS
- MLB
MCIMX6X3EVN10AB Features not
supported:
- LVDS
- MLB
MCIMX6X3EVN10AC Features not
supported:
- LVDS
- MLB
MCIMX6X4EVM10AB Features not
supported:
- MLB
MCIMX6X4EVM10AC Features not
supported:
- MLB
1
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
2N19K
or
3N19K
4N19K
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
2N19K
or
3N19K
4N19K
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
1 GHz
227
MHz
Extended
Commercial
-20 to
+105°C
If a 24 MHz input clock is used (required for USB), the maximum Cortex-A9 speed for 1 GHz speed grade is limited to 996 MHz
and the maximum Cortex-A9 speed for 800 MHz speed grade is limited to 792 MHz.
Figure 1
describes the part number nomenclature so that the users can identify the characteristics of the
specific part number they have (for example, cores, frequency, temperature grade, fuse options, and silicon
i.MX 6SoloX Applications Processors for Consumer Products, Rev. 4, 11/2018
4
NXP Semiconductors
Introduction
revision). The primary characteristic which describes which data sheet applies to a specific part is the
temperature grade (junction) field.
• The i.MX 6SoloX Automotive and Infotainment Applications Processors data sheet
(IMX6SXAEC) covers parts listed with an “A (Automotive temp)”
• The i.MX 6SoloX Applications Processors for Consumer Products data sheet (IMX6SXCEC)
covers parts listed with a “D (Commercial temp)” or “E (Extended Commercial temp)”
• The i.MX 6SoloX Applications Processors for Industrial Products data sheet (IMX6SXIEC) covers
parts listed with “C (Industrial temp)”
Ensure to have the proper data sheet for specific part by verifying the temperature grade (junction) field
and matching it to the proper data sheet. If there will be any questions, visit see the web page
nxp.com/imx6series or contact a NXP representative for details.
MC
IMX6
X
@
+
VV
$$
%
A
Silicon Revision
1
Rev 1.2 Production (Maskset 2N19K)
Rev 1.3 Production (Maskset 3N19K)
Rev 1.4 Production (Maskset 4N19K)
Qualification Level
Prototype Samples
Mass Production
Special
MC
PC
MC
SC
A
B
C
Fusing
i.MX 6 Family
i.MX 6SoloX
%
A
X
X
Security Enabled
ARM Cortex-A9 Frequency
Part Differentiator
Package
GPU
Y
VM
Y
VN
VO
VK
Y
Y
Y
-
VN
-
-
VO
-
-
VK
-
PCIe
Y
Y
Y
-
-
Y
Y
-
-
-
-
LVDS
Y
Y
-
-
-
-
-
-
-
-
-
ADC
2x 4ch
2x 4ch
1x 2ch
2x 4ch
2x 4ch
1x 2ch
1x 2ch
2x 4ch
2x 4ch
2x 4ch
2x 4ch
MLB
$$
08
10
@
800 MHz
1 GHz
Automotive
Ext. Commercial/ Industrial
Ext. Commercial/ Industrial
Ext. Commercial/ Industrial
Ext. Commercial/ Industrial
Automotive
Ext. Commercial/ Industrial
Automotive
Ext. Commercial/ Industrial
Automotive
Ext. Commercial/ Industrial
Y
4
-
-
-
-
Y
Package Type
3
14x14NP: MAPBGA 14x14 0.65mm
NP = No PCIe
17x17NP: MAPBGA 17x17 0.8mm
NP = No PCIe
2
17x17WP: MAPBGA 17x17 0.8mm
WP = With PCIe
MAPBGA 19x19 0.8mm
1
ROHS
VK
VO
VN
VM
-
Y
-
Y
-
Junction Temperature (Tj)
Extended Commercial: -20 to + 105C
Industrial: -40 to +105C
+
E
C
A
1. See the nxp.com\imx6series Web page for latest information on the available silicon revision.
Auto: -40 to + 125C
Figure 1. Part Number Nomenclature—i.MX 6SoloX
1.2
Features
The i.MX 6SoloX processors are based on the Arm Cortex-A9 MPCore™ platform, which has the
following features:
• Supports single Arm Cortex-A9 MPCore processor (with TrustZone)
• The core configuration is symmetric, where each core includes:
i.MX 6SoloX Applications Processors for Consumer Products, Rev. 4, 11/2018
NXP Semiconductors
5
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