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SEAM8-50-S02.0-S-08-2-GP-K

产品描述板对板与夹层连接器 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal
产品类别连接器    板对板与夹层连接器   
文件大小1MB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

SEAM8-50-S02.0-S-08-2-GP-K概述

板对板与夹层连接器 0.80 mm SEARAY High-Speed High-Density Open-Pin-Field Array Terminal

SEAM8-50-S02.0-S-08-2-GP-K规格参数

参数名称属性值
厂商名称SAMTEC
产品种类板对板与夹层连接器
发货限制Mouser目前不销售该产品。
产品Connectors
位置数量400 Position
节距0.8 mm
排数8 Row
端接类型SMD/SMT
安装角Straight
电流额定值1.3 A
电压额定值220 VAC
系列SEAM8
封装Reel
触点电镀Gold
外壳材料Liquid Crystal Polymer (LCP)
触点材料Copper Alloy
可燃性等级UL 94 V-0
安装风格Mounting Peg
最大工作温度+ 125 C
最小工作温度- 55 C
叠放高度7 mm
工厂包装数量175

文档预览

下载PDF文档
F-219
SEAM8–30–S02.0–S–06–2–K
SEAM8–20–S02.0–S–04–2–GP–K
(0.80 mm) .0315"
SEAM8 SERIES
ULTRA-HIGH DENSITY OPEN-PIN-FIELD
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAM8
Insulator Material:
Black LCP
Contact Material:
Copper Alloy
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Current Rating:
1.3 A per pin
(10 adjacent pins powered)
Working Voltage:
220 VAC
RoHS Compliant:
Yes
Lead-Free Solderable:
Yes
Board Mates:
SEAF8
Cable Mates:
ESCA
Standoffs:
JSO
Up to 500 I/Os
7 mm and 10 mm
stack heights
Lead-Free solder
charge terminations
POWER/SIGNAL
APPLICATION
4, 6, 8 and
10 rows
HIGH-SPEED CHANNEL PERFORMANCE
Signal Integrity optimized
Edge Rate
®
contact
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
SEAM8/SEAF8 @ 7 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data
visit Samtec.com or contact
SIG@samtec.com
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
SEAM8
NO. PINS
PER ROW
LEAD
STYLE
PLATING
OPTION
NO. OF
ROWS
SOLDER
TYPE
OPTION
K
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Other pin counts
–10, – 20,
– 30, –40, –50
(Standard sizes)
NO. OF
ROWS
–S02.0
= 2 mm
Body
Height
–S05.0
A
(4.30)
.169
(6.30)
.248
(8.30)
.327
(10.30)
.406
MATED HEIGHT*
SEAF8
LEAD
STYLE
SEAM8 LEAD STYLE
–04
–06
–08
–10
= 5 mm
Body
Height
= 10 µ"
(0.25 µm)
Gold on
contact area,
Matte Tin on
solder tail
–L
= Four
Rows
– 04
– 06
= Six
Rows
= Lead-Free
Solder
Charge
–2
= Guide Post
(–S02.0 lead
= Polyimide
style only)
film Pick &
(Mates with
Place Pad
SEAF8-RA-GP)
– GP
–K
–S02.0
–S05.0
(10.00) .394
–05.0
(7.00) .276
= 30 µ"
(0.76 µm)
Gold on
contact area,
Matte Tin on
solder tail
01
–S
= Eight
Rows
–08
*Processing conditions will affect
mated height.
= Ten
Rows
–10
No. of positions x
(0.80) .0315 + (5.84) .230
(0.75)
.029
LEAD
STYLE
B
(4.54)
.179
(7.54)
.297
A
06
–S02.0
–S05.0
(0.70)
.028
Notes:
Patent Pending
Tape & Reel packaging
is standard.
Some sizes, styles and
options are non-standard,
non-returnable.
(1.02)
.040
(1.32)
.052 DIA
(1.10) (1.32)
.043 x .052
(0.80)
.0315
B
(1.27)
.050
No. of positions x
(0.80) .0315 + (2.56) .101
SEAM8–30–XXX.X–X–06–2 SHOWN
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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