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QTE-014-01-F-D-DP-A-RT1

产品描述板对板与夹层连接器 0.80 mm Q Strip High-Speed Ground Plane Terminal Strip
产品类别连接器    板对板与夹层连接器   
文件大小997KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
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QTE-014-01-F-D-DP-A-RT1概述

板对板与夹层连接器 0.80 mm Q Strip High-Speed Ground Plane Terminal Strip

QTE-014-01-F-D-DP-A-RT1规格参数

参数名称属性值
厂商名称SAMTEC
产品种类板对板与夹层连接器
发货限制Mouser目前不销售该产品。
产品Headers
位置数量28 Position
节距0.8 mm
排数2 Row
端接类型SMD/SMT
安装角Straight
电流额定值2 A
电压额定值225 VAC
系列QTE
封装Tray
应用Power, Signal
触点电镀Gold
外壳材料Liquid Crystal Polymer (LCP)
触点材料Phosphor Bronze
可燃性等级UL 94 V-0
安装风格SMD
最大工作温度+ 125 C
最小工作温度- 55 C
叠放高度5 mm
工厂包装数量65

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F-219
QTE–014–01–F–D–DP–A
®
QTE–040–01–L–D–A
QTE–060–01–L–D–A
(0.80 mm) .0315"
QTE SERIES
HIGH-SPEED GROUND PLANE HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?QTE
Insulator Material:
Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
Contact:
2 A per pin
(2 pins powered)
Ground Plane:
23 A per ground plane
(1 ground plane powered)
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
225 VAC mated with QSE
& 5 mm Stack Height
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
QSE
Cable Mates:
EQCD, EQDP
(See Also Available Note)
Standoffs:
SO
Integral metal plane
for power or ground
Standard stack heights
from 5 mm to 25 mm
POWER/SIGNAL
APPLICATION
HIGH-SPEED CHANNEL PERFORMANCE
QTE-D/QSE-D or QTE-DP/QSE-DP
@ 5 mm Mated Stack Height
Rating based on Samtec reference
channel.For full SI performance
data visit Samtec.comor contact
SIG@samtec.com
QTE-D/QSE-D
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
14 28
G b p s
G b p s
QTE-DP/QSE-DP
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 50 µ" GOLD
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (020-060)
Board Stacking:
For applications requiring
more than two connectors per
board contact ipg@samtec.com
QTE
PINS PER ROW
NO. OF PAIRS
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
PLATING
OPTION
TYPE
A
OTHER
OPTION
1-DH1
(40 total pins per bank = –D)
–020, –040, –060
–014, –028, –042
(14 pairs per bank = –D–DP)
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
= Gold Flash on
Signal Pins and
Ground Plane,
Matte Tin on tails
= 10 µ" (0.25 µm)
Gold on Signal Pins
and Ground Plane,
Matte Tin on tails
–F
= Single-Ended
–D
–L
= Differential Pair
(–01 only)
–D–DP
= (7.00 mm)
.275" DIA
Polyimide
Film Pick &
Place Pad
–K
–D–DP = (No. of Positions per Row/14)
x (20.00) .7875
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• 15 mm, 22 mm and
30 mm stack height
• 30 µ" (0.76 µm) Gold
(Specify -H plating for
Data Rate cable mating
applications.)
• Edge Mount, Guide Posts,
Screw Down & Friction Lock
• 56 (-DP), 80, 100
positions per row
• Retention Option
01
–D = (No. of Positions per Row/20)
x (20.00) .7875
(20.00) .7875
= Tape & Reel
Packaging
(N/A –05 & –07
lead style)
–TR
(5.97)
.235
02
(0.80)
.0315
(0.20)
.008
A
= Electro-Polished
Selective
(7.11)
.280
50 µ" (1.27 µm) min
Au over 150µ"
(3.81 µm) Ni on Signal
Pins in contact area,
10 µ" (0.25 µm) min
Au over 50 µ" (1.27 µm)
Ni on Ground Plane
in contact area,
Matte Tin over 50µ"
(1.27 µm) min Ni on
all solder tails
*Note:
–C Plating passes
10 year MFG testing
–C*
= Latching
Option
(N/A on –042 &
–060 positions)
QTE
LEAD
STYLE
–L
A
(4.27) .168
(7.26) .286
HEIGHT
WITH QSE*
(5.00) .197
(8.00) .315
(0.76)
.030
(0.89)
.035 DIA
(0.64)
.025
–01
–02
–03
–04
–05
–07
–09
(10.27) .404 (11.00) .433
(15.25) .600 (16.00) .630
(18.26) .718 (19.00) .748
(24.24) .954 (25.00) .984
(13.26) .522 (14.00) .551
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
–L
*Processing conditions will affect
mated height. See SO Series for
board space tolerances
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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