电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

TW-07-09-G-D-200-SM-LC

产品描述板对板与夹层连接器 2.00 mm Flex Stack, Flexible Board Stacker, Surface Mount
产品类别连接器    板对板与夹层连接器   
文件大小949KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
下载文档 详细参数 全文预览

TW-07-09-G-D-200-SM-LC在线购买

供应商 器件名称 价格 最低购买 库存  
TW-07-09-G-D-200-SM-LC - - 点击查看 点击购买

TW-07-09-G-D-200-SM-LC概述

板对板与夹层连接器 2.00 mm Flex Stack, Flexible Board Stacker, Surface Mount

TW-07-09-G-D-200-SM-LC规格参数

参数名称属性值
厂商名称SAMTEC
产品种类板对板与夹层连接器
发货限制Mouser目前不销售该产品。
产品Connectors
位置数量14 Position
节距2 mm
排数2 Row
端接类型SMD/SMT
安装角Vertical
电流额定值4.9 A
系列TW
封装Tube
应用Elevated Board Staking
触点电镀Gold
外壳材料Liquid Crystal Polymer (LCP)
触点材料Phosphor Bronze
安装风格SMT
最大工作温度+ 125 C
最小工作温度- 55 C
叠放高度5.08 mm
工厂包装数量40

文档预览

下载PDF文档
F-219
TW–25–02–F–S–260–SM
TW–10–04–L–D–300–SM
(2.00 mm) .0787"
TW–20–07–T–D–550–SM
TW SERIES
SMT BOARD STACKERS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?TW-SM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating:
4.9 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +105 °C with Tin;
-55 °C to +125 °C with Gold
RoHS Compliant:
Yes
Board Mates:
CLT, SQT, SQW, ESQT,
TLE, SMM, MMS
Cable Mates:
TCSD
Available with
optional
pick & place
pads
OTHER SOLUTIONS
• Stacker height
ranges and standard
part numbers on
double row.
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.15 mm) .006" max*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
(2.00 mm)
.0787" pitch
Available
with optional
alignment pins
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
TW
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
below.
(2.00)
.0787
PLATING
OPTION
ROW
OPTION
STACKER
HEIGHT
SM
OTHER
OPTIONS
02 thru 36
FILE NO. E111594
= Gold flash
on post,
Matte Tin
on tail
–F
= Single
Row
–S
–“XXX”
= Stacker
Height
in inches
(0.13 mm)
.005"
increments
= Polarized Position
–“XXX”
–A
No. of positions
x (2.00) .0787
= 10 µ"
(0.25 µm)
Gold on post,
Matte Tin
on tail
–L
= Double
Row
–D
Example:
–250
= (6.35 mm)
.250"
= Alignment Pin
(Metal or plastic
at Samtec discretion)
(4.83 mm) .190" min.
board space
(–D only)
ALSO AVAILABLE
(MOQ Required)
• Other Platings
• End shrouds with or
without guide post
36
(2.00)
02
.0787
01
72
= Matte Tin
(4.00)
.1574
–T
A
(5.33)
.210
ROW
OPTION
= Pick & Place Pad
(1.91 mm) .075" min.
post height
(04-36 only)
–P
A
(5.08) .200
(6.35) .250
01
(1.27) .050 TYP
(0.00)
(0.51)
.000 MIN
.020 SQ
STACKER
HEIGHT OAL
(4.32)
.170
MIN
71
LEAD
STYLE
OAL
(7.85) .309
(11.86) .467
(12.37) .487
(15.37) .605
(17.35) .683
(9.86) .388
–S
–D
Notes:
For added mechanical
stability, Samtec recommends
mechanical board spacers be
used in applications with gold or
selective gold plated connectors.
Contact ipg@samtec.com for
more information.
This Series is non-standard,
non-returnable.
–02
–03
–04
–06
–07
–09
–P OPTION
= Tape & Reel
Packaging
(–07 lead style
not available)
(–06 lead style with
–P option not available
as a standard)
–TR
(1.27)
.050
(1.09)
.043
DIA
(1.50)
.059
(2.00)
.0787
–A OPTION
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
IC1B的的逻辑探头电路图
本帖最后由 Aguilera 于 2019-1-6 09:52 编辑 IC1A的非反相输入端与IC1B的反相输入端连接到测试探头上。电路使用90%的电源电压作为CMOS逻辑高,2.7V作为TTL逻辑高。  如下图所示的是 ......
Aguilera 模拟与混合信号
PIC系列单片机程序设计基础
1、PIC单片机程序的基本格式  先介绍二条伪指令:  EQU ——标号赋值伪指令  ORG ——地址定义伪指令  PIC16C5X单片机在RESET后指令计算器PC被置为全“1”,所以PIC16C5X几种型号芯片的 ......
rain Microchip MCU
汽车LED灯驱动电路
汽车LED灯驱动电路 107954 ...
qwqwqw2088 电源技术
bu2508dx
BU2508DX 晶体管技术资料 ...
lorant 模拟电子
恳请各位高手指点一下,我是ucos新手,遇到了第一个问题....
编译时老是报错,见下: UCOS-ii 2.86 STM32F103VE MDK3.8 ************************ ..\ObjFlash\STM32-FD-ucos.axf: Error: L6218E: Undefined symbol App_TCBInitHook (referred fro ......
youjianbaba 实时操作系统RTOS
关于芯片选型的一些看法,欢迎大家指教
应急灯的电路设计一直拖到现在都没完成,一方面是时间上投入得不够,一方面是这是我第一次做这种小项目性质的电路设计。 做的过程,简单说,经过两个阶段: 第一阶段,在自由选择芯片时,选用 ......
辛昕 DIY/开源硬件专区

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 733  2628  2865  1743  1086  31  14  49  36  17 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved