F-219
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 30 µ" GOLD
TMMH–125–04–L–DV–EP
TMMH–135–04–F–DV–LC
(2.00 mm) .0787"
FLEXIBLE SMT HEADER
SPECIFICATIONS
For complete specifications and
recommended PCB layouts
see www.samtec.com?TMMH
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Sn or Au over
50 µ" (1.27 µm) Ni
Current Rating (TMMH/ESQT):
4.5 A per pin
(2 pins powered)
Current Rating (TMMH/SQT):
5.1 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to +105 °C with Tin;
-55 °C to +125 °C with Gold
Voltage Rating:
281 VAC mated with SQW;
250 VAC mated with SQT
RoHS Compliant:
Yes
Board Mates:
CLT, SQT, SQW, ESQT,
TLE, SMM, MMS
Cable Mates:
TCSD
FLEX SHROUD
OPTIONS
–ES OPTION
–M OPTION
–A OPTION
OTHER SOLUTIONS
–EP OPTION
Through-
hole
2 mm Shunt
(4.45)
.175
(3.99)
.157
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max
–EL OPTION
–EC OPTION
–TR OPTION
Specify
2SN–BK–G
for
2 mm shunt with Gold plating.
(1.95)
.077
TMMH
1
NO. PINS
PER ROW
LEAD
STYLE
Specify
LEAD STYLE
from chart
LEAD
STYLE
–01
–04
–05
MATES
WITH
PLATING
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
03 thru 50
OPTION
–ES
= Gold flash
on post,
Matte Tin on tail
–F
–L
–T
Z
A
No. of positions x (2.00) .0787 +
Z
(2.00)
.0787
02
100
(2.92)
.115
(4.70)
– EC
.185
(6.10)
–EP & –EPC
.240
(4.45)
–EL & –EBC
.175
SQT, SQW,
(3.20) ESQT, TLE,
.126 SMM, MMS,
TCSD
(1.91)
CLT
.075
(1.65)
.065
= 10 µ" (0.25 µm)
Gold on post,
Matte Tin on tail
= Matte Tin
(1.40)
.055
(6.35)
.250
(1.09)
.043
DIA
ALSO AVAILABLE
(MOQ Required)
• Other platings
(2.00)
.0787
01
99
–A
(4.00)
.157
A
No. of positions x (2.00) .0787
(10.16)
.400
x
(6.35)
.250
(0.64)
.025
(2.51)
.099
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(0.51)
.020
SQ
(2.00) .0787
(Shrouded options removed for clarity)
(7.04)
.277
–M
(1.42)
.056
– LC
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
TMMH–118–04–F–DV–EL
TMMH–110–01–F–DV–A
TMMH–125–01–L–DV
TMMH–114–04–L–DV
TMMH–110–01–F–DV
TMMH SERIES
Optional end shrouds
with board lock
(2.00 mm)
.0787"
Surface mount
(2.00 mm)
.0787"
(2.00 mm) .0787"
Optional alignment pins
or locking clips
DV
FLEX SHROUD OPTIONS
OTHER OPTIONS
All Flex Shroud options require 9 pins/row minimum
(For board-to-board interfaces. Will not mate with TCSD)
LEAD
STYLE
= End Shroud
(For best cost also see TSH Series)
–ES
= Polarized Position. Specify position of omitted pin
= Alignment Pin
(3 positions minimum)
(Not available with -LC)
= Locking Clip
(5 positions minimum)
(Not available with -A)
(Manual placement required)
= Pick & Place Pad
(5 positions minimum)
= Tape & Reel Packaging
(36 positions maximum)
(Flex Shroud options not available
except –ES, –EP & –EL)
–“XXX”
–A
X
Y
–01
(5.84) (4.45)
.230 .175
–04 &
(4.50) (3.02)
–05
.177 .119
(4.00)
.157
= End Shroud with Locking Clip
(For best cost also see TSH Series)
(Manual placement required)
–EC
–EP
–EL
–LC
= End Shroud with Guide Post
–M
(1.32)
.052
(1.41)
.056
– EBC
= End Shroud with Board Lock
(Boards are positively locked and cannot be unmated)
= End Shroud with Board Lock and Locking Clip
(Boards are positively locked and cannot be unmated)
–EBC
–EPC
–TR
(1.17)
.046
(3.20)
.126
X
= End Shroud with Guide Post and Locking Clip
(Manual placement required)
Y
(2.44)
.096
X
(1.32)
.052
(1.91)
.075
DIA
(1.32)
.052
– EL
– ES
– EC
– EP
– EPC
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
FPGA/CPLD
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