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MIS-019-01-F-D-TR

产品描述板对板与夹层连接器 .025" Mixed Technology Socket
产品类别连接器    板对板与夹层连接器   
文件大小670KB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
标准
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MIS-019-01-F-D-TR概述

板对板与夹层连接器 .025" Mixed Technology Socket

MIS-019-01-F-D-TR规格参数

参数名称属性值
厂商名称SAMTEC
产品种类板对板与夹层连接器
发货限制Mouser目前不销售该产品。
产品Sockets
位置数量38 Position
节距0.635 mm
排数2 Row
端接类型SMD/SMT
安装角Straight
电压额定值275 VAC
系列MIS
封装Reel
触点电镀Gold
外壳材料Liquid Crystal Polymer (LCP)
触点材料Phosphor Bronze
可燃性等级UL 94 V-0
安装风格SMD
最大工作温度+ 125 C
最小工作温度- 55 C
叠放高度5 mm
工厂包装数量550

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F-219 SUPPLEMENT
MIS–019–01–F–D
®
MIS–057–01–L–D
MIS–038–01–F–D
(0.635 mm) .025"
MIS SERIES
MIXED TECHNOLOGY SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?MIS
Insulator Material:
Liquid Crystal Polymer
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
275 VAC
Max Cycles:
100
RoHS Compliant:
Yes
Board Mates:
MIT
Standoffs:
SO
Integral metal plane
for power or ground
Polarized
• Mixed
technology
footprint
HIGH-SPEED CHANNEL PERFORMANCE
MIT/MIS @ 5 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (019-057)
Board Stacking:
For applications requiring more
than two connectors per board
contact ipg@samtec.com
28
G b p s
76 signal lines
per linear inch
MIS
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
OTHER
OPTION
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
–019, –038, –057
(38 total positions per bank)
= Gold Flash on Signal Pins and
Ground Plane, Matte Tin on tails
–F
–L
= (7.00 mm)
.275" DIA
Polyimide
film Pick &
Place Pad
–K
ALSO AVAILABLE
(MOQ Required)
• 11 mm, 16 mm, 18.75 mm
and 22 mm stack height
• 30 µ" (0.76 µm) Gold
• Differential Pair and
“Partitionable” (combine
differential & single-ended
banks in same connector)
available.
• 76, 95, 114 and 133
positions per row
= 10 µ" (0.25 µm)
Gold on Signal Pins and
Ground Plane, Matte Tin on tails
= Tape &
Reel
–TR
(No. of Positions/19) x (12.70) .500 + (12.70) .500
(12.70) .500
(6.22)
.245
(0.635)
.025
(1.32)
.052
(0.69) .027
(0.15)
.006
01
= Electro-Polished Selective
50 µ" (1.27 µm) min Au over
150 µ" (3.81 µm) Ni on
Signal Pins in contact area,
10 µ" (0.25 µm) min Au over
50 µ" (1.27 µm) Ni on Ground
Plane in contact area, Matte Tin
over 50 µ" (1.27 µm) min Ni
on all solder tails
*Note:
–C Plating passes 10 year MFG testing
–C*
02
MATED HEIGHT*
(3.43)
.135
(7.49)
.295
(3.63)
.143
(0.18)
.007
MIS
LEAD
STYLE
MIT LEAD
STYLE
–01
–02
–01
(5.00) (8.00)
.197 .315
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
Note:
Rugged through-hole ground plane soldered to board
(requires paste-over-hole, not press-fit) for added retention to PCB.
Due to technical progress, all designs, specifications and components are subject to change without notice.
*Processing conditions
will affect mated height.
See SO Series for board
space tolerances.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM

 
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