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SEAMP-30-02.0-S-10-GP

产品描述板对板与夹层连接器 .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit
产品类别连接器    连接器   
文件大小1MB,共2页
制造商SAMTEC
官网地址http://www.samtec.com/
下载文档 详细参数 全文预览

SEAMP-30-02.0-S-10-GP概述

板对板与夹层连接器 .050" SEARAY High-Speed High-Density Open-Pin-Field Array Terminal, Press-Fit

SEAMP-30-02.0-S-10-GP规格参数

参数名称属性值
厂商名称SAMTEC
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time8 weeks
连接器类型BOARD CONNECTOR
Base Number Matches1

文档预览

下载PDF文档
F-219
SEAMP–20–02.0–S–10-GP
SEAMP–20–02.0–L–06
(1.27 mm) .050"
SEAMP–20–02.0–L–04
SEAMP SERIES
PRESS-FIT OPEN-PIN-FIELD ARRAY
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?SEAMP
Insulator Material:
Natural High
Temperature Nylon
Contact Material:
Copper Alloy
Operating Temp Range:
-55 °C to +125 °C
Current Rating:
2.5 A per pin
(6 adjacent pins powered)
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Working Voltage:
215 VAC
RoHS Compliant:
Yes
Mates with:
SEAF, SEAF-RA-GP,
SEAFP
Able to mate with right-angle socket
for micro backplane applications
Large
contact wipe
Press-fit
tails
(1.40 mm)
.055"
NOMINAL
WIPE
HIGH-SPEED CHANNEL PERFORMANCE
SEAMP/SEAF @ 7 mm Mated Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
PROCESSING
Application tooling and one
ton minimum press required.
Contact ATG@samtec.com for
more information.
28
G b p s
(1.27 mm) .050"
pitch grid
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
FILE NO. E111594
SEAMP
NO. OF POSITIONS
PER ROW
02.0
PLATING
OPTION
NO. OF
ROWS
OPTION
SEAMP
= Press-fit
–10, – 20, – 30, –40, –50
ALSO AVAILABLE
(MOQ Required)
• Other plating options
A
No. of positions x (1.27) .050 + (5.18) .204
= 10 µ"
(0.25 µm)
Gold on
contact area,
Matte Tin on tail
–L
= Four Rows
– 04
– 06
– 08
– 10
= Six Rows
= Guide
Post
(Mates with
SEAF-RA-
GP only)
– GP
B
TOOLING
• Compliant pin fixture
CAT-SEAMP-XX-XX
For more information, visit
www.samtec.com/tooling
(1.27) .050
= 30 µ"
(0.76 µm)
Gold on
contact area,
Matte Tin on tail
–S
= Eight Rows
– TR
= Tape
& Reel
= Ten Rows
NO. OF
ROWS
–04
–06
–08
(1.78)
.070
DIA
(3.05)
.120
DIA
(8.18)
.322
(11.18)
.440
A
(7.06)
.278
(9.60)
.378
(12.14)
.478
(14.68)
.578
B
(2.54)
.100
(2.54)
.100
(5.08)
.200
(7.62)
.300
(4.60)
.181
(0.59)
(1.27)
.023
.050
No. of positions x (1.27) .050 - (1.27) .050
(1.23)
.048
(1.78)
.070
–10
SEAMP–20–02.0–X–08 SHOWN
MATED HEIGHTS*
SEAFP
SEAMP
LEAD STYLE
LEAD STYLE
–05.0
7 mm
–02.0
* Processing conditions will affect mated
height. Other stack heights available if
mated with SEAF (solder charge tails).
No. of positions x (1.27) .050 + (19.66) .774
(5.54)
.218
–GP OPTION
No. of positions x (1.27) .050 + (13.54) .533
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
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